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Status of the CMS ECAL Endcaps LHCC Comprehensive Review, June 2006 D Cockerill

Status of the CMS ECAL Endcaps LHCC Comprehensive Review, June 2006 D Cockerill EE  EE large mechanics  VPTs and Supercrystal assembly  Electronics  Trigger  The “Dee4” project ES  ES mechanics  Micromodules and readout EE and ES Planning Conclusions.

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Status of the CMS ECAL Endcaps LHCC Comprehensive Review, June 2006 D Cockerill

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  1. Status of the CMS ECAL Endcaps • LHCC Comprehensive Review, June 2006D Cockerill EE  EE large mechanics VPTs and Supercrystal assembly Electronics Trigger The “Dee4” projectES ES mechanics Micromodules and readout EE and ES PlanningConclusions

  2. The CMS ECAL Endcaps – EE/ES Preshower 2Xo, 1Xo Pb, 2mm Si strips, 2 x 2 orthogonal layers Crystal Endcaps:4 Dees (2 per endcap)14648 Crystals Total mass 22.9t Tapered crystalsOff-Pointing ~ 3o from vertex

  3. EndCap EE All large mechanical pieces are at CERN Dry assembly of env. screen produced in Russia

  4. EE: VPT production & gluing, Supercrystals EE VPT to crystal gluing 2800 VPTs shipped from UK to CERNAll tested upon receipt by Russia - INR Up to 50 EE crystals/VPTs glued each week110 of current EE crystal stock (~350 xtals) done First “Russian” SC completed in June 2006built using CRISTAL database

  5. EE electronics SC HV cards105 pre-production cards completed All R & C components for EE delivered Motherboards2 prototypes on Dee4 600 cards by end 2006 EE VFE cardsRC feedback on MGPA tuned for EEInput diode for VPT spark protection30 prototypes produced in Feb 06250 cards now under test 3130 cards by end July 06FE cards80pre-production cards tested 800 cards produced by Sep 2006 Preliminary results, ~ 3900 e- per channelCross talk < 0.1%Meets EE requirements

  6. EE trigger Pseudostrip (5 crystal) allocationsEE+ towards I.P Consequent trigger towers (TCC level)EE+ towards I.P

  7. EE : preparing for the assembly Ensuring correct cabling of the channels LED cabling tester from UVa Trigger map (H.Heath)

  8. EE data and trigger readout The fibre readout fan-out boxes (two layers) serving the EE DCCs and TCCs in the control room 900 readout fibres to correctly route per Dee

  9. “Dee4” project EE assembly has started “Dee4” will provide crucial assembly and test beam insights Dee1 assembly from September 2006 “Dee4”First large scale test of integration philosophy 20 SCs mounted on BP Dee4 by end 2006 Trigger mapping at motherboard 10 cooling blocks, main manifold “Dee4” to testbeam in May 2007

  10. (Preshower) ES: Engineering Windows ready with Paraffin : first elements to be installed before beam pipe closure Blanks for outer drums/patch panels First brazing of cooling screen

  11. ES: Silicon micro-modules Si sensors available All ceramics supports and Al tiles produced Small mod to allow for backplane bonding(follow. ES and Tracker experience) All ASICS available Problem with hybrids production First large series of PCBs not good ! Immediate action: change PCB manufacturing company Will probably eat a large part of schedule contingency

  12. ES: On and Off detector digital electronics MB tester (NTU) • Successful test of Mother boards pre-series • including 12 boards token ring and test of several ladders • →Production launched • ESR for ES-DCC last May • OptoRx: proto ok. Final version in a few weeks • VME board end of Summer (collab. with TOTEM) OptoRx

  13. EE Planning CMS windowfor Dee1end Sep 07 EE+mid Jan 08 EE-mid Mar 08 • Dee 1 End Sep 2007Dee 2 End Dec 2007Dee 3 Mid Mar 2008Dee 4 Mid Apr 2008

  14. EE planning Crucial to introduce as much parallel assembly and integration as possibleQuality control at each crucial step Suggestion to carry out all SC mounting and Dee assembly in bldg 867 This offers many very attractive features - all major activities under one roof - proximity of expert teams - realisation of the EE trigger, from motherboard level to fibre readout level - multiple DAQ test systems, needed for EE QA, available locally - cooling capacity for one entire Dee - LV power Crystal Palace Advance preparation of all large mechanics - Dees into OPAL frames - dry assembly tests of Environmental screens - BP cooling installation - Mounting laser monitoring system

  15. ES planning Good progress with engineering/mechanicsBare micromodule production has startedProblem with hybrid PCB production: change of producer necessary; will try to minimize impact on overall ES scheduleDelay on system motherboards but production should start soon and should be faster than originally envisaged Important progress in DAQ (software and ES-DCC) and good advances in offline/physics software “Ready for Installation” dates so far unaffected by delays. Some contingency now exists due to revised V35 schedule but will probably be “eaten” by hybrid delay ES+ Dee1 assembly finished 15.3.07ES+ Dee2 assembly finished 30.6.07 ES- Dee1 assembly finished 30.8.07 ES- Dee2 assembly finished 30.11.07 ES- RFI 31.8.07 ES+ RFI 31.12.07

  16. EE - Conclusions EE and ES assembly has started Much progress with the EE large mechanics, VPTs, SC assembly, electronics, and trigger and data mapping “Dee4” will provide crucial assembly and test beam insights Dee1 assembly from September 2006 Good progress with ES engineering/mechanics Bare micromodule production has started We are on the learning curve for EE and ES assembly

  17. Additional info follows, next slide

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