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YAGEO. Passive Components Introduction ---- MLCC ----. YAGEO DG Marketing Dec 15, 2004. Content:. 1. MLCC introduction MLCC Reliability test MLCC application Product Introduction & Development. Construction of MLCC. Terminations. Electrodes. Ceramic Green Sheet. Printed Electrode.

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slide1

YAGEO

Passive Components Introduction----MLCC----

YAGEO DG

Marketing

Dec 15, 2004

slide2

Content:

  • 1. MLCC introduction
  • MLCC Reliability test
  • MLCC application
  • Product Introduction & Development
slide3

Construction of MLCC

Terminations

Electrodes

Ceramic Green Sheet

Printed Electrode

Electrode End

Ceramic Material

slide4

Dielectric material

Electrode

Grain

Grain Boundary

Ø BaTiO3 ,CaTiO3, SrTiO3 , NbTiO3 , TiO2 , La2O3 ...

Type I (Class I) : Temperature Compensation

ex. NP0 (COG)

Type II (Class II) : High Dielectric Constant

ex. X7R, X5R, Y5V, Z5U

slide5

The principle of capacitance designing

Electrode

Ceramic

W effective

Distance

L effective

e= Permittivity of ceramic

e0 = 8.841910-12 F/m

A = Area, (LeffxWeff)

Ne = Number of electrode

D = Distance of electrode

A x ( Ne-1 )

Capacitance = e e0

D

Unit : F (farad, from Faraday)

slide7

MLCC material and construction

Plating Termination

Noble Metal Electrode (NME) MLCC

Base Metal Electrode (BME) MLCC

Pd/PdAg/Ni

Sn

Ni

Ag/Cu

Ceramic

slide8

MLCC Production Process

PdAg

Ni

PVA

NPO

H20

foil

Ball Mill

Slip

Foil Casting

Drying

Screen Printing

1100~1300C

Sintering

Binder Burn Out

Notching

Pressing

Tumbling

Dipping/Curing

Plating

Testing

Taping

slide9

Principle of Notching Process

Upper Knife

N/T knife : 30um

Apply extrinsic stress from upper/lower knife to break product spontaneously

Lower Knife

slide10

Principle of Notching Process

Top & Bottom Surface

Side Notching Surface

slide11

The classification of ceramic material

Type I (Class I) :

Temperature Compensation

Liner function of cap. with temp.

ex. NP0 (COG)

Type II (Class II) :

High Dielectric Constant

Non-liner function of cap. with temp.

ex. X7R, X5R, Y5V, Z5U

slide12

Symbols of temperature coefficients (EIA)

Ex. : C0G = NP0, T.C.= 0  -1  30 ppm

C : 0 N : Negative

0 : -1 P : Positive

G : 30 ppm 0 : 0

Class I

slide14

Symbols of temperature characteristics (EIA)

Ex. : X7R Y5V Z5U

X : -55C Y : -30 C Z: +10 C

7 : +125 C 5 : +85 C 5 : +85 C

R : 15% V : +22 to -82% U: +22 to -56%

Class II,

& III

slide16

Content:

  • 1. MLCC introduction
  • MLCC Reliability test
  • MLCC application
  • Product Introduction & Development
slide17

Test Specification

& Reference Documents

  • YAGEO Product Spec.
  • IEC 60115-8 Clause
  • IEC 60068 Method
  • JIS 5202 General rule
  • JIS 5201 Test method
  • EIA/IS 703
  • MIL-STD-202F
slide20

Content:

  • MLCC introduction
  • MLCC Reliability test
  • MLCC application
  • Product Introduction & Development
slide22

A. Capacitance measuring low

  • Cause:
  • Equipment Accuracy- measuring range limitation
  • Measuring Environment
slide24

Temperature Coefficient/Characteristic

20

NP0

10

  • Requirement:
  •  C/C = (C1-C0)/C0
  • NP0:  30 ppm/° C
  • X7R:  15%
  • Y5V: +22% ~ -82%
  • Z5U: +22% ~ -56%

0

-60

-40

-20

0

20

40

60

80

100

120

140

-10

°

Temperature (

C)

X7R

-20

-30

C/C (%)

-40

D

Z5U

-50

-60

-70

Y5V

-80

Temperature characteristic vs Ceramic material

-90

slide26

Six factors cause poor solderability

a. Preheating and heating conditions

b. Temperature distribution inside the

furnace and on the board

1. Uneven heating

a. Termination shape and dimensional accuracy

b. Termination solder wettability

2. Chip components

3. Board material and thickness

4. Land shape, geometry (relation with chip termination

dimensions), and land solder wettability

a. Flux composition, chemical activity

b. Solder amount (coated area and coating thickness) and

coating accuracy

5. Solder paste

6. Reflow soldering method selected

slide27

The theory of thermal shock effect

Termination Sn/Pb and Ni over Ag glass frit

(CTE=18ppm/ C; dT=381W/m K)

Ceramic

(CTE=9.5~11.5ppm/ C; dT=4~5W/m K)

F

F

F

Electrodes

(CTE=16ppm/ C; dT=140W/m K)

F

MLCC structure with coefficients in thermal expansion (CTE) and thermal conductivities (dT) listed

slide28

The typical failure modes in the board bending test

Small and thick chip capacitors (0603, 0805 & 1206)

Small and thin chip capacitors (0603, 0805 & 1206)

Crack

Crack

Land pattern

Land pattern

Solder

Solder

Board

Board

Small and medium thick chip capacitors (0603, 0805 & 1206)

Large chip capacitances (1812 & 2220)

Crack

Crack

Land pattern

Land pattern

Solder

Solder

Board

Board

slide30

The stress vs. position on PCB during bending

Chip mounting close to board separation point

Prerouted Corners to Relieve Stress

0.200”(5 mm)

Minimum

5

4

Perforation

Pre-routed

corners

2

2

3

1

Shear line

Slit

SMT components

Magnitude of stress 1 > 2  3 > 4 > 5

Multi-assembly panel

slide31

Content:

  • MLCC introduction
  • MLCC Reliability test
  • MLCC application
  • Product Introduction & Development
slide32

Focus applications

Communications

Consumer Multimedia

Automotive &

General Industrial

Computing

slide34

Yageo’s product portfolioMultilayer Ceramic Capacitors (MLCC)

  • Dielectric: NP0, X7R (X5R), Y5V, Z5U
  • Rated voltage: 6.3V to 4 kV
  • Size: 0201 - 2220
  • Terminations: NiSn, NiAu
  • Special ranges:
    • High capacitance values
    • High voltage
    • Micro wave
    • Capacitor arrays
    • Low inductance capacitors
    • Ultra small
    • X2Y
    • Low profile
slide37

Integration components development trends

R-Array

R-Network

More Functionality Design

RC Network

C-Feed-throgh

C-Array

C-Network

Fine Pitch Design

slide38

Integration 2-capacitor array

  • Only 50% less space comparable to 0402 discrete capacitors.
  • Save the pick and place cost by using capacitor arrays
  • Low inductance characteristics
  • High capacitance per unit volume
    • NP0 10pF to 1nF
    • X7R 120pF to 150nF
slide40

Low inductance MLCC

ESL Measurement of CMC X7R / 100nF Types

1.0

  • Lower Equivalent Series Inductance (ESL) and higher noise absorption than traditional MLCC.
  • Lower inductance and higher Self-Resonant Frequency (more bandwidth)

1206

0603

Inductance (nH)

0.5

0805

0612

0508

0.0

10MHz

100MHz

1GHz

10GHz

Frequency

Total 33 pieces of 0508 LIC used

slide42

Ceramic capacitor trend for miniaturization application

Small Size

YAGEO Solution

Miniaturization

0201

C-array

Integration

RC Network

Thinner

Low profile

slide43

Miniaturization trend

0201

0402

0603

0805

1206

>1206

slide45

Miniaturization down to size 0201

Power amplifier module with

0402 MLCC

6*6 mm2 Power amplifier module with 0201 MLCC (same scale)

6 mm

slide46

Technology trends discrete ceramics

Higher Capacitance Values

100µF

10µF

1µF

Higher Dielectric constant

Thin-layer technology

Higher Voltages

Miniaturization

-DC up to 4kV

- Pulse load

High Accuracy Technology

1206, 0805, 0603, 0402, 0201

CUSTOMER

High Frequency

Integration

- Microwave

- Narrow tolerance

- Low inductance

- Feed Through

- X2Y

Capacitor/Resistor array’s

R/ RC Networks

Cost effective

Bulk case

Base metal electrodes (BME)

slide47

物質名稱

  • Environmental Concern
  • According Sony SS-00259 2nd version

重金屬

Cadmium and cadmium compounds 鎘及鎘化合物

Lead and lead compounds 鉛及鉛化合物

Mercury and mercury compounds 汞及汞化合物

Hexavalent chromium compounds 六價鉻化合物

有機氯化合物

Polychlorinated biphenyl 多氯聯苯(PCB)

Polychlorinated naphthalene 多氯化萘(PCN)

Chlorinated paraffin 氯代烷烴(CP)

Mirex 滅蟻靈

Other chlorinated organic compounds 其他有機氯化合物

slide48

有機溴化合物

Polybrominated biphenyls 多溴聯苯(PBB)

Polybrominated diphenyl ethers 多溴二聯苯

Tetrabromobiphenol-A-bis-(2,3-dibromopropylether) TBBP-A-bis 四溴雙酚-A-雙-(2,3-二溴丙醚)(TBBP-A-bis)

Other brominated organic compounds 其他有機溴化合物

Organic tin compounds (Tributyl tin category & Triphenyl tin category) 有機錫化合物(三丁基錫化合物,三苯基錫化合物

Asbestos 石綿

Azo compounds 偶氮化合物

Formaldehyde 甲醛

Polyvinyl chloride (PVC) and PVC blends 聚氯乙烯(PVC)以及聚氯乙烯化合物

slide49

Item

Material

物质

  • New European Directives

Restriction on Hazardous Substances [ROHS]

1

Lead

2

Mercury

3

Cadmium

4

Hexavalent Chromium

六价铬

5

Polybrominated Biphenyls (PBB)

联本基复合溴

6

Polybrominated Diphenyl Ethers (PBDE)

乙醚溴苯复合溴

slide50

Yageo MLCC

Meet Sony SS-00259 2nd version Requirement

Technology Roadmap for

Technology Roadmap for

Leadfree

Termination Components

Leadfree

Termination Components

~2000

2001

2002

2003

A. Sample Request for Customer

MLCC

Rchip

B.Manufacture Technology Ready

MLCC

Rchip

C. Quality Evaluation

MLCC

(test by LF solder paste)

Rchip

D.SMT Application Evaluation

MLCC

(Cooperate with customers)

Rchip

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