O uter b arrel h ybrid i ntegrated c ircuit
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O uter B arrel H ybrid I ntegrated C ircuit. Cosimo Pastore, ITS-MFT mini-week, 12 March 2014. OUTLINE. OB Module assembly Ongoing activities tools for: - modules pre-alignment and shipping - laser soldering test with 1 and 14 chips - pALPIDE_fs chip Summary.

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O uter b arrel h ybrid i ntegrated c ircuit

Outer Barrel

Hybrid Integrated Circuit

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

OUTLINE

  • OB Module assembly

  • Ongoing activities

  • tools for:

  • - modules pre-alignment and shipping

  • - laser soldering test with 1 and 14 chips

  • - pALPIDE_fs chip

  • Summary

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

OB Module assembly: material

FPC layer stack up

Cover-sheet 25 µm

Copper 50 µm

Kapton 25 µm

Copper 50 µm

6 modules have been produced

- 1 with carbon plate

- 5 without carbon plate

  • 50 µm thick

  • size 15 mm x 30 mm

Dummy chip

Dummy FPC

  • designed as in TDR1 to accommodate 7 x 2 chips

  • holes metalized

  • no coverlay at the bottom

  • produced by Nuova Eurotar

First version of FPC

30,1 mm

210,6 mm

3

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

1

2-5

OB Module assembly

4

3

C

A

B

A

B

A

4

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

OB Module assembly

Accuracy of chips x,y position: < 8 um (average)

Modules without carbon plate

Front view

Chip: 15 mm x 30 mm

300 um thick

Back view

2 modules already shipped to Cagliari

Modules with carbon plate

Front view

Carbon plate K13D2U 75gsm (≈ 40µ)

Thickness 0,11-0,12mm Weight 1,22g

Back view

5

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

OB Module assembly

  • Production of 10 dummy modules (without carbon plate) for development of the stave assembly procedure is on going as scheduled:

  • 4 modules already shipped to Torino

  • 6 modules completed by the end of March:64 dummy chips needed

  • Time manufacturing: 2 hours + curing time

  • Tools developed and assembly procedures: accuracy of chips x,y position < 5 um (average)

Weight 4,4 g

the pick up tool must be used for all modules handling operations

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

Ongoing activities: tools for modules prealignment and shipping

by Silvia

2

Alignment station

1

Module box

foam

dummy module

Next 6 modules will be shipped by end of March

references holes for Module box

Pins for module

pre alignment

4

3

Half stave modules

Conductive carrying case for shipping half stave modules

1

2

3

4

5

6

7

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

Ongoing activities: tools for laser soldering test

Preparation of two single chip assemblies with glue and adhesive tape in order to define the procedure for a fully equipped dummy modules to solder at CERN

1

2

Daisy chain FPC in copper

Macor grid

Mechanical screws

for chip-fpc alignment

Vacuum tool

Ball pick up tool

Quartz window

3

4

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

Ongoing activities:toolsforHIClasersolderingtest

The pre-fixed module is then placed on the tool for the laser soldering interconnections

2

1

Reference pins

3

4

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

Ongoing activities: production of the new FPC

FPC layer stack up

Cover-sheet 25 µm

Copper 50 µm

Kapton 25 µm

Copper 50 µm

FPC elaborated on the layout design for the IB module

M. Sacchetti

30,1 mm

The production of the dummy FPCs for 14 chips was commissioned to Nuova Eurotar company.

220,4 mm

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

Ongoing activities:

ball pick up tool for pALPIDE_fs chip

Third ball pick up tool designed

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

SUMMARY

  • 6 modules have been produced: 2 to develop the jig to pick up the module and 4 for development of the stave assembly procedure. Next step is to produce 6 modules by the end of March.

  • The modules prealigned will be shipped to Torino by mean an ad hoc tool which will be ready by the end of March.

  • As soon as possible the solder test with 1 chip will be done.

  • The production of the dummy FPCs for 14 chips was commissioned to Nuova Eurotar company.

  • The ball pick up tool for the pALPIDE chip will be ready by the end of March.

Cosimo Pastore, ITS-MFT mini-week, 12 March 2014


O uter b arrel h ybrid i ntegrated c ircuit

Back slide


O uter b arrel h ybrid i ntegrated c ircuit

X

i1

i1

Y

i2

i3

i1

i4

i5

i6

L

Measures in mm

CHIP 8

CHIP 1

CHIP 2

CHIP 1

CHIP 2

15


O uter b arrel h ybrid i ntegrated c ircuit

Module assembly procedure

Gluing procedure to fix the FPC on the chips

8

Adhesive mask

9

10

11


O uter b arrel h ybrid i ntegrated c ircuit

Module assembly procedure

FPC

FPC 150 µm thick

Chip 50 µm thick

Carbon plate 120 µm thick

Glue: Ecobond 40 µm thick

Modules without carbon plate

Modules with carbon plate

Does the module plate help for handling and testing?


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