1 / 3

Main Claim :

Wire bonding 전에 laser 로 bond finger 부분을 제거한 후 wire bonding 한다. 오염된 DI water 에 의한 Bond finger discolor U/F 용액에 의한 resin bleed out 발생. Current. Invention. Laser. Laser. Bond finger discolor. Resin bleed out. Main Claim :

karan
Download Presentation

Main Claim :

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. Wire bonding전에 laser로 bond finger 부분을 제거한 후 wire bonding한다. • 오염된 DI water 에 의한 Bond finger discolor • U/F용액에 의한 resin bleed out발생 Current Invention Laser Laser Bond finger discolor Resin bleed out • Main Claim : • - Claim1 : flipchip 공정에서 DI water 를 사용하는 flux cleaning 과 SAT inspection하는 동안 오염된 물에의한 bond finger 에 discolor가 자주 발생하고있다.Bond finger opening을 wire bonding 전에 Laser로 open하여 작업하면 오염된 DI water가 finger에 노출되지 않게 하여 근원적으로 discolor를 막을 수 있다. • Claim: U/F공정 동안 solder mask가 Bond finger를 덮고 있기 때문에 dispensing pattern이 자유로며, resin bleedout이 발생해도 Laser solder mask opening에서 제거가 가능한 장점이 있다. • =>특히 FCCSP,TMVPKG의 DBRC를 최소화해서 Large die를 구현을 할 수 있는 장점이 있다.

  2. Bond finger 영역에 Solder mask를 Laser로 open한다 Bond finger 영역에 Solder mask가 덮혀져 있는 PCB • Embodiment 1: De-flux Process Underfill Process SAT Inspection Laser Die Die Laser Plasma cleaning Die Die Wire bonding process Laser Laser

  3. Process schematic • Embodiment 1: UV Coated PCB UV type material UV type material UV type material UV type material Chip Attach/Reflow SAT process Flux cleaning Substrate Bake Underfill / Cure SAT UV Die Die Die Substrate Bake UV expose UV material strip 변경된 PCB Substrate Bake Added process

More Related