1 / 17

O uter B arrel H ybrid I ntegrated C ircuit

O uter B arrel H ybrid I ntegrated C ircuit. Cosimo Pastore, ITS-MFT mini-week, 12 March 2014. OUTLINE. OB Module assembly Ongoing activities tools for: - modules pre-alignment and shipping - laser soldering test with 1 and 14 chips - pALPIDE_fs chip Summary.

lakia
Download Presentation

O uter B arrel H ybrid I ntegrated C ircuit

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Outer Barrel Hybrid Integrated Circuit Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  2. OUTLINE • OB Module assembly • Ongoing activities • tools for: • - modules pre-alignment and shipping • - laser soldering test with 1 and 14 chips • - pALPIDE_fs chip • Summary Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  3. OB Module assembly: material FPC layer stack up Cover-sheet 25 µm Copper 50 µm Kapton 25 µm Copper 50 µm 6 modules have been produced - 1 with carbon plate - 5 without carbon plate • 50 µm thick • size 15 mm x 30 mm Dummy chip Dummy FPC • designed as in TDR1 to accommodate 7 x 2 chips • holes metalized • no coverlay at the bottom • produced by Nuova Eurotar First version of FPC 30,1 mm 210,6 mm 3 Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  4. 1 2-5 OB Module assembly 4 3 C A B A B A 4 Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  5. OB Module assembly Accuracy of chips x,y position: < 8 um (average) Modules without carbon plate Front view Chip: 15 mm x 30 mm 300 um thick Back view 2 modules already shipped to Cagliari Modules with carbon plate Front view Carbon plate K13D2U 75gsm (≈ 40µ) Thickness 0,11-0,12mm Weight 1,22g Back view 5 Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  6. OB Module assembly • Production of 10 dummy modules (without carbon plate) for development of the stave assembly procedure is on going as scheduled: • 4 modules already shipped to Torino • 6 modules completed by the end of March:64 dummy chips needed • Time manufacturing: 2 hours + curing time • Tools developed and assembly procedures: accuracy of chips x,y position < 5 um (average) Weight 4,4 g the pick up tool must be used for all modules handling operations Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  7. Ongoing activities: tools for modules prealignment and shipping by Silvia 2 Alignment station 1 Module box foam dummy module Next 6 modules will be shipped by end of March references holes for Module box Pins for module pre alignment 4 3 Half stave modules Conductive carrying case for shipping half stave modules 1 2 3 4 5 6 7 Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  8. Ongoing activities: tools for laser soldering test Preparation of two single chip assemblies with glue and adhesive tape in order to define the procedure for a fully equipped dummy modules to solder at CERN 1 2 Daisy chain FPC in copper Macor grid Mechanical screws for chip-fpc alignment Vacuum tool Ball pick up tool Quartz window 3 4 Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  9. Ongoing activities:toolsforHIClasersolderingtest The pre-fixed module is then placed on the tool for the laser soldering interconnections 2 1 Reference pins 3 4 Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  10. Ongoing activities: production of the new FPC FPC layer stack up Cover-sheet 25 µm Copper 50 µm Kapton 25 µm Copper 50 µm FPC elaborated on the layout design for the IB module M. Sacchetti 30,1 mm The production of the dummy FPCs for 14 chips was commissioned to Nuova Eurotar company. 220,4 mm Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  11. Ongoing activities: ball pick up tool for pALPIDE_fs chip Third ball pick up tool designed Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  12. SUMMARY • 6 modules have been produced: 2 to develop the jig to pick up the module and 4 for development of the stave assembly procedure. Next step is to produce 6 modules by the end of March. • The modules prealigned will be shipped to Torino by mean an ad hoc tool which will be ready by the end of March. • As soon as possible the solder test with 1 chip will be done. • The production of the dummy FPCs for 14 chips was commissioned to Nuova Eurotar company. • The ball pick up tool for the pALPIDE chip will be ready by the end of March. Cosimo Pastore, ITS-MFT mini-week, 12 March 2014

  13. Back slide

  14. X i1 i1 Y i2 i3 i1 i4 i5 i6 L Measures in mm CHIP 8 CHIP 1 CHIP 2 CHIP 1 CHIP 2 15

  15. Module assembly procedure Gluing procedure to fix the FPC on the chips 8 Adhesive mask 9 10 11

  16. Module assembly procedure FPC FPC 150 µm thick Chip 50 µm thick Carbon plate 120 µm thick Glue: Ecobond 40 µm thick Modules without carbon plate Modules with carbon plate Does the module plate help for handling and testing?

More Related