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Technology-Assisted Assessment Inquiry Part 1

Technology-Assisted Assessment Inquiry Part 1. Grand Canyon University TEC-546 Clayton Jackson. SOLDERING/DE-SOLDERING TECHNQUES . Academic Standards and Goals:.

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Technology-Assisted Assessment Inquiry Part 1

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  1. Technology-Assisted Assessment Inquiry Part 1 Grand Canyon University TEC-546 Clayton Jackson

  2. SOLDERING/DE-SOLDERING TECHNQUES

  3. Academic Standards and Goals: • Students will make connections among mathematical ideas and to other disciplines. Students will correctly install components into the circuits based on resistor values, voltage ratings and proper polarity. • Students will use tools and instruments for observing, measuring, and manipulation of scientific equipment and materials.Studentswill use the appropriate soldering and de-soldering tools to install and connect electronics components and wires into selected electronics circuits.

  4. Academic Standards and Goals: cont. • Students will identify and investigate problems scientifically. Students will identify circuit problems by making visual inspections, and taking voltage and resistance measurements, de-soldering and re-soldering bad solder connections.

  5. Objectives: • Upon completion of this lesson, the students will be able to correctly answer 70 % of questions about soldering and de-soldering procedures and techniques. • The students will correctly install, and connect electronics components into selected circuits in accordance with verbal and written instructions.

  6. Objectives: cont. • The students will perform a final visual inspection before connecting the circuit to the appropriate voltage source, and performing an operational test.

  7. Assessment instructions • Assessments for the Soldering and De-soldering Techniques lesson will be accomplished in two parts. • Part 1: In accordance with the academic standards and goals, the academic assessment will consist of a written pre-test/quizof 12 questions. This assessment consists of both true and false, and multiple choice questions.

  8. Assessment instructions: cont. • Part 2 of the assessment is a hands-on practical exercise, and the completion of a Post-test. • The students will be required to correctly install components into selected circuits using the proper soldering techniques, and perform an operational check of the circuit. • Results of the pre-test and post-test will be monitored in addition to results of other topic related assessments in order to measure student learning and progress.

  9. SOLDERING/DE-SOLDERING TECHNQUES Quiz 1. Soldering is defined as: (a) joining to piece of wire together to extend the length of the wire. (b) melting components in-place to form a circuit. (c) the process of joining metal leads, creating a mechanical and electrical bond. (d) the process of removing components from an electronic circuit. 2. The most common type of solder used in electronics contains: (a) 50% tin and 50% lead. (b) 60% tin and 40% lead. (c) 60% lead and 40% tin. (d) 65% tin and 35% lead.

  10. 3. A solder joint that appears dull and rough or irregular appearance is a: (a) cold solder joint. (b) solder bridge. (c) good solder joint. (d) surface mount joint A tool used for drawing heat from connections while soldering to prevent damage to components is: (a) crimping tool (b) heat sink (c) heat-shrink tubing (d) soldering iron A liquid or solid which when heated cleans and protects surfaces and protects surfaces to be soldered. (a) flux (b) lead (c) alcohol (d) rosin

  11. 6. Films and impurities which form on the surface of metals when exposed to air or • water are: • (a) rosin • (b) lead • (c) flux • (d) oxides • 7. The purpose of the soldering iron is to: • (a) heat the flux • (b) heat the joint. • (c) remove oxides form the joint. • (d) remove the solder. • 8. The last step in the soldering process is to • (a) remove heat from the joint. • (b) cut-off excess leads. • (c) bend the component leads. • (d) remove solder from the connection.

  12. 9. TRUE or FALSE: There are seven steps in the soldering process. 10. TRUE or FALSE: When preparing components for soldering it is not necessary to bend the component leads. TRUE or FALSE: Isopropyl alcohol is used to help the solder bond to the connection. 12. TRUE or FALSE: The difference between a soldering iron and soldering pencils is the wattage rating.

  13. REFERENCES Foundations of electronics, Engineering and Technology Pathways, Career Technical, Agricultural Education (CTAE 2011). Georgia Performance Standards, https://www.georgiastandards.org Soldering and De-soldering techniques, Foundations of Electronics, C. Jackson (2011). Glenn Hills High School, http://ghhs.rcboe.org

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