Mechanical Shock Behavior of Pb-free Solder Joints Nikhilesh Chawla, Arizona State University, DMR 0805144. Sn-rich Pb-free solders are utilized as replacement materials for Sn-rich (Pb-free) solders in consumer microelectronics.
Sn-rich Pb-free solders are utilized as replacement materials for Sn-rich (Pb-free) solders in consumer microelectronics.
During it’s service life an electronic device may experience thermal and mechanical stresses.
Understanding the fracture of Sn-rich alloys, particularly through Cu6Sn5 interfacial fracture, or solder fracture, is instrumental in understanding its properties.
We have shown that at lower strain rates, fracture is controlled in the Sn solder alloy, while at high strain rates, the Cu6Sn5 intermetallic controls failure.
Prof. Nik Chawla gave a talk entitled “Learning to Network and Giving the Elevator Talk,” in the Preparing Future Faculty (PFF) Program at Arizona State University.
The program is a two year program for Ph.D. students from various fields, who wish to join the professoriate and have a career in academia.