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Pixel Bus Development

Pixel Bus Development. Who is working Over view of pixel bus Manufacture process Issues Development / Production Schedule. Atsushi Taketani RIKEN/RBRC. Who is working. RIKEN Design, Founding, and Coordination for PHENIX Soliton R&D Fine pitch PCB manufacture. Manufacturing Al bus

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Pixel Bus Development

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  1. Pixel Bus Development • Who is working • Over view of pixel bus • Manufacture process • Issues • Development / Production Schedule Atsushi Taketani RIKEN/RBRC

  2. Who is working • RIKEN • Design, Founding, and Coordination for PHENIX • Soliton R&D • Fine pitch PCB manufacture. • Manufacturing Al bus • Hiroshima Kokusai Gakuin University Research Institute of Advanced Technology • Expert of Aluminum for condensed matter physics • KEK and their contractor • Parallel effort for R&D

  3. ALICE Pixel BUS (a milestone) ALICE Pixel BUS structure Singal2 Singal3 5 to 7 mm Al 12 mm Polyimide 5 mm glue 5 to 7 mm Al 12 mm Polyimide 5 mm glue Singal1 15 mm Al 5 mm glue 12 mm Polyimide 5 mm glue 50 mm Al Signal 1;(Vertical line)line connected withpixel chip with wire bonding 5 mm glue 12 mm Polyimide Signal 2;(Horizontal line)connected with vertical line with through hole 5 mm glue 50 mm Al Signal 3;(for SMD) Total radiation length = 0.173 % X0 5 mm glue 12 mm Polyimide

  4. PHENIX Option Aggressive Easy (relatively) Option 2 Option 3 Option 1 Line spacing; 140 um pitch Material Budget; Cu; Total ~ 0.306 % Al; Total ~ 0.128 % Line spacing; 140 um pitch Material Budget; Cu; Total ~ 0.376 % Al; Total ~ 0.139 % Line spacing; 70 um pitch Material Budget; Cu; Total ~ 0.236 % Al; Total ~ 0.117 % Horizontal 2layer Vertical 2layer Horizontal 1 layer Vertical 1layer Fine pitch Horizontal 2layer Vertical 1ayer Alignment, Through hole

  5. Aluminum Aluminum Polyimide Polyimide Polyimide Manufacture Process 4 Through hole 1 Glued 5 Alignment and Etching 2 Etching 3 Glued 6 Gold plating

  6. List of Issues • Pattern Etching Aluminum fine pitch pattern • Through hole Small (~100micron) Filling conductive material • Al - Ni - Au plating Making wire bonding pad • Alignment of multiple layer Precise alignment

  7. Etching Successfully for ALICE PIXEL bus pattern!!! 40 micron width, 120 micron pitch

  8. Etching (2) • Peal strength is OK by test. • 10micron Polyimide + 5micron/15micron Glue (polyimide) + 12 micron Al • Almost ready for production for ALICE BUS • Possible for 40micron space pattern • Possible to produce 5cm*60cm pattern

  9. Through Hole (BVH method) Tiring now and will have a result on next week Aluminum Laser Polyimide Aluminum Chemical plating or Vacuum evaporation

  10. Al –Ni-Au plating • Al –Ni for hardening ground for wire bonding. Succeeded, I got a sample, sorry for no picture. • Ni-Au Trying now and will have a result on next week.

  11. Alignment for multilayer bus • By using alignment marks by machine • By using through halls by human Developing adjustment machine by mid Sep. Mask Pattern Optics Resist Aluminum On the movable table Polyimide

  12. Schedule • Etching Done • Through hall Done by 2nd week of June • Au plating Done by 2nd week of June • Alignment Machine will be ready at mid Sep. • Test production on Mid Oct for ALICE Bus • Preproduction for PHENIX on Mid Nov.

  13. Alternative • KEK and their contractor They will produce ALICE BUS on July. But no Al-Ni-Au plating. • We are considering Cu version bus for PHENIX electrical test with readout chip and pilot module.

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