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EFI Block Diagram. A High-Input Impedance Low-Noise Voltmeter in Space. sheath. sensor. preamp. Floating ground generation. BIAS. USHER. Bias channels. GUARD. VBraidCtrl. VBraid. BRAID. Vref. Top-Level Design (1). Diagram of THEMIS EFI Elements. AXB. Preamp Enclosure.

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EFI Block Diagram

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Efi block diagram

EFI Block Diagram

  • A High-Input Impedance Low-Noise Voltmeter in Space

sheath

sensor

preamp

Floating ground

generation

BIAS

USHER

Bias channels

GUARD

VBraidCtrl

VBraid

BRAID

Vref


Top level design 1

Top-Level Design (1)

  • Diagram of THEMIS EFI Elements

AXB

Preamp

Enclosure

Preamp PWB

BEB

SPB

DFB

GSE


Top level design 2

Top-Level Design (2)

  • Description of THEMIS EFI Elements

    • Three-axis E-field measurement, drawing on 30 years of mechanical and electrical design heritage at UCBSSL.

    • Closest living relatives are Cluster, Polar and FAST, with parts heritage from CRRES (mechanical systems, BEB designs, preamp designs).


Top level design 3

Top-Level Design (3)

  • Description of THEMIS EFI Elements

    • Radial booms:

      • 22-m cable length (up to 50 m tip-to-tip deployed; SPB-X to be deployed to 50 m, SPB-Y to be deployed to 40 m).

      • 8-cm dia., Ti-N-coated spherical sensor.

      • 3-m, 0.009-inch dia. fine wire to preamp enclosure.

      • SMA-actuated door release mechanism.

      • Brushed motor design.

      • Significant volume and mass relief relative to closest living relatives.

      • USHER and GUARD bias surfaces integral to preamp enclosure.

      • BRAID bias surface of 3-m length inboard of preamp (common between all 4 radial booms).

      • Sensor is grounded through 10 Mohm resistance when stowed, providing ESD protection and allowing for internal DC and AC functional tests.

      • External test/safe plug (motor,door actuator,turns click, ACTEST) to allow for deploy testing/safeing and external signal injection.


Top level design 4

Top-Level Design (4)

  • Description of THEMIS EFI Elements

    • Axial booms:

      • 2.8-m stacer with ~1-m DAG-213-coated whip stacer sensor.

      • New, fully-qualified Double DAD design based on FAST axial booms.

      • New, fully-qualified FrangiBolt deployment actuation.

      • Preamp mounted in-line, between stacer and sensor.

      • USHER and GUARD bias surfaces integral to preamp enclosure.

      • No BRAID bias surface.

      • Sensor is grounded through 7 Mohm resistance when stowed, providing ESD protection and allowing for internal DC and AC functional tests.

      • External test/safe plug (deploy actuator, ACTEST) to allow for deploy testing/safeing and external signal injection.


Top level design 5

Top-Level Design (5)

Description of THEMIS EFI Elements

  • BEB block diagram:


Top level design 6

Top-Level Design (6)

  • Description of THEMIS EFI Elements

    • BEB Signal Processing and Control Specifications:


Top level design 7

Top-Level Design (7)

Description of THEMIS EFI Elements

  • DFB functional block diagram:


Top level design 8

Top-Level Design (8)

Description of THEMIS EFI Elements

  • DFB signal flow block diagram:


Top level design 9

Top-Level Design (9)

  • Description of THEMIS EFI Elements

    • DFB Signal Processing and Control Requirements:

      • +/- 100 V analog input relative to AGND.

      • CMRR >= 80 dB on differential E-Field channels.

      • DC-coupled E-fields and sensor potential waveforms from 0-4 kHz.

      • AC-coupled E-fields from 0-6 kHz.

      • AC-coupled SCM (AC B-field) from 0-4 kHz.

      • Log(AKR POWER) from 100-500 kHz.

      • E-field and sensor potentials for on-board Spin Fit data processing.

      • Filter bank with df/f better than 25% from 8 Hz to 4 kHz.

      • On-board projection of E and dB into ExB/E.B coordinates for FFT processing (“Derived Quantities”).

      • On-board computation of FFT spectra (Standard and Derived Quantities).


Top level design 10

Top-Level Design (10)

  • Performance Specification

    • Spacecraft potential: +/- 60 V, 1.8 mV resolution, better than 46 uV/m resolution (allows ground reconstruction of E from spacecraft potential to better than 0.1 mV/m resolution).

    • DC-coupled E-field: +/- 300 mV/m, 9 uV/m resolution, 0-4 kHz.

    • AC-coupled E-field: +/- 50 mV/m, 3.0 uV/m resolution, 0-6 kHz.

    • AKR log(Power) channel: 1 uV/m to 4.5 mV/m RMS amplitude, 400-kHz bandwidth, 100-500 kHz.

    • 16-bit resolution.


Top level design 11

Top-Level Design (11)

  • Thermal Predicts:

60-min-long eclipse

180-min-long eclipse


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