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by John Mosher, Bob Nickels – Honeywell Sensing & Control and

NeSSI II - A Platform for Micro-Analytical Devices CPAC Spring Meeting – May 2003. by John Mosher, Bob Nickels – Honeywell Sensing & Control and Ulrich Bonne – Honeywell Laboratories. Why NeSSI?. “It's estimated that 70-80% of analyzer outages can be traced to the sample system.”

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by John Mosher, Bob Nickels – Honeywell Sensing & Control and

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  1. NeSSI II - A Platform for Micro-Analytical Devices CPAC Spring Meeting – May 2003 by John Mosher, Bob Nickels – Honeywell Sensing & Control and Ulrich Bonne – Honeywell Laboratories

  2. Why NeSSI? “It's estimated that 70-80% of analyzer outages can be traced to the sample system.” T. McMahon, Control Magazine, August 2001 • Sample systems limit the effectiveness of process analytical technology: • Complex • Expensive • Sparingly deployed • High maintenance • Large, bulky, “dumb” devices • Major cause of unplanned downtime

  3. Evolution of the NeSSI Project MicroAnalytical (enabled by Technology Advances) End User Value Gen III Circa 200? At the Pipe (enabled by Intrinsic Safety) Gen II Circa 2003 Electrical/Smart (enabled by Communication Standard) Miniature/Modular (enabled by Mechanical Standard) Gen I 2002 Honeywell Proof Of Concept Apparatus ( under development at S&C, Feb. 03)

  4. User-Driven, Multi-vendor Supported NeSSI Objectives • Promote the concept of... • at the pipefield-mounted analytical systems • Facilitate the acceptance/implementation of... • modular & miniature process analytical technology • Lay the groundwork for... • smart technologyopen connectivity & communications • Provide a technology bridge to the process for... • microanalytical“lab-on-a-chip” - PHASED U.S. Patent No: 6,393,894 • PHASED Multi-Gas Analyzer (Micro Gas Chromatograph) under development at Honeywell Labs • GE-Panametrics Oxygen sensor probe on NeSSI

  5. Gen I - Miniature/Modular Concept Traditional Sample System: NeSSI Sample System: ANSI/ISA 76.00.02-2002 Modular Component Interfaces for Surface-Mounted Fluid Distribution Components Part 1: Elastomeric Seals Approved August 2002

  6. CANbus P F V A SAM SAM Substrate Auxiliary Heating/Cooling Programmable Substrate Heater  eSAM T T Gen II - Smart/Electrical Technology NeSSI II = ANSI/ISA76 + IS + CAN + SAM NeSSI Gen II ENTERPRISE DOMAIN Level 4 Enterprise LAN Level 3 LAN PROCESS CONTROL DOMAIN INFORMATION D0MAIN Level 2 LAN = Field LAN • Open communications protocol standard based on CAN • Intrinsically Safe • SAM = Sensor Actuator Manager – Embedded Controller, Profile Manager Communications Gateway Level 1 SensorBus (CAN) MEASUREMENT DOMAIN

  7. NeSSI II/III – Platform Development Communications Interface “Rail” – DeviceNet IS The Area Between the Enabling “Rails” is Where Sensor and Instrument Vendors Add Value and Commercialize Intellectual Property. Physical Interface “Rail” – ANSI/SP76

  8. Network Network A/D D/A Press/ Temp Mod Valve NeSSI II/III – Product Development Typical NeSSI Device combines state-of-the-art combi- sensor technology with Intelligence and network interface in one small, surface-mount package. Other Analytical: pH, O2, Ion, Conductivity, NOx, Turbidity, ??? Substrate Substrate Substrate On/Off and Modulating valves Flow Sensor w/ Temp, Pressure w/ Temp PHASED Micro GC Moisture in Dry Gasses

  9. Adaptation of Honeywell Temp, Pressure, Flow Sensors • Microbridge flow sensor interfaced to a typical miniature CAN microcontroller and 8 mm connector. • A similar interfacing • approach will be used in this project to connect existing sensors and actuators to • the CAN network. 8 mm by Bob Nickels, Honeywell

  10. Honeywell Proof-of-Concept-Assembly (POCA) • Current Status: • Sensor Design and SP76 housing qualified • Intrinsically Safe (IS). • CAN controller and transceiver chipsets • identified. • DeviceNet protocol selected and pre-tested • in selected chipset. • M8 connector tested for DeviceNet on POCA. • Preliminary CAN IS mode testing done. • First POCA units delivered to Dow and • ExxonMobil. • Next Steps: • Design and build PCBs incorporating selected sensing and communication chipsets/circuits. • Design and build PCBs into SP76 Housings and qualify full product as IS. • Test Assemblies in full DeviceNet network. • Identify DeviceNet IS network restrictions and rules. • Propose establishment of DeviceNet IS Special Interest Group (SIG) to ODVA.

  11. NeSSI II/III Cost Comparison System Configuration: Above Average Complexity, 4 Gas Streams: 2 Process, 1 Span, 1 Calibration. Extra, Blank Locations for Additional Instrumentation, including PHASED GC. Traditional SS NeSSI Gen 1 w/Control NeSSI Gen 2/3 $20,000$36,000$40,000 est. Traditional Sampling System: Gauges, Manual Valves, Rotometers, Gas-Purged Enclosure, No Information, Process Variable Disconnect, Custom One-of-a-Kind NeSSI Gen 1 w/Control: Smaller Footprint, Modular Gas Path, Gauges, 4-20mA Input/Output Devices PLC Control, Process Variables Connected, Huge Gas Purged Enclosure, Custom One-of-a-Kind. NeSSI Gen 2/3: Much Smaller Footprint, Networked I/O Devices, Local & Remote Control, Process Variables Integrated, Intrinsically Safe, Software Menu Designed, SAM Controlled, GC Onboard, PDA Enabled, Standard Enclosure Located Near Flow.

  12. Intelligence + Communications = Improved Productivity • The Value of Good, Fast Information: • Monitoring of key parameters • Verify constant flow of analyte • Control pressure, temperature • Self-validation, both continuous and periodic (embedded control, integrated diagnostics, self-calibration) • Intelligent statistical tools identify abnormal events • Operators notified when trouble is anticipated (predictive diagnostics) • Data presented in a user-friendly way to the right person, anywhere • Self-correcting systems to avoid downtime Wireless enablers for operator productivity

  13. Preliminary Investigation of SAM Controller Choices • Honeywell Experion PKS C200 Controller  • DeviceNet in/Ethernet or ControlNet out • Direct Connectivity to Honeywell Architectures |CPU|Enet|Dnet| I/O| •  SAM Design A: • DeviceNet in/Ethernet out • 4” x 4” x 2” • USB and Serial Ports • Linux OS w/ JavaVirtual Machine • SAM Design B:  • DeviceNet in/Ethernet out • 3” x 4” x 6” • Expandable local I/O, Serial Ports • Windows CE OS • Webserver OPC Connectivity

  14. NeSSI Integration into Information Systems DeviceNet Sample System I/O Subsystem OPC Gateway Local HMI Station SensorActuatorManager SensorActuatorManager V V A A P P T T Gas Analyzer Sample System Control & Information - Level 3 LAN (Ethernet) Control Room Field Class 1 Div 1 At-Line Sample Point Field - Level 2 LAN (Wired or Wireless) Field - Level 2 LAN (Ethernet) Analyzer Shed Class 1 Div 2 Wireless Handheld HMI Class 1 Div 2 Sensor - Level 1 LAN (DeviceNet) Gas Analyzer Sample System NeSSI Generation 2/3 Class 1 Div 1 NeSSI Generation 1

  15. NeSSI II – Market Development Industry Organizations: Honeywell Products and Services: Sensing & Control - Pressure, Temperature, Flow Moisture, Turbitity, ??? Industrial Measurement & Control - pH, O2, H20, Conductivity NOx, Ion, Moisture, ??? Honeywell Labs - PHASED, Microanalyzers Industry Solutions - Sales, Service, and Support NeSSI - New Sampling Sensor Initiative Center for Process and Analytical Chemistry Open DeviceNet Vendors Association

  16. NeSSI II/III – Commercialization Strategy Unsophisticated End Users Sophisticated End Users & Application-Specific OEMs Customers Analyzer OEMs Honeywell Services & Industrial Solutions Solutions ABB, Siemens, Many Others Other Integrators/Installers Also ABB, Siemens, Many Others Analyzer OEMs Gas Box Assemble, Test Companies Celerity, UCT, Others Products Components Other Analytical Device Manufacturers Substrate/Valve Manufacturers Honeywell Indust. Measure & Control Honeywell Sensing & Control DeviceNet & Controller Manufacturers GE Panametrics, Circor, Rosemount, Others pH, O2, H2O, PHASED, More Pressure, Temp, Flow, Moisture Parker, Swagelok, Celerity, Others Many

  17. Thank You! NeSSI II - A Platform for Micro-Analytical Devices CPAC Spring Meeting – May 2003 John.Mosher@Honeywell.com (209) 339-4004 Bob.Nickels@Honeywell.com (815)235-5375 Ulrich.Bonne@Honeywell.com (763)954-2758

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