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Report from WG 3 – Part I (Pixels)

Report from WG 3 – Part I (Pixels). P. Riedler, A. Rivetti , G. Contin. Pixel Technologies. 2 technologies under study: Hybrid pixel detectors Monolithic pixel detectors Requirements: Low mass: 0.3-0.5 % X 0 per layer Pixel size O(20-30 µm) Integration time <50 µs 0.3 mW /cm 2

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Report from WG 3 – Part I (Pixels)

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  1. Report from WG 3 – Part I (Pixels) P. Riedler, A. Rivetti, G. Contin

  2. Pixel Technologies 2 technologies under study: • Hybrid pixel detectors • Monolithic pixel detectors Requirements: • Low mass: 0.3-0.5 % X0 per layer • Pixel size O(20-30 µm) • Integration time <50 µs • 0.3 mW/cm2 • 1.4 Mrad/2E13 neq L0 • L1/L2 trigger contribution

  3. Hybrid Pixel Detectors • Layout: • 100 um thick sensor with edgeless design • 50 um thick chip with TSV connections • Very fine pitch bump bonding (30 µm)

  4. Hybrid Pixel Detectors – ongoing activities • Sensors: • Edgeless epitaxial sensors (ALICE pixel layout) being processed by FBK – delivery spring 2012 • Edgeless MPW sensor (ALICE pixel layout) run at VTT, delivery of 20 assemblies with ALICE pixel chips in March 2012 • Thinning and bumping: • Dummy test run with IZM (connect 50 µm chips to 100 µm sensors using ALICE pixel layout – delivery November 2011 • TSV: • Joint project with Medipix collaboration at CEA Leti– delivery end 2011

  5. Hybrid Pixel Detektors – next steps • Study 30 µm pitch bump bonding • Using dummies (small prototype?) • Validate thinning to final thicknesses and bumping with real components • Use ALICE pixel chips (small prototype?) • Sensors available from 2010 epi run (conventional edge) or from 2011 edgeless epi run at FBK, might be possible to purchase edgeless sensors from VTT MPW run

  6. Monolithic Pixel Detectors – ongoing activities • Evaluate TOWER/JAZZ process: • Submission of prototype chip (MISTRAL prototype) in October 2011 MPW run • Design of test structures for the October/December MPW run • Irradiation tests with TPAC chips • Irradiation tests with test structures • LePix: • submission to be delivered soon, to be tested

  7. Monolithic Pixel Detectors – next steps • Test prototype chip • Test structures • Irradiation tests of the submitted chips and structures • X-ray irradiation system at CERN • Hadron irradiation (Frascati, CERN, Uppsala) • Submit in 2012 to Tower a set of prototypes • Thinning and dicing studies with various vendors (use either existing ASIC wafers or produce dummies) • Produce dummies with BGA contact layout for assembly studies

  8. Testing • Develop versatile test system (Cagliary readout system) for variety of chips: MIMOSA, prototypes, ….ongoing, first version for MIMOSA available November 2011 • Identify testing equipment for R+D phase, check availabilities in the different labs • Testbeam at CERN using either existing pixel telescope or available telescopes, such as EUDET

  9. Module Aspects • Produce sufficient amount of realistic dummies for studies to connect to the flex cable and for integration studies • Flex cable design: first studies started, more work willbe done to evaluate prototypes

  10. Outlook • Next WG3 meeting – next Monday, October 24, 2011 at 14:00

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