Two Components contribute to the power dissipation: Static Power Dissipation Leakage current Sub-threshold current Dynamic Power Dissipation Short circuit power dissipation Charging and discharging power dissipation. Power Dissipation in CMOS. Static Power Dissipation. VDD.
Two Components contribute to the power dissipation:
Static Power Dissipation
Dynamic Power Dissipation
Short circuit power dissipation
Charging and discharging power dissipation
The first term —— the energy dissipation due to the
Charging/discharging of the effective load capacitance CL.
The second term —— the energy dissipation due to the input-to-output coupling capacitance. A rising input results in a VDD-VDD transition of the voltage across CM and so doubles the charge of CM.
CL = Cload + Cdbp +Cdbn
CM = Cgdn + Cgdp
Even ESC can be modeled, it is also difficult to calculate the Edynamic.
On the other hand, if the short-circuit current iSC can be Modeled, the power-supply current iDD may be modeled with the same method.
So there is a possibility to directly model iDD instead of iSC.
The short-circuit energy dissipation ESC is due to the rail-to-rail current when both the PMOS and NMOS devices are simultaneously on.
ESC = ESC_C + ESC_n
For a long-channel device, assuming that the inverter is symmetrical (n = p = and VTn = -VTp = VT) and with zero load capacitance, and input signal has equal rise and fall times (r = f = ), the average short-circuit current [Veendrick, 1994] is
From the above equation, some fundamental factors that affect short-circuit current are:
, VDD, VT, and T.
For a short-channel device, and VT are no longer constants, but affected by a large number of parameters (i.e. circuit conditions, hspice parameters and process parameters).
CL also affects short-circuit current.
Imean is a function of the following parameters (tox is process-dependent):
CL, , T (or /T), VDD, Wn,p, Ln,p (or Wn,p/Ln,p ), tox, …
The above argument is validated by the means of simulation in the case of discharging inverter,