The origami chip on sensor concept for low mass readout of double sided silicon detectors
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The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors. M.Friedl, C.Irmler, M.Pernicka HEPHY Vienna. Motivation: Belle. Belle Silicon Vertex Detector (SVD2) 4 layers, total of 246 double-sided silicon detectors (DSSDs) 17°…150° polar angle coverage

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The origami chip on sensor concept for low mass readout of double sided silicon detectors

The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors

M.Friedl, C.Irmler, M.Pernicka

HEPHY Vienna


Motivation belle
Motivation: Belle

  • Belle Silicon Vertex Detector (SVD2)

    • 4 layers, total of 246 double-sided silicon detectors (DSSDs)

    • 17°…150° polar angle coverage

    • Slow readout: ~800ns peaking time

  • Low energy machine: Material budget is extremely important!

Markus Friedl (HEPHY Vienna)


Superkek b upgrade
SuperKEK-B Upgrade

  • Planned for 2009-2012

    • Ultimately 30-fold increase in luminosity and trigger rate

  • SVD2 Limitations:

    • Occupancy (currently ~10% in innermost layer)  need faster shaping

    • Dead time (currently few percent)  need faster readout and pipeline

  • APV25 readout chip would fit the needs

  • Requirements similar to ILC

SVD2 occupancy vs. layer

Markus Friedl (HEPHY Vienna)


Apv25
APV25

  • Developed for CMS by IC London and RAL

  • 40 MHz clock

  • 128 channels

  • 192 cells deep analog pipeline

  • 50 ns (adjustable) shaping time

  • 0.25 µm CMOS process (>100 MRad tolerant)

  • Low noise: 250 e + 36 e/pF

  • Multi-peak mode (read out several samples along shaping curve)

Markus Friedl (HEPHY Vienna)


Shaping time and occupancy
Shaping Time and Occupancy

}

BEAM

PARTICLE

}

OFF-TIMEBACKGROUND

PARTICLE

Markus Friedl (HEPHY Vienna)


Shaping time and noise
Shaping Time and Noise

  • Unfortunately, short shaping time inherently implies larger noise

  • Applies to both constant term and slope

    • VA1TA (Tp=800ns): ENC = 180 e + 7.5 e/pF

    • APV25 (Tp=50ns): ENC = 250 e + 36 e/pF

  • Nothing can be done about constant term

  • Capacitance must be minimized to reduce effect of steeper slope

Markus Friedl (HEPHY Vienna)


Svd2 ladders
SVD2 Ladders

up to 3 ganged

sensors

  • Up to 3 ganged (concatenated) sensors are read out from the side

  • Minimization of material budget, as hybrids are outside of acceptance

  • SNR >> 15 with VA1TA, but would be << 10 with APV25

  • Ganging of sensors does not work with APV25!

up to 3 ganged

sensors

Markus Friedl (HEPHY Vienna)


Ganged sensors read out with apv25
Ganged Sensors Read Out with APV25

  • Prototype module with 2 partially ganged DSSDs

  • Beam test result shows that already ganging of 2 sensors is problematic

Markus Friedl (HEPHY Vienna)


Solution chip on sensor
Solution: Chip-on-Sensor

  • Thinned APV25 with flex circuit (Kapton) sits on sensor

  • Providing shortest possible connections to the strips

(drawing not to scale)

Markus Friedl (HEPHY Vienna)


Flex module
Flex_Module

  • Demonstrator prototype with chip-on-sensor readout on the n-side and conventional readout on the p-side

  • Cooling pipe made of carbon fiber (too massive)

n-side: chip-on-sensor

p-side: conventional readout

Markus Friedl (HEPHY Vienna)


Measurement results
Measurement Results

  • Beam test result shows that chip-on-sensor (n-side) delivers excellent SNR

Markus Friedl (HEPHY Vienna)


Cooling options
Cooling Options

  • Each APV25 dissipates ~350 mW

  • In total, SuperBelle SVD will burn >1 kW  cooling mandatory

  • Several options tried in “thermal channel“ with dummy APVs:

    • Air

    • Water

    • Heat pipe

    • TPG

  • Clearly liquid cooling is most powerful option

  • Paraffine: reduces risk of leakage and corrosion (used for beam pipe cooling in Belle)

Markus Friedl (HEPHY Vienna)


Origami concept
Origami Concept

  • Extension of chip-on-sensor to double-sided readout

  • Flex fan-out pieces wrapped to opposite side (hence “Origami“)

  • All chips aligned on one side  single cooling pipe

Side View (below)

Markus Friedl (HEPHY Vienna)


3d rendering
3D Rendering

Markus Friedl (HEPHY Vienna)


Material budget
Material Budget

  • X0 comparison between conventional and chip-on-sensor:

  • +50% increase in material, but also huge improvement in SNR

  • Trade-off between material budget and SNR

  • According to simulation, additional material is prohibitive in 2 innermost layers, but no problem for layers 3-5

Markus Friedl (HEPHY Vienna)


Possible superbelle layout
Possible SuperBelle Layout

[cm]

  • Using 6“ DSSDs (~12.5 cm long, up to ~4 cm wide)

  • Every sensor is read out individually (no ganging)

    • Edge sensors (green) are conventionally read from side

    • Center sensors (red) use chip-on-sensor concept (layers 3-5)

layers

5

4

3

2

1

[cm]

Markus Friedl (HEPHY Vienna)


Summary outlook
Summary & Outlook

  • Motivated by Belle upgrade (requirements similar to ILC)

  • APV25 chip (developed for CMS) fits

  • Fast shaping implies higher noise

  • Need to minimize capacitive load  chip-on-sensor concept

  • Successfully demonstrated on Flex_Module

  • “Origami“ concept for low-mass double-sided readout with cooling

  • Will construct such a module in near future

Markus Friedl (HEPHY Vienna)


Try it yourself
Try It Yourself

Markus Friedl (HEPHY Vienna)


Backup slides
BACKUP SLIDES

Markus Friedl (HEPHY Vienna)


Comparison va1ta apv25
Comparison VA1TA – APV25

VA1TA (Belle SVD2)

  • Commercial product (IDEAS)

  • Tp = 800ns (300 ns – 1000 ns)

  • no pipeline

  • <10 MHz readout

  • 20 Mrad radiation tolerance

  • noise: ENC = 180 e + 7.5 e/pF

  • time over threshold: ~2000 ns

  • single sample per trigger

APV25 (SuperBelle)

  • Developed for CMS by IC London and RAL

  • Tp = 50 ns (30 ns – 200 ns)

  • 192 cells analog pipeline

  • 40 MHz readout

  • >100 Mrad radiation tolerance

  • noise: ENC = 250 e + 36 e/pF

  • time over threshold: ~160 ns

  • multiple samples per trigger possible (Multi-Peak-Mode)

Markus Friedl (HEPHY Vienna)


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