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Introduction

Introduction. Background Executive Director of QPL in 1992. Co-founder of Compass Technology Co,. Ltd.. Executive Director since Oct, 1997 and as CEO since June 2000. Non-performer in school. Survey. What is your expectation as Start-ups?. Smooth Sailing. Roller Coaster.

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Introduction

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Presentation Transcript

  1. Introduction • Background • Executive Director of QPL in 1992. • Co-founder of Compass Technology Co,. Ltd.. • Executive Director since Oct, 1997 and as CEO since June 2000 • Non-performer in school

  2. Survey What is your expectation as Start-ups?

  3. Smooth Sailing

  4. Roller Coaster

  5. Company Profile

  6. Company Profile • Compass Technology Co., Ltd. • Founded in June 11,1997. • Area: HK-150,000ft2. (13,935m2) China-21,528ft2. (2,000m2) • Paid-up Capital-HK$429M. (USD 55M) • Investor Base- Employee owned with additional investment by blue chip Asian, European VC Funds. • GEMS • General Oriental Investments (HK) Ltd. • Temasek Holdings Ltd. • Value Partners.

  7. Compass Technology Business nature • Manufacture state-of-the-art Semiconductor IC packaging interconnect materials. Application • Flexible Substrates ( TCP, LCD Driver, Flip Chip, TBGA, mBGA, m*BGA,CSP, MCM) Capacity • 250,000 linear meters per month by year 2003 Manufacturing Quality System • ISO 9002 - certified on Dec, 1999 • ISO 14001- certified on Dec, 2000 • ISO 9001- by Q3 2003 • QS 9000 - by Q2 2004

  8. State-of-the-art Production Line

  9. Semiconductor IC packaging interconnect materials IC SUBSTRATE Printed Circuit Board Chip Substrate 1st level interconnect PCB 2nd level interconnect Sample of Packaging Materials Essence of a package Compass Source: Hong Kong University of Science & Technology

  10. IC SUBSTRATE Printed Circuit Board Chip Substrate 1st level interconnect PCB 2nd level interconnect Semiconductor IC packaging interconnect materials Function of Electronic Packaging Essence of a package Compass Packaging & Assembly Chip protection Power distribution Signal passage Heat dissipation Geometry transformer Source: Hong Kong University of Science & Technology

  11. Product Applications • Communications • Broadband • Internet • Wireless • Network • Multi-Media • Cable Modems • Cable Set-Top Boxes • WAP Cellular Phone • Switch Controllers

  12. Product Applications • Computer • Laser printer • Micro Processor • Memory (Rambus, Flash) • Consumer Electronics • Digital Signal Processors • Video Camcorder • Digital Camera

  13. Current Customer Base I-Cube Mitsui EEMS CARSEM ASE Direct Customers Indirect Customers

  14. Start up Experience in our business

  15. Start up Experience

  16. Corporate Responsibilities Co-operative Education Scheme, CityU (協助教育計劃) • 1 year on-the-job Training Program for under-graduates Industrial Attachment Scheme, CityU (暑期就業計劃) • Summer Internship for under-graduates Youth Work Experience and Training Scheme, Labour Dept. (勞工處青少年就業計劃) • 1 year training program for youth between 15 to 24 Selective Placement, Labour Dept. (勞工處展能就業計劃) • Recruitment of employees with physical disabilities Production Technician Pre-Employment Training Scheme, ERB (僱員再培訓局生產技術員再培訓計劃) • Training & recruitment Program for the unemployed Youth Pre-Employment Scheme, Labour Dept. (勞工處展翅計劃) • 6 months training & recruitment program for F.5 graduates.

  17. Green company 1. ISO140001 certified - Recycle the wasted material through recyclers. - Reduce in consumption of office paper and electricity. - Provide training program to employee preserving environment. 2.Gas filters incorporated on all machines to prevent air pollution. 3.Certified Waste Water Treatment Plant that meet Hong Kong Government EP Regulations.

  18. Technology Development Collaboration Programs with Universities • City University of Hong Kong (EPA Center) - Failure Analysis - Reliability Testing - Tape Substrate Functional Testing • Hong Kong Polytechnic University (PCB Technology Transfer Unit) - Via formation by UV YAG or CO2 laser drilling on blind and through hole - Laser drilling on 2metal & multi-layer PI substrates Development • Hong Kong University of Science & Technology (EPACK LAB) - Material characterization & testing - Research in advance engineering materials & technology - Blind & through via hole metallization on 2 metal layer substrate

  19. Technology Development Collaboration Programs with Universities • Xiamen University (China) (Department of Chemistry & Institute of Physical Chemistry) - Metal Finish Process Study and Development - Plating Solution Analysis and Maintenance • Georgia Tech (Package Research Center) - Research and development in advance packaging materials (Material research & development for tape substrate) solder resist - evaluate % cure under different thermal condition ) * Students exchange program with Georgia Tech to do material research in polymers * Current member of Package Research Center. * Programs supported by HKSAR Applied Research Council.

  20. Conclusion “If you help enough people to get what they want, you will get what you want.”

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