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Instrument Integration and Test Rick Sterling / Sharon Jelinsky University of California – Berkeley Thm_CDR_IT_Revc. Overview. Overview / Topics I&T Sequence Facilities Integration Platform Instrument Requirements Integration/Test Flow Schedule Milestones Transportation.

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Presentation Transcript


Overview

  • Overview / Topics

    • I&T Sequence

    • Facilities

    • Integration Platform

    • Instrument Requirements

    • Integration/Test Flow

    • Schedule Milestones

    • Transportation



Facilities - Environmental

  • Thermal Chambers

  • Space Sciences Lab

  • New Chamber for EFI Booms

  • Cal Chamber Upgrade for SST

  • Test Chamber Requirements

  • Pre-Test Clean

  • Pre-Test Bakeout

  • TQCM Monitoring

  • Cryo-Pump

  • Final Bakeout

  • GN2 Backfill

  • Calibration Chambers

  • Vacuum only

  • Ion Gun

  • Manipulator

Available Chambers

Type

Comment

HiBay L1

TV

AXB Booms

HiBay L2

TV

STEREO

320 T10

TV

STEREO

320 Cal

Vac

ESA Cal

320 “Mini”

TV

SCM, Bake-outs

B20-TV “Bayside”

TV

EFI

B20-Large TV

TV

Payload TV

B20-Cal VAC2

Vac

SST Cal

SST, IDPU, EFI

B20-TV “Snout”

TV

ESA MCPs

339-TV Cal

  • Vibration Facilities

  • Wyle

  • AMES

  • EMI/EMC

  • EMCE Engineering – Fremont


B20 T/V CHAMBERS

  • Room B20

    • 3 T/V Test Chambers: Bayside, Snout, Bertha

    • High Vacuum Base Pressures of 1x10e-6 torr or better

    • Thermal Systems with LN2 cooling and IR heating

    • Thermal Controllers: Watlow hardware & Anawin Software

    • Test Chambers Certified prior to instrument testing

      • Verify Outgassing levels less than 1% TML and 0.1% CVCM

      • RGA measures of residual gasses to less than 1x10e-7 PP

      • TQCM to measure condensable materials deposition rates


Chamber ‘Bertha’

  • Bertha - Large Thermal Vacuum Test Chamber

    • Dimensions: 9 ft. Diameter x 16 ft. Long

    • Accommodates 2 THEMIS Instrument Suites at once

    • Temperature cycles of -80C to +80C

    • Base Pressure of less than 1 x 10e-6 torr

    • Tests full ETU and 5 Flight Instruments


Chamber ‘Themis Snout’

  • THEMIS Snout

  • Dimensions: 3 ft. Diameter x 3 ft. Long

  • Accommodate EFI Axial Boom

  • Temperature cycles of -100C to +110C

  • Base Pressure of less than 1 x 10e-6 torr

  • Tests IDPU, AXB T/V, and Boom Deployment


Chamber ‘Bayside’

  • Bayside

    • 3 ft. Diam x 3 ft. Length

    • Fits 2 Instruments

    • Temp Range: –100 to +110C

    • Base Pressure: <1 x 10e-6 torr


Thermal Testing

  • TV Plan

  • 2 Component-Level TV Cycles Prior to Instrument-Level I&T

  • 6 Instrument Level TV Cycles at Instrument-Level

  • Survival, Cold Start, Cycles (Functional at extremes), Bake-out

  • Deployments in Vacuum

  • SPB: Full Deploy w Takeup reel

  • AXB: Deploy Hot & Cold

  • MAG: First Motion Hot & Cold

  • Typical TV Profile:


Status of Chamber Upgrades

  • Bertha

    • Vacuum Chamber in full working order

    • Thermal System designed; Baseplate and Shroud in production

    • Thermal Controller off the shelf & on order

  • Snout

    • Vacuum Chamber manufacture complete and under test

    • Thermal System designed; Baseplate and Shroud in production

    • Thermal Controller off the shelf & on order

  • Bayside

    • Vacuum Chamber in full working order

    • Thermal System designed and built

    • Thermal Baseplate and Shroud under installation and test


Clean Rooms SSL

Clean Room Features

  • Requirement: 100K Class

  • Nitrogen Gas purge available

  • Continuous Oxygen Monitoring

  • Temperature and Humidity Monitoring

  • Weekly Air Quality sampling

  • Controlled Access

  • Crane Certification

  • Staff Training




Integration Platform

Instrument Suite on Platform

  • Platform is same size as s/c deck

  • Framing supports platform to set comfortable work height

  • Metal rack alongside holds GSE and support equipment

  • GSE communicates with BAU Simulator via hardwire or ethernet

INSTRUMENT PAYLOAD ASSEMBLY PLATE


Parallel Integration/Test

Parallel Integration and Test of S/C Platforms


Instrument Requirements

  • Instrument Cleanliness/Contamination Requirements

    • ESA and SST require continual nitrogen gas purge

    • Oxygen meter following instruments and gas purge equipment

    • Normal ESD concerns

    • Magnetometer sensors to be boxed except when under test and before flight

  • Instrument-Provided GSE Accommodation

    • Mu-Metal Enclosures for FGM & SCM

    • N2 Purge Systems for ESA, SST

    • Sphere Sensor Boxes for EFI

  • Instrument Red/Green Tag Items Tracking

    • IDPU - Arming plug enables actuators causing boom deployment

    • EFI  - Electrical: 4 SPB Test/enable plugs plus one AXB test/enable plug

    • EFI  - Mechanical: 4 SPB Snout Covers plus 2 AXB Tube Covers

    • SST -  Covers to be removed before flight

    • ESA -  Cover; Arming plug; purge fitting;cocking pin nut


Instrument Payload I&T Flow

Harness

Bake-out

IDPU-Harness

Safe-to-Mate

FGM

Functional

(Level 2)

SCM

Functional

(Level 2)

Mag Boom

Deploy

Mag

Alignment

MAG INTEGRATION

EFI

Functional

(Level 1)

EFI AXB

Deploy

EFI SPB

Deploy

EFI

Functional

(Level 2)

EFI/SCM/FGM

Phasing

EFI INTEGRATION

ESA/SST INTEGRATION

SST

Functional

(Level 2)

ESA

Functional

(Level 2)

ESA/SST

Timing

Payload

CPT

Instrument

PER

Payload

EMC/EMI/MAGl

Payload

T-V

Payload

Vibration

Payload

Acceptance

PAYLOAD ENVIRONMENTAL

  • ONLY if req’d

  • (workmanship)

  • Test Review


FGM I&T Flow

FGB

Vibration

FGB/SCB

Thermal

FGB

Acceptance

FGM BOOM (FGB)

  • 1 cycle T-V

  • Hot/Cold Deploy

  • Inspection

  • Mass Properties

  • DC Magnetics

FGS

Vibration

FGS

Thermal

FGS

Acceptance

FGM SENSOR (FGS)

  • Boom Levels

  • 2 cycles T-V

  • Bake-out +60C

  • Inspection

  • Mass Properties

  • DC Magnetics

FGE

Acceptance

IDPU

Safe-to-Mate

FGM

Functional

(Level 0)

IDPU/ESA/

SCM Pre-Amp

Vibration

IDPU

Thermal

IDPU

Acceptance

FGM ELECTRONICS (FGE)

  • Inspection

  • Backplane

  • Without FGS

  • 2 cycles T-V

  • Bake-out +60C

  • FGS Functional

  • (Level 1)

  • Inspection

  • Mass Properties

  • DC Magnetics

Payload

Safe-to-Mate

FGM

Functional

(Level 2)

Mag Boom

Deploy

Alignment

EFI/SCM/FGM

Phasing

FGM / PAYLOAD INTEGRATION

  • Harness

  • Sensor in TCU

PAYLOAD ENVIRONMENTAL

Instrument

PER

Payload

EMI/EMC/MAGl

Payload

T-V

Payload

Vibration

Payload

Acceptance

  • ONLY if req’d

  • (workmanship)

  • Test Review

  • 6 cycles T-V

  • FGM Functional Lev1)


FGM Test Configurations

  • FGM Level 0 – Without Sensor (Aliveness)

    • B-field about zero if FGM in Cal Mode (preferred mode)

    • B-field saturated if feedback is closed

    • Interface full functional

    • Power consumption reduced by about 200mW

  • FGM Level 1 – Sensor in Mu-metal cap (Limited Performance Test)

    • B-field about 10,000nT, Noise about 1nT

    • Full functionality,

      but B-field not representative

  • FGM Level 2 – Sensor in TCU (Comprehensive Performance Test)

    • B-field < 10nT, Noise <10pT/sqrt (Hz)

    • B-field has to be available in full quality

    • Delta in calibration coefficients known


SCM I&T Flow

SCB

Vibration

FGB/SCB

Thermal

SCB

Acceptance

SCM BOOM (SCB)

  • 14.1g RMS

  • 1 cycle T-V

  • Hot/Cold Deploy

  • Inspection

  • Mass Properties

  • DC Magnetics

SCM Sensor

Vibration

SCM Sensor

Thermal

SCM Sensor

Bake-out

SCM Sensor

Acceptance

SCM SENSOR (SCM)

  • Boom Levels

  • 3 cycles (air)

  • Bake-out +60C

  • Inspection

  • Mass Properties

  • DC Magnetics

SCM Pre-Amp

Thermal

SCM Pre-Amp

Bake-out

SCM Pre-Amp

Acceptance

IDPU/ESA/

SCM Pre-Amp

Vibration

IDPU

Thermal

IDPU

Acceptance

SCM PRE-AMP

  • 3 cycles (air)

  • Bake-out +60C

  • Inspection

  • Mass Properties

  • DC Magnetics

  • 2 cycles T-V

  • Bake-out +60C

  • SCM Functional

  • (Level 1)

  • Inspection

  • Mass Properties

  • DC Magnetics

Payload

Safe-to-Mate

Functional

(Level 3)

Mag Boom

Deploy

Alignment

EFI/SCM/FGM

Phasing

SCM / PAYLOAD INTEGRATION

  • Harness

  • SCM Sensor in Mu Metal

PAYLOAD ENVIRONMENTAL

Instrument

PER

Payload

EMI/EMC/MAGl

Payload

TV

Payload

Vibration

Payload

Acceptance

  • 6 cycles T-V

  • SCM Functional (Lev 2)

  • ONLY if req’d

  • (workmanship)

  • Test Review


SCM Test Configurations

  • SCM Safety – Feedback Plug

    • Required when SCM Pre-Amp is powered and sensor is not connected

  • SCM Level 0 – With SCM EGSE I/F Box (Aliveness)

    • Same Power, Command, Analog output interfaces

    • Power and Cal Mode identification by LED

    • Cal Signal re-injected to the input

    • Signal generator connected to input

    • Validation by analysis of data

  • SCM Level 1, 2 – Sensor in Mu Metal Box (Comprehensive Performance Test)

    • Sensor kept in mu metal box during integration

    • Axis identification

    • Re-verification of end-to-end calibration

    • Phase relation

    • Check of conducted noise

    • SCM/EField timing reference


ESA I&T Flow

ESA

Thermal

ESA

Acceptance

ESA SENSOR

  • 2 cycles T-V

  • Bake-out +60C

  • Inspection

  • Mass Properties

  • DC Magnetics

ETC

Acceptance

IDPU

Safe-to-Mate

ESA

Functional

(Level 0)

IDPU/ESA/

SCM Pre-Amp

Vibration

IDPU

Thermal

IDPU

Acceptance

ESA ELECTRONICS (ETC)

  • Inspection

  • Backplane

  • 2 cycles T-V

  • Bake-out +60C

  • Inspection

  • Mass Properties

  • DC Magnetics

Payload

Safe-to-Mate

ESA

Functional

(Level 2)

ESA/SST

Timing

ESA / PAYLOAD INTEGRATION

  • Harness

  • Instrument Functional

  • Cover Simulator Test

Instrument

PER

Payload

EMI/EMC/MAG

Payload

T-V

Payload

Vibration

Payload

Acceptance

PAYLOAD ENVIRONMENTAL

  • ONLY if req’d

  • (workmanship)

  • Test Review

  • 6 cycles T-V

  • ESA Functional (Lev 1)


SST I&T Flow

SST

Vibration

SST

Thermal

SST

Acceptance

SST SENSOR

  • 2 cycles T-V

  • Bake-out +60C

  • Inspection

  • Mass Properties

  • DC Magnetics

DAP

Acceptance

IDPU

Safe-to-Mate

SST

Functional

(Level 0)

IDPU/ESA/

SCM Pre-Amp

Vibration

IDPU

Thermal

IDPU

Acceptance

SST ELECTRONICS

(DAP and ETC)

  • Inspection

ETC

Acceptance

  • Backplane

  • Without SST

  • 2 cycles T-V

  • Bake-out +60C

  • Inspection

  • Mass Properties

  • DC Magnetics

  • Inspection

Payload

Safe-to-Mate

SST

Functional

(Level 2)

ESA/SST

Timing

SST / PAYLOAD INTEGRATION

  • Harness

  • SST w/ Radiation Source

  • Attenuator Test

Instrument

PER

Payload

EMI/EMC/MAGl

Payload

T-V

Payload

Vibration

Payload

Acceptance

PAYLOAD ENVIRONMENTAL

  • ONLY if req’d

  • (workmanship)

  • Test Review

  • 6 cycles T-V

  • SST Functional (Level 1)


EFI I&T Flow

AXB

Vibration

AXB

Thermal

AXB

Acceptance

EFI AXIAL BOOM (AXB)

  • 1 cycle T-V

  • Hot/Cold Deploy

  • Inspection

  • Mass Properties

  • DC Magnetics

SPB

Vibration

SPB

Thermal

SPB

Acceptance

EFI RADIAL BOOM (SPB)

  • 1 cycle T-V

  • Hot/Cold Deploy

  • Inspection

  • Mass Properties

  • DC Magnetics

EFI Pre-Amp

Vibration

EFI Pre-Amp

Thermal

EFI Pre-Amp

Bake-out

EFI Pre-Amp

Acceptance

EFI PRE-AMP

  • 3 cycles (air)

  • Bake-out +60C

  • Inspection

  • Mass Properties

  • DC Magnetics

BEB

Acceptance

IDPU

Safe-to-Mate

EFI

Functional

(Level 0)

IDPU/ESA/

SCM Pre-Amp

Vibration

IDPU

Thermal

IDPU

Acceptance

EFI ELECTRONICS

(BEB and DFB)

  • Inspection

  • Backplane

  • Without sensors

  • 2 cycles T-V

  • Bake-out +60C

  • Inspection

  • Mass Properties

  • DC Magnetics

DFB

Acceptance

  • Inspection

Payload

Safe-to-Mate

EFI AXB

Deploy

EFI SPB

Deploy

EFI

Functional

(Level 2)

EFI/SCM/FGM

Phasing

EFI / PAYLOAD INTEGRATION

  • Harness

  • Sensor in Mu Metal

Instrument

PER

Payload

EMI/EMC/MAGl

Payload

T-V

Payload

Vibration

Payload

Acceptance

PAYLOAD ENVIRONMENTAL

  • ONLY if req’d

  • (workmanship)

  • Test Review

  • 6 cycles T-V

  • EFI Functional (Lev 1)



Transportation

  • Transportation and Logistics

  • Air Transport of Instrument Suites from Berkeley to Swales

  • Fed Ex Critical/Specialty Freight Overnight

  • Point to Point, Highest Security

  • Transport Berkeley’s spacecraft platform to Swales also

  • Post-Transport Acceptance Test at Swales


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