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第 12 章 封装过程中的缺陷分析 PowerPoint PPT Presentation


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第 12 章 封装过程中的缺陷分析. 由于封装技术水平的不断提高以及封装元件轻薄短小的发展趋势,本来已存在于封装制作中的缺陷问题,显得更为突出重要了。为了提高产品的可靠性,了解封装缺陷问题的原因并加以改善,延长产品的使用寿命,避免封装缺陷的产生并提高封装产品质量,本章对封装过程中的缺陷进行分析和阐述。. 12.1 金线偏移 金线偏移是封装过程中最常发生的问题之一,集成电路元件常常因为金线偏移量过大造成相邻的金线相互接触从而形成短路( Short Shot ),甚至将金线冲断形成断路,造成元件的缺陷如图 12.1 所示。金线偏移的原因一般有以下几种:

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第 12 章 封装过程中的缺陷分析

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12


12.1

Short Shot12.1

Viscous Drag ForceViscosity

Bending Moment


/Overpacking/Latepacking

2.5-250m25m

IC


12.1 X


12.2

12.2.1

1

112.2


12.2

25-612.3


12.3

2

12.4

PCB

PCBPCBPCBPCBPCBPCB

PCB


12.4

3


self alignmentPCB


ChipBGACSPChipChipBGABGASOPSOJQFPPLCCSOPSOJQFPPLCCSMD


4

112.5PCBPCBPCBPCB

12.5


PCB:

a.

b.

c.

d.

12.6ABGS


12.6

PCB

a. G


12.7 G

b.

12.8


2

3


4

Chip;SOPSOJQFPPLCC3/4


1/20.2mm0.1mm


12.2.2

1

PCB


12.9

12.9


2

1

2

a.

b.

c.

d.


3

a.STC

b.XY

c.

d.

Z

3


1

Sn/Pb/In/

2

3

4


12.2.3

12.10

12.10


1

1

9095

12.11


12.11

2


3

4

4150-16070s-90s

5


12.2.4

SMT

PCB


1

12.12


12.12

2


3

1


2

3

cartridge

T


4T

//TT

5

PCBT


6

50179183Sn62.5/Pb36.5/Ag1.0

183179

7

T

N2O2


12.2.5

1


2BGA

BGABGAXBGAXXBGAX

BGAIPG-7095BGABGAIPG-7095


3

BGABGABGAPCB

BGA


BGAPCBBGABGA63Sn/37PbBGA10Sn/90PbBGA302BGA


4

IPC-7.95/502510302510-25


12.2.6

1


2


3


4


5


6


7


8


9


10


11

X235PCBPCB


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