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IBL Spare Slides. Commissione I – 22 Nov 2010 G. Darbo - INFN / Genova. IBL Detector. Material from Raphael/Neal. The Insertable B-Layer (IBL) is a fourth layer added to the present Pixel detector between a new beam pipe and the current inner Pixel layer (B-layer). PP1 Collar.

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Ibl spare slides

IBL Spare Slides

Commissione I – 22 Nov 2010

G. Darbo - INFN / Genova


Ibl detector

IBL Detector

  • Material from Raphael/Neal

  • The Insertable B-Layer (IBL) is a fourth layer added to the present Pixel detector between a new beam pipe and the current inner Pixel layer (B-layer).

PP1 Collar

Sealing service ring

Alignment wires

IBL key Specs/ Params

  • 14 staves, <R> = 33.25 mm

  • CO2 cooling, T < -15ºC @ 0.2 W/cm2

  • X/X0 < 1.5 % (B-layer is 2.7 %)

  • 50 µmx 250 µm pixels

  • 1.8º overlap in ϕ, <2% gaps in Z

  • 32/16 single/double FE-I4 modules per stave

  • Radiation tolerance 5x1015 neq/cm2

IST

IBL Support Tube

IBL Staves


History of ibl project time line

History of IBL Project - Time Line

  • 1998: Pixel TDR

    • B-layer designed to be substituted every 3 years of nominal LHC (300 fb-1): due to then available radiation hard sensor and electronic technologies.

  • 2002: B-layer replacement

    • became part of ATLAS planning and was put into the M&O budget to RRB.

  • 2008: B-layer taskforce

    • B-layer replacement cannot be done – Engineering changes to fulfil delayed on-detector electronics (FE-I3, MCC) made it impossible even in a long shut down.

    • Best (only viable) solution: “make a new smaller radius B-layer insertion using technology being developed for HL-LHC prototypes”. This became the IBL.

  • 2009: ATLAS started IBL project:

    • February: endorsed IBL PL and TC

    • April: IBL organization in place (Endorsed by the ATLAS EB)

  • 2010: TDR and interim-MoU

    • TDR is under approval in ATLAS

    • Interim-MoU is collecting last signatures.


Wgs pixel liaison tasks

WGs, Pixel Liaison & Tasks

  • IBL Management Board (MB)

  • Membership:

  • IBL PL + IBL TC

  • Coordinators of WG

  • Pixel / IBL Liaison

  • Ex-officio

  • PIXEL / IBL “LIAISON”

  • Common Pixel / IBL Membership:

  • Offline Software: A. Andreazza (untill 9/2010)

  • DAQ: P. Morettini

  • DCS: S. Kersten

  • Module WG

  • (WG1)

  • M. Garcia-Sciveres

  • F. Hügging

  • Stave WG

  • (WG2)

  • E. Vigeolas

  • O. Rohne

  • Integration & Installation WG

  • (WG3)

  • F. Cadoux

  • R. Vuillermet

  • Off-detector

  • (WG4)

  • T. Flick

  • S. Débieux

TASK

WG

Module

Responsible

Description


Management board mb

Management Board (MB)

  • MB ad-interim membership

  • IBL Project Leader: G. Darbo

  • IBL Technical Coordinator: H. Pernegger

  • “Module” WG: F. Hügging & M. Garcia-Sciveres

  • “Stave” WG: O. Rohne + E. Vigeolas

  • “Integration & Installation” WG: F. Cadoux + R. Vuillermet

  • “Off-detector” WG: T. Flick + S. Débieux

  • “Extra” members:

  • IBL/Pixel “liaison”:

  • Off-line SW: A. Andreazza, DAQ: P. Morettini, DCS: S. Kersten

  • Ex officio:

  • Upgrade Coordinator (N. Hessey), PO Chair (M. Nessi), Pixel PL (B. Di Girolamo), ID PL (P. Wells), IB Chair (C. Gößling)

  • IBL Management Board (MB)

  • Membership:

  • IBL PL + IBL TC

  • 2 cordinators from each WG

  • Plus “extra” members

  • Module WG

  • (2 cordinators)

  • FE-I4

  • Sensors

  • Bump-Bonding

  • Modules

  • Procurement & QC

  • Irradiation & Test Beam

  • Stave WG

  • (1 Phys + 1 Eng.)

  • Staves

  • Cooling Design & Stave TM

  • HDI (Flex Hybrid)

  • Internal services

  • Loaded stave

  • Procurement & QC

  • Integration & Installation WG

  • (2 Eng.)

  • Stave Integration

  • Global Supports

  • BP procurement

  • Ext. services inst.

  • BP extraction

  • IBL+BP Installation

  • Cooling Plant

  • Off-detector

  • (1 Phys + 1 E.Eng.)

  • BOC/ROD

  • Power chain & PP2

  • DCS & interlocks

  • Opto-link

  • Ext. serv .design/proc.

  • Procurement & QC

  • System Test


Interim mou institutions

Interim-MoU - Institutions

  • 43 institutions in the IBL project

    • Large interest for the sensor (22 Institutions)

  • 300 people have expressed their interest to contribute to the project

    • The list of names is in Ch.11 of IBL TDR


Money matrix a 4

Money Matrix (A.4)

  • Unknown covers the previously assigned contribution to UK. UK cannot commit until sensor decision,

  • The Annex 4 has been changed in the technology option with the addition of is Munich MPI (D-MPG) – 12 kCH for the IZM order.


Institutes and contributions to ibl

Institutes and Contributions to IBL

Technology options refer to supplementary costs that are sensor technology specific and will be known before the definite MoU takes effect.

42 Institutes in the interim-MoU (few others are “observers” ).

14 Countries + CERN

9.7 MCH total project cost

Note: the numbers in the table "are not final, nor are the suggested financial contributions yet firm, but are meant for a common overall discussion.”


Money matrix a 4 ext

Money Matrix (A.4 ext)


Annex 5 ibl payment profile

Annex 5: IBL Payment Profile

  • Funding profile follows schedule for “ready to installation by end of 2014”

    • 2010 Expenditures: in large fraction for prototyping of FE-I4, sensors, modules, staves…

    • Two common contracts and several prototype costs already done in the framework of the interim-MoU.


Institutes a 3

Institutes (A.3)


Ibl tdr endorsed by cb lhcc

IBL TDR – Endorsed by CB, LHCC

  • IBL TDR endorsed by ATLAS Collaboration Board (8/10/2010):

    • CERN-LHCC-2010-13, ATLAS TDR 19

  • In printing 200 copies

  • Editorial team:

    M. Capeans (technical editor), G. Darbo, K. Einsweiller, M. Elsing, T. Flick,M. Garcia-Sciveres, C. Gemme,H. Pernegger, O. Rohne and R. Vuillermet.

  • IBL TDR presented to LHCC 21/9/2010:

    http://indico.cern.ch/conferenceDisplay.py?confId=107477

    • The project has received very positive comments and TDR was considered a solid documents.

    • We expect some feedback from the reviewers (hope towards a formal approval) by end of the year/beginning of next year


  • Ibl tdr in atlas e news

    IBL TDR in ATLAS e-News

    • http://atlas-service-enews.web.cern.ch/atlas-service-enews/2010/news_10/news_Insertable%20B-layer.php


    Physics performance

    Physics Performance

    2 jets of 500 GeV event with 2 x 1034 pile-up

    Sound TDR section on Physics and Performance:

    • Pixel / IBL software Group – Coordinated by Attilio

    • Boosted in the last 3 months by the P & P TF – Chaired by Markus

    • Need to channel again the efforts in the Pixel / IBL Offline Software!

    Same event w/o pile-up

    IBL


    Physics performance1

    Physics Performance

    b-tagging with pile-up

    2 jets of 500 GeV event with 2 x 1034 pile-up

    • b-tagging performance crucial for:

      • New Physics (3rd generation !)

      • observation of H → bb through boosted WH production

    • Main conclusions of IBL performance Task Force:

      • performance at 2x1034 with IBL is equal to or better than present ATLAS without pile-up

      • w/o IBL and 10% B-layer inefficiency: b-tagging ~ 3 times worse at 2x1034 than today

    Same event w/o pile-up

    IBL Physics & Performance Task Force – M. Elsing et al.

    IBL

    b-tagging with pile-up & inefficiencies


    The new front end chip fe i4

    The New Front-end Chip (FE-I4)

    60 KGD / Wafer

    20.2 mm

    • Reason for a new front-end chip

      • Increased radiation hard (> 250 Mrad)

      • New architecture to reduce inefficiencies (L=2x1034): faster shaping; not move hits from pixel until LVL1 trigger.

      • Smaller pixel size 50 x 250 µm2 (achieved by 0.13 µm CMOS with 8 metals)

      • Larger fraction of footprint devoted to pixel array (~90%) – little space for IBL envelope.

    • FE-I4 submitted on July 1st

      • More than 2 years of engineering work for a team of >15 Engineers/physicist

      • Largest HEP chip ever! 20.2x19.0 mm2, 87 million transistors!

      • 60 Known Good Dies (KGD) / 8” wafer.

      • 16 wafer engineering run – 3 received and under test.

    • Money contributions collected following interim-MoU share.

      • Engineering run cost > 500kCH

    160

    336 rows

    FE-I3

    (Pixel)

    FE-I4

    (IBL)

    18

    19 mm

    80 columns


    Fe i4 wafer received

    FE-I4 Wafer Received!

    FE-I4 Production

    • 3 wafers received 27/9

    • 7 more expected early december

    • 6 more held back

      One wafer partially diced

    • 6 chips put on boards

    • All works!

      One wafer under probed

    • 41/60 are good!

    FE-I4 8” wafer - 60 KGD / Wafer

    FE-I4 die

    ~2x2 cm2


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