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ASME Electronics and Photonics Packaging Division (EPPD)

ASME Electronics and Photonics Packaging Division (EPPD) .

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ASME Electronics and Photonics Packaging Division (EPPD)

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  1. ASME Electronics and Photonics Packaging Division (EPPD) • Scope: The Division is concerned with all design and engineering aspects related to theoretical (analytical and computer-aided) and experimental problems and results associated with the application of methods and approaches of engineering and applied mechanics to the analysis, design, manufacturing, testing and operation of microelectronics, optoelectronics and photonics components, devices, equipment and systems. • EPPD reports to the Systems and Design Technical Group (SDTG) of ASME Objectives: international cooperation, understanding, and promotion of efforts and disciplines in Microelectronics, Photonics, RF and Micro-Electro-Mechanical Systems Packaging Engineering.

  2. EPPD Purpose • Promote the art, science, and practice of electrical, electronic, and photonic packaging and related emerging technologies. • Encourage and foster research, development, education, and dissemination of reliable data and results of engineering importance pertaining to subjects within the Division’s scope of activities. • Encourage the interchange of ideas among professionals by encouraging the preparation and publication of research papers in the field, and encourage collaborations between academia, industry and national labs. • Provide information transfer among its members through IMECE program, InterPACKconferences, Journal of Electronic Packaging and associated publications. • Provide networking structure at conference and committee activity levels.

  3. EPPD Purpose (Contd.) • Promote interactions with other Divisions: K-16 of Heat Transfer, Applied Mechanics, MEMS and Nanotechnology. • Maintain effective interrelationship between industrial and academic interests.

  4. EPPD Awards • The Division gives the following annual awards: • • EPPD Applied Mechanics Award: For excellence in applications of engineering mechanics in the field of electronic and/or photonic packaging including stress analysis, reliability, experimental methods, and computational modeling, as demonstrated by the impact of publications, patents, techniques and processes developed. • • Best Journal of Electronic Packaging (JEP) Paper Award. • • Best JEP Associate Editor Award: In recognition of contributions and outstanding performance as Associate Editor to the Journal of Electronic Packaging during the past calendar year. • • K16 Clock Award: In recognition of outstanding and continuing contributions to the science and engineering of heat transfer in electronics. • • EPPD Woman Engineer Award: In recognition of a female engineer with significant technical achievements in the area of electronic and photonic packaging demonstrated through papers, patents, or product development. • • EPPD Young Engineer Award: In recognition of a young engineer, no more than 35 years of age, who has made significant technical contributions in the area of electronic and photonic packaging demonstrated through papers, patents, or product development. • • EPPD Student Member Award: In recognition of a current student member who has excelled in research and has shown promise to be a strong contributor in the field of electronic and photonic packaging. • The Division shall administer the Allan Kraus Thermal Management Medal.

  5. Divisional Organization • Executive Committee • Elected according to the Bylaws for a five year term • Rotates from Member-at-large to Chair • Should have equal industrial and academic representation • Technical Committee • For the Technical Program in IMECE • For the Technical Program in InterPACK • For the technical needs of the packaging community • Advisory Committee • For Division consultation and policy development • For awards and recognitions • For nominations and recruitment • Ad-hoc Committees (formed as needed)

  6. EPPD Executive Committee 2013-2014 Chair: Dr. Y. Joshi, Georgia Tech Vice Chair: Dr. K. Ramakrishna, Hewlett-Packard Treasurer: Dr. A. Dasgupta, U. of Maryland Secretary: Dr. S. Chaparala, Corning Member-at-Large: Dr. K. Nagarkar, General Electric

  7. Major Activities •IMECE Program – Organized 20+ sessions each year in IMECE on topics in structural and stress analysis, modeling and reliability, materials and processing, thermal management of microelectronic systems, MEMS and nano scale packaging problems. – Co-sponsored sessions with Electronic and Photonic Tracks, K-16 of Heat Transfer and MEMS Divisions. – Sponsored receptions/dinners for recognition/award presentation. • InterPACKConferences (Odd Years) – Flagship conferences owned and organized by EPPD. – Provide an international forum for the packaging community. – Program organization and development is equally divided between industry and academia. – InterPACK series was recognized as “Hawaiian” conferences from 1995 to 2003, rotating among various islands of Hawaii. – InterPACK was moved back to the continent since 2005. – InterPack 2013 held in San Francisco; attendance ~500

  8. Major Activities (Contd.) • ITHERM Conferences (Even Years) • – Currently owned by IEEE CPMT Society and co-located with ECTC. • – Many organizers were EPPD officers or members. • • JOURNAL OF ELECTRONIC PACKAGING • – Published quarterly. • – Best paper and associate editor awards conferred yearly. • • DIVISIONAL COMMITTEE ACTIVITY • – Active open meetings at IMECE and InterPACK with attendance of 20- 40 participants. • – Forum allows membership concerns and emerging topics to be addressed. • – Recruiting mechanism for IMECE and InterPACK program chairs and Divisional leaders

  9. Current EPPD Focus Initiatives • Engage with current/graduating students, early career engineers, experienced engineers on EPPD activities • Develop alliances with MEMS Division and Nanotechnology Institute on packaging: transfer our expertise in this area to other divisions/institute • Encourage the formation of technical Chapters of the Division in the global Sections and Subsections of the Society such that the local membership may conduct the activities of the Division on the geographical area of the societal unit. • Ensure that the activities of the Division shall be directed by members who have attained prominence in the field, and who have shown by activities within the Division, the ability and willingness to discharge such responsibilities. • Newsletter and website development and maintenance. Please sign up at:https://community.asme.org/electronic_photonic_packaging_division/default.aspx

  10. EPPD Related Initiatives in the Atlanta Area • Georgia Tech • Packaging Research Center • NSF I/UCRC on Energy Efficient Electronic Systems • Research in photovoltaics, RF electronics, power electronics • Local industries • - energy, data centers, telecommunications, solid state lighting, automotive, defense

  11. How Can You Help Us ? • Sign up at EPPD site • Attend EPPD General Meeting at IMECE • Contribute technical papers to JEP, participate in InterPack • Volunteer to review papers, help co-organize sessions • Possibility of local chapter

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