Adhesive bonding. Ville Liimatainen 05.03.2013. Contents. Introduction Adhesive bonding Process overview Main features Polymer adhesives Adhesive bonding technology Bond characterization Applications Conclusion. Adhesive bonding.
Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author.While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server.
UV epoxies (e.g. SU8)
Positive and negative photoresists
Thermosetting copolyesters (ATSP)
Thermoplastic copolymers (PVDC)
Liquid-crystal polymers (LCP)
Polymers are large molecules consisting of linked small molecules (monomers)
Wafer bonder schematic
Substrate lamination tool schematic
Schematic of the ITEC die bonder principle(NXP Semiconductors)
3D integrated circuits
Thin film and device transfer
for MEMS/IC integration
Thin film solar cells
Microcavities for packaging