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Track Trigger Meeting 3/ 23/10

Track Trigger Meeting 3/ 23/10. Chip Schedule: 2D wafers complete fab ~ April 30 – available for single –tier functional testing 3D wafers complete fab ~ May 28

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Track Trigger Meeting 3/ 23/10

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  1. Track Trigger Meeting 3/23/10 • Chip Schedule: • 2D wafers complete fab~ April 30 – available for single –tier functional testing • 3D wafers complete fab ~ May 28 • Diced parts and full wafers June – Sent to Ziptronix for oxide bonding of a handle wafer, then back to Tezzaron for exposure of bottom TSVs. • Sensor wafers available early July • Topography and flatness checked at Ziptronix • Backside protection • Test of topside tungsten deposition and CMP • Phone conference next week with Ziptronix to discuss plans • Volunteers for chip testing work?

  2. VICTR Chip Can be used to estimate areas needed on final chip Long Strip Tier Short Strip Tier

  3. Pad Structure

  4. Kapton-based Interposer • A preliminary project description has been written and sent to one vendor • The goals include: • Develop a low-mass layup which is sufficiently planar (<100 microns bow) to allow bump bonding on both sides over the full area. • Minimum mass, either using low mass materials or by removing unneeded material. • Contains embedded capacitance. • Provides a flex circuit “tail” for connection to optical drivers about 5 cm away. • Provides through vias to measure load capacitance and crosstalk. Approach Endicott, CompuneticsCyrexx

  5. Interposer Strategy • Development of a full-size technology demonstration board which would be used for mounting dummy chips and developing bump-bonding techniques. This board would provide a platform to demonstrate a low-mass interposer with the appropriate interconnectivity. • We probably need to develop a full candidate layout of either a full or VICTR 2 interposer including bussing for vendors • Guess at pinout and numbers of bus lines • Production of a direct interconnection interposer for the VIP-1 chip. • Production of a direct interconnection interposer for the VIP-2 chip. • Final product – full sized fully functional

  6. Proposed On-chip Logic Diagram

  7. Proposal for VICTR II

  8. 2nd Submission Plan Dec 2010 ?

  9. Meetings • Upgrade Week (April 26-30) Presentations • Simulation • Mass Budget • Module Design • Interposer? • Trigger Architecture • Mechanics and cooling • US CMS (May 6-8) • Workshop in Elba (May 24-28) – detailed discussions of CMS upgrade plans in light of revised machine plans. • Address issues and objections: • Detector mass • Yield and chip size • Functionality • Increase breadth of the collaboration

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