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Semiconductor E&M & Manufacturing in Europe – Quo Vadis?. Georg Kelm European Commission, DG INFSO, Nanoelectronics.

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1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

Semiconductor E&M & Manufacturing in Europe – Quo Vadis?

Georg Kelm

European Commission, DG INFSO, Nanoelectronics

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

1. SC Industry -What is the Situation Now?2. Dialogue Between Industry and Policy3. What Can and Will Policy Do?After Lisbon: EU2020 and Digital Agenda5. SC E&M & Manufacturing in Current R&D Programmes 6. Last WordsDisclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission

Outline

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

Pessimists (realists?) say:- European semiconductor manufacturing capacity dropped 25% from 2005-2008- 95% of global investments in semiconductor manufacturing now outside EuropeWhy?- Unfair competition for European semiconductor ecosystemBut:- Is this the main reason why Qimonda went bankrupt?- Why is R&D efficiency so much lower than in the US?- Also: there are still investments–e.g. Crolles or Dresden

What is the Situation in Europe now?

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

Optimists (idealists?) say:-We still have IDMs, more foundries, world leading institutes, well developed E&M industry in selected areas-Imposed paradigm shift has advantages:Why?Healthier mix MM and MtM, better use of technologyShift to MtM: emphasis of European strengths But:- Existing base needs support, private and public- Triangle of Education-R&D-Innovation decisive - Synergy of policies mandatory, national and EU

What is the Situation in Europe now?

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

Past 5 years–intensive interaction between Industry, Research and EC:-e.g.ESIA reports and TF, SEMI White Paper issuedCommon understanding at all levels:-No Knowledge Society w/o R&D and Innovation- Semiconductor devices are a driving force for innovation in Europe's key industries- SC technology addresses societal issues as climate change, renewable energy, security or health careActions at European level – Result of Dialogue:- 2008: Strategic Initiatives Eniac and Artemis launched- 2009: Communication on Key Enabling Technologies- 2009: European 450 mm E&M initiative (EEMI450)

Dialogue

EU2020 and Digital Agenda

Intel Supplier Forum, IMEC Sept 2010


Eniac joint undertaking as public private partnership

e-Society

Communication

Energy & Environment

Security & Safety

Transport & Mobility

Health & Wellness

7. Design Methods & Tools

8. Equipment & Materials

ENIAC Joint Undertaking as Public-Private Partnership

Executive Dir. and secretariat

Industry and R&D actors

Commission and Public Authorities

Intel Supplier Forum, IMEC Sept 2010


Identified key enabling technologies ket

Identified Key Enabling Technologies (KET)

Nanotechnologyholds the promise of leading to – among others - the development of smart nano and micro devices and systems;

Micro- and Nanoelectronics, including semiconductors, are essential for all goods and services which need intelligence and functionality;

Photonicsprovides the technological basis for the conversion of sunlight to electricity which is important for the production of renewable energy and for a variety of electronic components and equipment such as photodiodes,

LEDs and lasers.

Advanced Materialssuch as lightweight materials facilitate lowering the carbon footprint and energy demand as well as limiting the need for raw materials;

Biotechnologybrings cleaner and sustainable process alternatives for industrial and agrifood operations

Intel Supplier Forum, IMEC Sept 2010


Eemi450 initiative long term objectives

EEMI450 Initiative: Long-term Objectives

  • To improve the competitiveness of the European semiconductor E&M industry, increase their chances to be selected by the tier 1 semiconductor companies in their future 450mm operations.

  • To stimulate a European infrastructure that is leading in 450mm E&M development and as a result will induce tier 1 companies to cooperation programs and possibly to equip 450mm fabs in Europe.

Intel Supplier Forum, IMEC Sept 2010


Eemi450 project

EEMI450 Project

  • The EEMI450 ENIAC project represents the start of 450mm E&M efforts in Europe

  • The project has 26 participants out of 7 countries: Austria, Belgium, France, Germany, Hungary, Ireland, Netherlands

    and United Kingdom

  • The project targets 450mm proof-of-concept of wafer manufacturing, waferhandling plus automation, process plus litho modules and metrology

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

1. SC Industry -What is the Situation Now?2. Dialogue Between Industry and Policy3. What Can and Will Policy Do?After Lisbon: EU2020 and Digital Agenda5. SC E&M & Manufacturing in Current R&D Programmes 6. Last WordsDisclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission

Outline

Intel Supplier Forum, IMEC Sept 2010


Lessons from lisbon strategy

Lessons from Lisbon Strategy

Strong convergence on direction of reforms ...

- Concrete results before crisis - employment grew moderately

- « Lisbonisation » of structural funds

... But a delivery gap has built up:

- Uneven progress between Member States

- Key targets - R&D + employment - not reached

- Lack of ownership; weak communication

- Regions not sufficiently involved

-Too EU-inward looking

  • UPDATE VISION TO POST-CRISIS WORLD

  • IMPROVE DELIVERY

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

From 10 years Lisbon Strategy to EUROPE 2020

  • UPDATE VISION TO POST-CRISIS WORLD

  • IMPROVE DELIVERY

3 priorities:

• Smart Growth:knowledge and innovation economy

• Sustainable growth:greener and competitive economy

• Inclusive growth:high employment, knowledge

people and social and territorial cohesion

EUROPE 2020: A EU strategy for smart, sustainable and inclusive growth

5 EU Targets – translated into national ones

7 Flagship initiatives – EU & national action

COMMUNICATION FROM THE COMMISSION COM(2010) 2020 http://ec.europa.eu/eu2020/pdf/COMPLET%20EN%20BARROSO%20%20%20007%20-%20Europe%202020%20-%20EN%20version.pdf

Intel Supplier Forum, IMEC Sept 2010


Europe 2020 five eu headline targets

Europe 2020: Five EU Headline Targets

By 2020:

75 % (now 69) employment rate (% of population aged 20-64 years)

3% (now 1,8%) Investment in R&D (% of EU’s GDP)

“20/20/20” climate/energy targets met (incl. 30% emissions reduction if conditions are right)

< 10% (now 15) early school leavers & min. 40% (now 31) hold tertiary degree

20 million less people (now 80) should be atrisk of poverty

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

And the Private Sector?

Private expenditure on all R&D as % of GDP – average annual growth 2000-2007

(source: EC, DG Entr)

Intel Supplier Forum, IMEC Sept 2010


Europe 2020 7 flagship initiatives underpin the targets

Europe 2020: 7 Flagship Initiatives underpin the Targets

Intel Supplier Forum, IMEC Sept 2010


Europe 2020 role of cohesion policy

Europe 2020: Role of Cohesion Policy

Cohesion Policy is largest source of multi-sector EU funding - much larger than R&D budget: Use it also for R&D&I objectives

Need to demonstrate that EU instruments work together, not against each other

Europe cannot achieve ‘2020’ goals unless regions achieve them

Intel Supplier Forum, IMEC Sept 2010


Digital agenda for europe

Digital Agenda for Europe

Fast Internet

Digital Single Market

Digital Citizenship

ICT Research and Innovationneed greater priority

Trust & Security

Interoperability

Intel Supplier Forum, IMEC Sept 2010


Key enabling technologies kets

Driving force of the development of future goods and services

Being at the forefront of competitiveness, innovation, knowledge-based economy

Modernisation of the industrial base and in the further strengthening of the research base

Creating related eco-systems of SMEs.

Knowledge intensive (high R&D and capital expenditure)

Associated with highly-skilled employment

Multi-disciplinary, cutting across many technology areas, converging

Create multiplier effects

Enabling process, good and service innovation and are of systemic relevance.

Key Enabling Technologies (KETs)

Importance of KETs

Defining KETs

Source: European Commission

Intel Supplier Forum, IMEC Sept 2010


The way forward support of key enabling technologies

The Way Forward-Support of Key Enabling Technologies-

Short Term

Shared long term vision

  • Better application of existing state aid rules

  • Trade: Ensure level playing field

  • Improve access to finance

  • Reinforce existing initiatives on KETs & link KETs with EU2020

  • Need to create a shared long term vision and partnership between Commission and Member states and industry and Key stakeholders.

  • Invite Member States to agree on importance of KETs and support the orientation included in the Communication.

Long Term

  • Establish a high level expert group (HLG)

    • - Assess competitiveness situation

    • of KETs focusing on deployment

    • - Analyse R&D capacity

      - Policy recommendations

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

R&D is the basic element for the Innovation process

R&D is an integral part of high end manufacturing

Investor’s decision for a production site is influenced by comparison of incentives on a global scale

Riskof losing the production lines AND also the R&D

Conclusions:

1. Where Europe Invested in R&D, State Aid Should be Allowed for Subsequent Investments

2. European Clusters show:

Win-Win Possible for Industry and Society

State Aid for Large Investments –

An Element for the Post-Lisbon Process?

Intel Supplier Forum, IMEC Sept 2010


The supply chain today

The Supply Chain Today

Data Processing

Communications

Industrial and Medical

Consumer

Automotive

Military, Civil Aerospace, Security

Intel Supplier Forum, IMEC Sept 2010


Equipment and material suppliers

Equipment and Material suppliers

Few specialized

players

80% of the Equipment Suppliers are SMEs

Semiconductor equipment sales by region

  • ***: various European players well positioned

  • **: 1 or 2 major European players and several small

  • *: very few European players

    Source: Datamonitor, Global SC Equipment, March ‘09

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

1. SC Industry -What is the Situation Now?2. Dialogue Between Industry and Policy3. What Can and Will Policy Do?After Lisbon: EU2020 and Digital Agenda5. SC E&M & Manufacturing in Current R&D Programmes 6. Last WordsDisclaimer: Views expressed in this presentation are not necessarily stating an official position of the European Commission

Outline

Intel Supplier Forum, IMEC Sept 2010


Fp7 nanoelectronics e m and manufacturing targets 2007 10

FP7 Nanoelectronics E&M and Manufacturing Targets 2007-10

  • New semiconductor manufacturing approaches, processes and tools

  • Joint assessments of novel process/metrology equipment and materials

  • Supporting 200/300mm wafer integration platforms

  • Preparatory work for 450mm wafer processing

Funding schemes:

STREPs

IP

Intel Supplier Forum, IMEC Sept 2010


Thematic coverage fp7 r d nanoelectronics 2007 10

Thematic Coverage FP7 R&D Nanoelectronics 2007-10

Design

Funding:34 M€

23 %

Processes

Funding: 35 M€

24 %

Devices

Funding: 35M€

24 %

E&M and Mfg

(incl. Europractice)

Funding:35 M€

21 %

Intel Supplier Forum, IMEC Sept 2010


Project seal sea leveraging innovation

Project SEAL: SEA-Leveraging Innovation

Users:

Global Foundries, Infineon, Intel, LFoundry, MEMC, Numonyx, Siltronic, Soitec, STMicroelectronics Crolles

Equipment Suppliers:

Hamatech, Alcatel Vacuum, Jenoptik Automatisierungs-technik, SUSS MicroOptics, Reinhardt Microtech, SUSS Microtech Lithography, MAPPER, Toppan Photomasks, HQ-Dielectrics, SUSS Microtec, Ion Beam Services,

Lam Research, Nanda, Semilab, Fries R&T, Applied Materials, Integrated Circuit Testing, Oxford Instruments, Metryx, PVA TePla, KLA-Tencor, ProTec

Research Institutes:

CEA/LETI, Fraunhofer IISB, imec, UALB, ICN, FHWN

Budget/Funding:

14,3 Mio EUR / 9,1 Mio EUR

Duration:June 2010 – May 2013

35% of suppliers are SMEs

Intel Supplier Forum, IMEC Sept 2010


Sp8 plasma trans plasma immersion ii tool for defect engineering cmos imager application

SP8-PLASMA-TRANS -Plasma Immersion II Tool for Defect Engineering & CMOS imager application

  • Short description:

  • Extension of application field by tool modification (process control, pressure, temperature)

  • Assessment of modified tool

  • Advances proposed Plasma Immersion Ion Implant

  • Adaptation and evaluation of the IBS PULSION platform for defect engineering/gettering

  • Application to:

    • CMOS imagers

    • trench doping

    • shallow trench isolation (STI)

    • deep trench doping for power applications

    • shallow junctions with low thermal budget activation for backside doping.

  • Modifications for improved throughput

PULSION-nano® tool installed in LETI

Partners: Ion Beam Services, CEA/LETI, STMicroelectronics Crolles

Coordinator: Frank TORREGROSA/ IBS

Duration: 24 Months

Intel Supplier Forum, IMEC Sept 2010


Sp15 m4 more mass metrology for monitoring

SP15 - M4More Mass Metrology for Monitoring

  • Short description:

  • Assessment of fab ready 300mm tool for mass metrology

  • Evaluation of new applications like Ion Implantation, Gate Stack, barrier seed layers for BEoL and 3D integration

  • Advances proposed in M4

  • Assessment of the next generation of mass metrology tools incorporating a high-resolution mass metrology measurement module

  • Resolution improvement of a factor of 100 to 0.1 micrograms, and a repeatability improvement of a factor of 10 to 8 micrograms.

  • Allow the introduction of mass metrology into new applications, structures and materials being introduced at the 22nm dimension.

  • The advanced modular construction of the tool will also provide the capability of adding multiple mass modules with mixed measurement capability, an extendable platform to cope with ever increasing volumes, and the capability of mixed technologies for custom metrology solutions

Partners: Metryx, Intel, imec

Coordinator:Mark Berry / Metryx

Duration: 30 Months

Intel Supplier Forum, IMEC Sept 2010


Magic the european initiative on multibeam lithography

Project leader

(1)

(2)

(3)

DP

EBPC

&

PI

&

Tool

Tool

devlpt

devlpt

simulation

Technology

assessment

FHV

FUJI

MAGIC: The European Initiative on Multibeam Lithography

  • Push the insertion of ML2 technology for semiconductor manufacturing

    • Demonstrate technology interest and capability

      • Resolution

      • Throughput

    • Develop first 300mm multi beam platforms

  • Build infrastructure for a fast and secure start-up

    • Fields of development : process, data preparation, proximity effect controls…

    • Highlight CMOS process integration compatibility

Intel Supplier Forum, IMEC Sept 2010


High energy multibeam demonstration capability

32nm hp

25nm hp SRAM test case

High energy multibeam demonstration capability

programmableAperturePlateSystem(APS)

  • Project driver : IMS Nanofabrication (Vienna)

  • Throughput potential

    • Multi axis : 76 columns

      • Each beam covering 1 die area

      • 256k beam per axis – 1µA per axis

    • 5-6wph per exposure module

Intel Supplier Forum, IMEC Sept 2010


Low energy multibeam demonstration capability

32nm hp resolution

40nm hp Contact hole

HSQ

CD=26nm-D=673µC/cm²

Positive CAR

CD=37nm -D=42µC/cm²

Positive CAR

CD=40nm-D=200µC/cm²

Low energy multibeam demonstration capability

  • Project driver : MAPPER Lithography (Netherlands)

  • Throughput potential

    • 10wph per module

      • 1 module : 1m²

      • 13000 beams per module

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

One of the Challenges: Integration on Silicon and the heteroepitaxy problem

DUALLOGIC approach: Use standard Si STI

Compatibility with standard CMOS cost effectiveness IP re-use

Ge in Si STI

IMEC results in DUALLOGIC: G. Wang et al., APL 96, 111903 (2010)

Problem :

Narrow trenches !

InP buffer in Si STI

IMEC results in DUALLOGIC : G.Wang et al., ECS Trans. 27, p. 959 (2009)

200 nm

150 nm

110 nm

InGaAs channel will be grown

here

InP

Aixtron as equipment partner!

STI

Si

Intel Supplier Forum, IMEC Sept 2010


Fab of the future fof smart factories 2009

Smart Factories

ICT

VirtualFactories

DigitalFactories

Fab of the Future (FoF)Smart Factories - 2009

“Smart Factories” expected impact:

  • Higher level of intelligence & environmental consciousness on the shop floor

  • Introduction of advanced automation into mainstream manufacturing

  • Higher productivity of customised manufacturing paired with reduced emissions & waste

More to come in 2011, 2012, 2013

Intel Supplier Forum, IMEC Sept 2010


Thematic coverage fof smart factories 2009

Thematic Coverage FoF - Smart Factories 2009 -

Energy & Mat

Monitoring

Integrated Process

Automation

Laser Applications in Mfg

Robotics Enabled

Mfg.

Result: 8 proposals with 35 M€ funding

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

Very Advanced NanoE Components 2011-12

Topics and Targets:

  • - Very advanced Si and non-Si switches, memories and interconnects (perf/ee)

  • - Co-integration of non-Si, charge, spin, photon based devices on Si

  • - Combined modelling, technology+ design work at circuit, device, material level for monolith and 3D integr of BeyondC+very adv. MtM on Si backbone

  • - Mfg solutions for integration/interfacing of Beyond CMOS+MtM with NanoCMOS

  • - E&M solutions to manufacture and measure 1D + 3D Si, including E&M assessment

  • - CSAs to support 450 mm cordination, develop strategies, attract young ones and link up globally to support IP creation and manufacture in Europe

201160M€STREPs, IPs, CSAs

Intel Supplier Forum, IMEC Sept 2010


Eniac themes covered 1st call 2008

ENIACThemes covered - 1st call - 2008

Proposals selected for funding (EC + MS)per sub-programme

Transport and Mobility

Energy and Environment

33 M€

10 M€

E3Car

SE2A

SmartPM

Electric car

Car safety & efficiency

Power management

E&M and Manufacturing

Design Methods and Tools

JEMSIP_3D

LENS

MODERN

Heterogeneity

Lithography

Reliability

NEPTUNE

IMPROVE

12 M€

43 M€

Heterogeneity

Productivity

Intel Supplier Forum, IMEC Sept 2010


Eniac themes covered 2nd call 2009

ENIACThemes covered - 2nd call - 2009

Proposals selected for funding (EC + MS) per sub-programme

16 M€

33 M€

8.5 M€

11.6 M€

Communications

Health and Wellness

Security and Safety

Energy & eSociety

MAS

CAJAL4EU

MIRANDELA

SMART

CSSL

Remote monitoring & therapy

CSI

Biosensors for diagnostics

mm-wave & RF integration

Solid state lighting

Secure storage

3D imaging

E&M and Manufacturing

MERCURE

Design Methods and Tools

Wide bandgap & RF MEMS

Last Power

EEMI 450

ESiP

END

Wide bandgap materials

450mm preparation

Multi-chip integration

Energy-aware design

31 M€

6.3 M€

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

Eniac - Annual WP 2010

Target R&D Activities E&M + Manufg:

  • - EUV sub-22 + complementary 1x nm patterning

  • - 450 mm supply chain

  • - Metrology Innovation

  • - Green & flexible Manufacturing

  • - Photomask innovation

  • - 3D IC Manufacturing

  • - Disruptive BEOL Technology + WL-Packaging

  • - Large Area Organic Substrates

    Call 3: Projects being selected at present !

201025-30 M€3 year projects

Intel Supplier Forum, IMEC Sept 2010


Nanoe e m and mfg in fp and eniac 2007 10

NanoE E&M and Mfg in FP and Eniac2007-10

First half of FP7 (2007-10):

  • More than 50 different European SC E&M suppliers participating in R&D and assessment projects, more than 40% of them being SMEs

  • More than 150 M€ invested in SC E&M and Mfg

    Second half of FP7 (2011-13):

  • R&D funding will increase by 30%.

Intel Supplier Forum, IMEC Sept 2010


Last words

Last Words

New European Commission with Emphasis on R&D&I –

basis for sustainable growth in Knowledge Society

The European R&D&I Programmes are investing in key

technologies as nanoE - a basis for innovation and growth

In the long run no SC ecosystem w/o SC E&M & Mfg

Opportunity if:

The Europeans keep IP and silicon together

Industry sees recent paradigm shifts as a chance not a threat

Policy and industry adapt a holistic approach to face global

challenges

It Seems There is a Common Will

to Act Jointly!

Intel Supplier Forum, IMEC Sept 2010


1 sc industry what is the situation now 2 dialogue between industry and policy 3 what can and will policy do afte

THANK YOU

[email protected]

Intel Supplier Forum, IMEC Sept 2010


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