ITRS Factory Integration Presentation

1. ITRS Factory Integration Presentation Mani Janakiram & Junji Iwasaki July 2005 Global Co-Chairs: Europe: Arieh Greenberg Japan: Shige Kobayashi, Michio Honma Korea: TBD Taiwan: Thomas Chen US: Mani Janakiram ITRS Factory Integration TWG

2. Agenda • Scope and Difficult Challenges • FI Current Status • Technology Requirements • Manufacturing Strategy Evolution • Top Factory Integration Focus Areas • Summary ITRS Factory Integration TWG

3. UI Factory Integration Scope and Drivers Factory Operations Production Equipment Factory Information & Control Systems AMHS Facilities Si Substrate Mfg Chip Mfg Wafer Mfg Product Mfg Distribution Reticle Mfg • FEOL • BEOL • Probe/Test • Singulation • Packaging • Test Increasing cost & Cycle time implications • Factory is driven by Cost, Quality, Productivity, and Speed: • Reduce factory capital and operating costs per function • Faster delivery of new and volume products to the end customer • Efficient/Effective high volume production, high reliability, & high equipment reuse • Enable rapid process technology shrinks and wafer size changes DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

4. Key Technologies that will Impact Factory Design • 2005 and future years are targeted to meet productivity and capture technology requirements • Key process and device technology intercepts that will impact the factory design are Extreme Ultraviolet Litho (EUVL), New Device Structures, new materials and the next wafer size conversion Start Planning for 450mm Started discussions EUVL in Production? New Device Structures? Next Wafer Size in Production? ITRS Factory Integration TWG

5. E=Economic/Business P=Process Technology M=Manufacturing Difficult Challenges Summary Near Term: 2005 to 2009 >45nm • Responding to rapidly changing and complex business requirements [E] • Meeting growth targets while margins are declining [E] • Managing ever increasing factory complexity [M] • Meeting factory and equipment reliability, capability or productivity requirements per the roadmap [M] • Meeting the Flexibility, Extendibility, and Scalability needs of a cost effective, leading edge factory [M] • Meeting process requirements at 65nm and 45nm nodes running production volumes [P] • Increasing global restrictions on environmental issues [E] Long Term: 2012 to 2018 <45nm • Post conventional CMOS manufacturing uncertainty [P] • Next Wafer Size and Emerging factory paradigm changes [M] [E] Economic and business challenges are equal to our manufacturing and process technology challenges in scope and breadth for both efficiency and effectiveness DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

6. Some Projected Attributes of a 300mm < 45nm Fab Wafer Data Standard For Packaging Data standards and Systems for Rapid Mask Set Creation Very Fast Cycle time Fabs for Hot & Normal lots Equipment & Systems designed for High Mix operation 100% Direct Tool Delivery AMHS Aggressive NPW Reduction & Efficient Spares Mgmt Full Wafer Level Tracking & Recipe/Parameter Changes Systems Scaled for > 50k wspm Ubiquitous APC; Rapid Process Matching & New Product Qualification Manufacturing Execution Systems Equipment Engineering Capabilities Equipment Control Systems SECS Control Line Equipment & Process Data APC FDC SPC Recipes Factory Scheduler And Material Control Yield PCS E-Diag EPT Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data Offline tools to test schedule rules and rapidly put in Mfg Partner, Customer Or Supplier Standard, Detailed Equipment Performance Tracking (EPT) Data Pervasive E-Diagnostics

7. FI Sub team – July 2005 Status Completed technology requirements, potential solutions, focus area and cross-cut challenges DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

8. Solution exists Solution being developed Solution required Factory Operations Technical Requirements Key Objectives: 1) Reduce mfg cycle times, 2) Improve Equipment Utilization, 3) Reduce Losses from High Mix

9. Production Equipment Technical Requirements Key Objectives: 1) NPW reduction, 2) Reliability Improvement, 3) Run rate (throughput) improvement Solution exists Solution being developed Solution required

10. Material Handling Technical Requirements Key Objectives: 1) Increase throughput for Traditional and Unified Transport, 2) Reduce Average Delivery times, 3) Improve Reliability Solution exists Solution being developed Solution required

11. FICS Technical Requirements Key Objectives: 1) Increase Reliability, 2) Increase Factory Throughput, 3) Reduce or Maintain Mask Shop Cycle Time, 4) Reduce Costs Solution exists Solution being developed Solution required

12. Facilities Technical Requirements Key Objectives: 1) Factory Extendibility, 2) AMC, 3) Rapid Install/Qualification, 4) Reduce Costs Solution exists Solution being developed Solution required

13. 2005 FI Focus Area Factory Integration focus areas: AMC, NWS, and Proactive Visualization

14. AMC Requirements - Current status • AMC limits are currently addressed in the Yield Enhancement YE TWG, and the Wafer Environmental Contamination Control WECC subTWG • Fab environment requirements have not been defined yet in the FI TWG Factory Integration Roadmap Yield Enhancement Roadmap Fab environment Technology Requirements Wafer/Tool environment Wafer

15. Rapid Tool Install - Adapter Plate Concept Exhaust From Tool Supplier Utilities Into Process Tool Facility Utilities Into Adapter Plate (water, gasses, etc.) Facility Power Into Adapter Plate Exhaust To Facility

16. Factory Resource Metrics Development and Proper Targeting Needed Factory Operation Proactive Visualization Products Quality Cost Delivery Energy Proactive Visualization • Comprehensive structured P/V matrix be developed for SoC manufacturing • Strategic issues be broken down and mapped into P/V matrix • Solutions and needs bilaterally be traceable through P/V matrix New IDM New Foundry Business Short product cycle Small order size Combinations of Solutions Varying product volume HMLV LMHV New Production Methods Design & Manufacturing Integration Strategic Issues solutions DRAFT – Work In Progress - NOT FOR PUBLICATION 13 July 2005

17. Cycle Time as a function of Lot Size Objective Lot Size Nominal Lot Size ITRS Factory Integration TWG

18. 675mm/2021? 200mm/1990 (125/150mm - 1981) 300mm/2001 450mm/2012? 9 yrs + ?yrs delay 9 yrs + 2 yrs delay* We started discussions for next wafer size transition When does this happen? We are here 9 yrs? + 2 yrs delay? ITRS Factory Integration TWG

19. Examples of next wafer size (NWS) technology decisions that are needed ITRS Factory Integration TWG

20. Interoperability Testing & Reliability Verification Factory Control System Standards Direct Transport Standards Production Equipment Standards 450mm wafer Standards 2004 2005 2006 2007 2008 2009 2010 2011 2012 Carrier & lot-size determination 2004 2005 2006 2007 2008 2009 2010 2011 2012 Proposed next wafer size (NWS) transition timeline Not final. Need Further discussions Many technology issues in NWS need to be addressed! FI has started to work on NWS technology challenges ITRS Factory Integration TWG

21. Key Messages • Business strategies, market demands, and process technology changes continue to make factories difficult to integrate • Factory’s speed and flexibility are vital to accommodate various production technologies High Mix, Cycle time improvement, equipment utilization, direct transport AMHS, etc. • Gaps in Production Equipment performance, Setup time, AMHS, Facilities and Factory operations must be improved Metrics needed to cover versatility, productivity, agility, quality, environment compatibility • Key cross-TWG issues need to be addressed Abatement, Energy requirement, • New technology demands tighter AMC control • Proactive visualization/usage of factory data is required Delivery time, Quality, and Reliability • Next wafer size technical requirements need to addressed ITRS Factory Integration TWG