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ALICE input to TE-MPE-EM workshop 29.11. 2012 GEM foils for the TPC upgrade

ALICE input to TE-MPE-EM workshop 29.11. 2012 GEM foils for the TPC upgrade ‘Low mass’ Aluminum/ Kapton bus c ables and c ooling elements for the Silicon Tracker (ITS) upgrade Access to PCB production and assembly. ALICE upgrade. ALICE will install a major upgrade in 2018 (LS2).

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ALICE input to TE-MPE-EM workshop 29.11. 2012 GEM foils for the TPC upgrade

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  1. ALICE input to TE-MPE-EM workshop 29.11. 2012 GEM foils for the TPC upgrade ‘Low mass’ Aluminum/Kapton bus cables and cooling elements for the Silicon Tracker (ITS) upgrade Access to PCB production and assembly

  2. ALICE upgrade ALICE will install a major upgrade in 2018 (LS2). The upgrade project was endorsed by the LHCC and we are preparing Technical Design Reports to be submitted in 2013. The major detector elements of the upgrade are:  A new, ultra low mass Inner Tracking System (ITS).  Upgrade of the Time Projection Chamber (TPC) with with GEM detectors.

  3. TPC upgrade • 2 sides with 18 sectors each with 2 chambers (IROC and OROC) • OROCs will use two sectors • 3 sets of triple-GEMs per sector • 3x36x3 = 324 single-mask foils • Production: 2014-2015 ~1.5 years • With the present lack of industrial production possibilities our baseline assumption is the production at CERN OROC IROC

  4. ITS upgrade ALICE is developing the signal/power buses for the ALICE Inner Tracking System upgrade together with the TE-MPE-EM service. This ultra low mass Kapton/Aluminum bus is a significant element of this project and relies on know how and technology developed by TE-MPE-EM. In addition the TE-MPE-EM service is involved in development of cooling elements for the silicon sensors.

  5. PCB Production/Assembly We make heavy use of the design, fabrication and assembly services for standard multi-layer PCBs. These are mostly boards that will be developed for the characterization of IC prototypes and for the characterization in terms of radiation hardness of commercial off-the-shelf components. We will have the need of developing a large number of small and relatively simple boards. The turn-around for the delivery of the final item (PCB loaded with the components) will have a large impact on the overall project schedule!

  6. Specific Feedback on PCB Production 1. PCB design In general this service provided a professional and satisfactory service . However, it is lacking a clear TECHNICAL supervision of the team. Sometimes we have the impression that people get stuck with some design simply because they encountered a technical problem that is new to them. More in general, we find that the members of the design team (to my knowledge all FSUs) should be better integrated within the CERN electronics design community. In particular they should be given the possibility to follow training courses. The billing scheme could also also be made more transparent to the users. 2. PCB manufacturing Very competent team. Outstanding contributions on R&D projects. What should be improved is a better management of the production of standard PCBs. In particular efforts should be made to guarantee the production and delivery schedule. (We had one case this year of a PCB that started beginning of February, was expected mid March and was delivered mid July: this is not ACCEPTABLE). 3. PCB assembly Quite satisfactory.    

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