The origami chip on sensor concept for low mass readout of double sided silicon detectors
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The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors. M.Friedl, C.Irmler, M.Pernicka HEPHY Vienna. Motivation: Belle. Belle Silicon Vertex Detector (SVD2) 4 layers, total of 246 double-sided silicon detectors (DSSDs) 17°…150° polar angle coverage

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The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors

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The origami chip on sensor concept for low mass readout of double sided silicon detectors

The Origami Chip-on-Sensor Concept for Low-Mass Readout of Double-Sided Silicon Detectors

M.Friedl, C.Irmler, M.Pernicka

HEPHY Vienna


Motivation belle

Motivation: Belle

  • Belle Silicon Vertex Detector (SVD2)

    • 4 layers, total of 246 double-sided silicon detectors (DSSDs)

    • 17°…150° polar angle coverage

    • Slow readout: ~800ns peaking time

  • Low energy machine: Material budget is extremely important!

Markus Friedl (HEPHY Vienna)


Superkek b upgrade

SuperKEK-B Upgrade

  • Planned for 2009-2012

    • Ultimately 30-fold increase in luminosity and trigger rate

  • SVD2 Limitations:

    • Occupancy (currently ~10% in innermost layer)  need faster shaping

    • Dead time (currently few percent)  need faster readout and pipeline

  • APV25 readout chip would fit the needs

  • Requirements similar to ILC

SVD2 occupancy vs. layer

Markus Friedl (HEPHY Vienna)


Apv25

APV25

  • Developed for CMS by IC London and RAL

  • 40 MHz clock

  • 128 channels

  • 192 cells deep analog pipeline

  • 50 ns (adjustable) shaping time

  • 0.25 µm CMOS process (>100 MRad tolerant)

  • Low noise: 250 e + 36 e/pF

  • Multi-peak mode (read out several samples along shaping curve)

Markus Friedl (HEPHY Vienna)


Shaping time and occupancy

Shaping Time and Occupancy

}

BEAM

PARTICLE

}

OFF-TIMEBACKGROUND

PARTICLE

Markus Friedl (HEPHY Vienna)


Shaping time and noise

Shaping Time and Noise

  • Unfortunately, short shaping time inherently implies larger noise

  • Applies to both constant term and slope

    • VA1TA (Tp=800ns):ENC = 180 e + 7.5 e/pF

    • APV25 (Tp=50ns):ENC = 250 e + 36 e/pF

  • Nothing can be done about constant term

  • Capacitance must be minimized to reduce effect of steeper slope

Markus Friedl (HEPHY Vienna)


Svd2 ladders

SVD2 Ladders

up to 3 ganged

sensors

  • Up to 3 ganged (concatenated) sensors are read out from the side

  • Minimization of material budget, as hybrids are outside of acceptance

  • SNR >> 15 with VA1TA, but would be << 10 with APV25

  • Ganging of sensors does not work with APV25!

up to 3 ganged

sensors

Markus Friedl (HEPHY Vienna)


Ganged sensors read out with apv25

Ganged Sensors Read Out with APV25

  • Prototype module with 2 partially ganged DSSDs

  • Beam test result shows that already ganging of 2 sensors is problematic

Markus Friedl (HEPHY Vienna)


Solution chip on sensor

Solution: Chip-on-Sensor

  • Thinned APV25 with flex circuit (Kapton) sits on sensor

  • Providing shortest possible connections to the strips

(drawing not to scale)

Markus Friedl (HEPHY Vienna)


Flex module

Flex_Module

  • Demonstrator prototype with chip-on-sensor readout on the n-side and conventional readout on the p-side

  • Cooling pipe made of carbon fiber (too massive)

n-side: chip-on-sensor

p-side: conventional readout

Markus Friedl (HEPHY Vienna)


Measurement results

Measurement Results

  • Beam test result shows that chip-on-sensor (n-side) delivers excellent SNR

Markus Friedl (HEPHY Vienna)


Cooling options

Cooling Options

  • Each APV25 dissipates ~350 mW

  • In total, SuperBelle SVD will burn >1 kW  cooling mandatory

  • Several options tried in “thermal channel“ with dummy APVs:

    • Air

    • Water

    • Heat pipe

    • TPG

  • Clearly liquid cooling is most powerful option

  • Paraffine: reduces risk of leakage and corrosion (used for beam pipe cooling in Belle)

Markus Friedl (HEPHY Vienna)


Origami concept

Origami Concept

  • Extension of chip-on-sensor to double-sided readout

  • Flex fan-out pieces wrapped to opposite side (hence “Origami“)

  • All chips aligned on one side  single cooling pipe

Side View (below)

Markus Friedl (HEPHY Vienna)


3d rendering

3D Rendering

Markus Friedl (HEPHY Vienna)


Material budget

Material Budget

  • X0 comparison between conventional and chip-on-sensor:

  • +50% increase in material, but also huge improvement in SNR

  • Trade-off between material budget and SNR

  • According to simulation, additional material is prohibitive in 2 innermost layers, but no problem for layers 3-5

Markus Friedl (HEPHY Vienna)


Possible superbelle layout

Possible SuperBelle Layout

[cm]

  • Using 6“ DSSDs (~12.5 cm long, up to ~4 cm wide)

  • Every sensor is read out individually (no ganging)

    • Edge sensors (green) are conventionally read from side

    • Center sensors (red) use chip-on-sensor concept (layers 3-5)

layers

5

4

3

2

1

[cm]

Markus Friedl (HEPHY Vienna)


Summary outlook

Summary & Outlook

  • Motivated by Belle upgrade (requirements similar to ILC)

  • APV25 chip (developed for CMS) fits

  • Fast shaping implies higher noise

  • Need to minimize capacitive load  chip-on-sensor concept

  • Successfully demonstrated on Flex_Module

  • “Origami“ concept for low-mass double-sided readout with cooling

  • Will construct such a module in near future

Markus Friedl (HEPHY Vienna)


Try it yourself

Try It Yourself 

Markus Friedl (HEPHY Vienna)


Backup slides

BACKUP SLIDES

Markus Friedl (HEPHY Vienna)


Comparison va1ta apv25

Comparison VA1TA – APV25

VA1TA (Belle SVD2)

  • Commercial product (IDEAS)

  • Tp = 800ns (300 ns – 1000 ns)

  • no pipeline

  • <10 MHz readout

  • 20 Mrad radiation tolerance

  • noise: ENC = 180 e + 7.5 e/pF

  • time over threshold: ~2000 ns

  • single sample per trigger

APV25 (SuperBelle)

  • Developed for CMS by IC London and RAL

  • Tp = 50 ns (30 ns – 200 ns)

  • 192 cells analog pipeline

  • 40 MHz readout

  • >100 Mrad radiation tolerance

  • noise: ENC = 250 e + 36 e/pF

  • time over threshold: ~160 ns

  • multiple samples per trigger possible (Multi-Peak-Mode)

Markus Friedl (HEPHY Vienna)


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