Status of Hybrid Qualification and Tender

1. Status of Hybrid Qualification and Tender • Final Technical Specifications • Hybrid types • Quality control, intermediate tests and inspections • Some results on FE-Hybrids w.r.t. these criteria • Visual inspections • Bonding • … • Delivery Profile of Pre-Production • Delivery Profile of Tender

2. FE-Hybrids Types • Latest modifications in April 2003 • Lamination onto ceramic stiffener is a very critical operation • 12 different types of combinations (the opposite of what was originally intended!!) • TIB, TOB, TEC • 4 or 6 APV • Connector up and down • r and stereo ceramic (5) 1 TEC, 2 TOB, 2 TIB • APV25, positioning and bonding • Thermal cycle (simple, no bias) • Final acceptance test FHIT

3. Quality Control • IPC-A-600F and IPC-A-610C, class 3 • Lamination: • detailed procedure, although recent failure is not understood. • Crucial visual inspection of lamination after all processing steps • Cleaning: has improved after some iterations • APV positioning and bonding is crucial (cost driving?) element • Certainly at limit of industrial standards • Detailed specs for precision placement and bonding • Dicing of APV-wafer is included as an option (1), ask for separated costing • Trace-ability of APVs at Wafer level • Trace-ability of individual APVs: Option (2) • Short temperature cycle is an option (3) • FHIT final functionality test (100%) and record for DB

4. Positioning of APVs

5. Positioning of APVs 95% should be in this area • TOB, Hybrid SA, 1st series, 55 measured • Kapton on ceramic • Overall shrink: 27 µm 0-1 0-4 0-5

6. Positioning of APVs 95% should be in this area • TOB, Hybrid SA, 2nd series, 45 measured • Kapton on ceramic • Overall shrink: 31 µm 0-1 0-4 0-5

7. Positioning of APVs 95% should be in this area • TIB, Hopp, series of 40 measured • Overall shrink FR4: 15 µm APV0-1 APV0-4 APV0-5

8. Bonding Strength Hybrid_SA, TOB GS-Hopp, TIB

9. Pre-Production I « M900 » • 300 TOB ordered (ceramic) • 16+80 delivered December 2002 • 78 -> CERN • 31 FNAL • 5 UCSB • 2 KA • 40 CERN • 29 with PA (25 bonded), 5 active thermal cycle • 100 delivered end Jan2003, • bad lamination • Can only be used for system tests • 20 TOB made in Feb/March, OK given end March • 80 to be done, in production • Lamination complete • 50 finished, 45 ok with FHIT, now in Strasbourg • 26 will be ready today • FHIT remained at factory • 200 TIB and 200 TEC ordered in Jan 2003 Problem not understood!

10. Pre-Production II « Large volume order by CERN  » • 4370 TEC/TIB/TOB ordered, • 200+200+4370 considered as single production • With new designs never prototyped! • Qualification batch: 3 lots of ca. 100 in production • Lamination of TEC about to start after electrical test • Also bad circuits will be laminated for tests • Evaluation sample, delivery ca. May 6: • 10 TOB: 5x 4-APV_rphi_down, 5x 6-APV_rphi_up • 10 TIB: 5x 4-APV_rphi_down, 5x 6-APV_stereo_up • 10 TEC: 5x 6-APV_down, 5x 4-APV_up • 3x 90 TOB, TIB, TEC delivery (2 weeks) not before May 20 • Production batches • Start May 6(?), circuits tested mid June • Lamination starts June 20, 600-800 pcs/ week, finnish end July • Assembly and test: could start June 23, 600/week • Delivery to CERN starts July 7, finish beginning of Sept

11. Tendering Status • Technical specifications are « frozen » • Documents for French administration: • Translation of Technical Specification into French • CCPT, Cahier des Clauses Techniques Particulières • CCAP, Cahier des Clauses AdministrativesParticulières • RDC, Règlement de la Consultation • Journal officiel des communautés européennes • All submitted on Monday, 07/04 to in2p3 • Official Start of Tendering 15th of April 2003 • All documents are/will be available on the ftp site: ftp://lepsi.in2p3.fr/pub/berst/CMS_HYBRIDS_AO /TIB; /TOB; /TEC; • “Appel d’offre ouvert” • Open for 52 days (end 17 June 17:00) • Opening of letters in week 25 (16/06) • Place Contract before 14th of July

12. Production Delivery Profile