Lab measurement results on izm thin assemblies
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Lab-measurement results on IZM thin assemblies. Mathieu Benoit . Outline. Assembly process Methodology Results . Sensor production and procurement : Bumping at IZM. Micron Sensor Wafer were sent to IZM for Under-Bump Metallization and assembly to Timepix and Medipix3RX ASIC

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Lab-measurement results on IZM thin assemblies

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Lab measurement results on izm thin assemblies

Lab-measurement results on IZM thin assemblies

Mathieu Benoit


Outline

Outline

  • Assembly process

  • Methodology

  • Results


Sensor production and procurement bumping at izm

Sensor production and procurement: Bumpingat IZM

  • Micron Sensor Wafer were sent to IZM for Under-Bump Metallization and assembly to Timepix and Medipix3RX ASIC

  • 10 Sensor wafers processed by IZM

    • Thickness: 100,150,200,300,650,1500 um

    • wafer <= 200 um thickness attached to handle wafer for processing

100um-on-100um assembly


Methodology

Methodology

  • After wire-bonding, chip is powered, sensor biased at 40V

  • Chip threshold equalization is performed twice, mask pattern is written to disk

    • First equalisation lead to weird masked pixel pattern (checkboard)

    • Second equalization works usually fine

  • An image of a Sr90 source is taken with Exposure time of 30s (every pixel should see some energy deposition)

  • A simple algorithm count how many pixel see no or too little signal (<20% of neighbors) and compare to mask


C03 w0126 100 on 100um masked pixels

C03-W0126 (100-on-100um) Masked pixels


C03 w0126 100 on 100um sr90 30s exposure

C03-W0126 (100-on-100um) Sr90, 30s Exposure

229 masked pixel in C03-W0126

35567 pixel with no Sr90 in C03-W0126


J08 w0126 100 on 100um masked pixels

J08-W0126 (100-on-100um) Masked pixels


J08 w0126 100 on 100um sr90 30s exposure

J08-W0126 (100-on-100um) Sr90, 30s Exposure

56 masked pixel in J08-W0126

56 pixel with no Sr90 in J08-W0126


J10 w0126 100 on 100um masked pixels

J10-W0126 (100-on-100um) Masked pixels


J10 w0126 100 on 100um sr90 30s exposure

J10-W0126 (100-on-100um) Sr90, 30s Exposure

190 masked pixel in J10-W0126

195 pixel with no Sr90 in J10-W0126


K04 w0126 100 on 100um masked pixels

K04-W0126 (100-on-100um) Masked pixels


K04 w0126 100 on 100um sr90 30s exposure

K04-W0126 (100-on-100um) Sr90, 30s Exposure

52 masked pixel in K04-W0126

52 pixel with no Sr90 in K04-W0126


K05 w0126 100 on 100um masked pixels

K05-W0126 (100-on-100um) Masked pixels


K05 w0126 100 on 100um sr90 30s exposure

K05-W0126 (100-on-100um) Sr90, 30s Exposure

28 masked pixel in K05-W0126

39 pixel with no Sr90 in K05-W0126


K06 w0126 100 on 100um masked pixels

K06-W0126 (100-on-100um) Masked pixels


K06 w0126 100 on 100um sr90 30s exposure

K06-W0126 (100-on-100um) Sr90, 30s Exposure

31 masked pixel in K06-W0126

31 pixel with no Sr90 in K06-W0126


Conclusion

Conclusion

  • New assemblies show pretty good yield for the bumping of 100um ASIC to 100um Sensors (5/6 perfect sensors)

  • Only one assembly with a catastrophic failure, plan to send it back to IZM for further X-Ray study, chip was fine before wire-bonding

    • Ian mention that assemblies were quite fragile

    • Maybe lift-off occurred during wire-bonding process

  • 4 more assemblies with 150um n-in-p on 100um currently at the bonding lab

This is now our thinnest full functional module we ever did using this technology.I forwarded this results immediately to all colleagues involved in this task.

Thomas Fritzsch, IZM


Lab measurement results on izm thin assemblies

Unconnected pixels

Hitmap, 100 on 100 um Assemblies


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