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TEAM 9 - MRAV PACKAGING DESIGN

TEAM 9 - MRAV PACKAGING DESIGN. by Nick Gentry Feb-9-2011. COMMERCIAL OPTION #1. Dragonflyer X4 PROs: - Very modular and expandable - Lightweight, uses composite materials - Rigid, durable design CONs: - Expensive, > $8K. COMMERCIAL OPTION #2. Parrot AR Drone

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TEAM 9 - MRAV PACKAGING DESIGN

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  1. TEAM 9 - MRAVPACKAGING DESIGN by Nick GentryFeb-9-2011

  2. COMMERCIAL OPTION #1 Dragonflyer X4 PROs: - Very modular and expandable - Lightweight, uses composite materials - Rigid, durable design CONs: - Expensive, > $8K

  3. COMMERCIAL OPTION #2 Parrot AR Drone PROs: - Affordable, < $300USD - Lightweight - Exceptional user interface CONs: - Styrofoam prone to failure - Aerodynamics more complicated than X4

  4. MRAV Design Features: - Lightweight (aluminum and carbon fiber) ~ 120g - Very rigid (‘boxed’ tubing) - Durable - Dimensions: 50cm motor-to-motor

  5. CARBON FIBER TUBULAR ALUMINUM

  6. INTEGRATED MOTOR MOUNT

  7. Ultrasonic Sensors CMOS Camera Vacuum Molded Carbon Fiber Cover

  8. ANDROID APP – AKA BASE STATION

  9. PCB Footprint 100 mm 7 mm 16 mm 6.2 mm MSP430F-2618(64Pin - PQFP) MSP430F-5438(100Pin - PQFP) MAX232(16Pin – SOIC) 7 mm 10 mm 16mm 10.5 mm 10.1 mm RN-121G802.11 Wifi(44Pin) LM25753V Reg.(24Pin) 5 mm NOTE: Dwg. not to scale. 100 mm DS2788 Li-Po Monitor(14Pin – TSSOP) 22.6 mm 25.5 mm 4.5 mm 9 mm HMC6343Compass(32Pin – LPCC) LIS3LV02DQAccel.(28Pin - QFPN) ITG-3200 Gryo(24Pin – QFN) 9 mm 7 mm 4 mm R = 3 mm 7 mm 4 mm

  10. The END

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