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Master of Science with Major in Packaging of Electronics and Optical Devices. Engineering Leaders Masters Series. Presentation Outline. SMU School of Engineering Mechanical Engineering Department Graduate Degree Programs MS and PhD in Mechanical Engineering

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Engineering Leaders Masters Series

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Engineering leaders masters series

Master of Science

with Major in

Packaging of

Electronics and

Optical Devices

Engineering Leaders Masters Series


Presentation outline

Presentation Outline

SMU School of Engineering

Mechanical Engineering Department

Graduate Degree Programs

  • MS and PhD in Mechanical Engineering

    Professional Degree Programs

  • MS with a Major in Manufacturing Systems Management

  • MS with a Major in Packaging of Electronics and Optical Devices

    Details of Professional Degree Program

    MS with a Major in Packaging of Electronics and Optical Devices

    Professional Certificate in Electronic Packaging Fundamentals


School of engineering

School of Engineering

Engineering Leaders Masters Series


Engineering leaders masters series

“At SMU, we are educating today’s engineers to be tomorrow’s engineering leaders.”

~Geoffrey Orsak, Dean

SMU School of Engineering


Five engineering departments

Five Engineering Departments

Mechanical Engineering (ME)

Computer Science and Engineering (CSE)

Electrical Engineering (EE)

Engineering Management, Information and Systems (EMIS)

Environmental and Civil Engineering (ENCE)


Student population

Student Population

Undergraduate students

~ 800

Graduate Students

~ 1,005

(~43 Ph.D. students)


School of engineering1

School Of Engineering

First University to offer Distance Learning program with

  • TAGER Satellite Network

  • VHS Delivery

  • DVD delivery

  • Streaming Video downloads

  • WebEx and Blackboard

  • 100% Coverage of all graduate courses

  • SMU is the only university that offers a complete program in Packaging of Electronics and Optical Devices via Distance Learning


  • Engineering leader s masters series

    Engineering Leader’s Masters Series


    Engineering leader s masters series1

    Engineering Leader’s Masters Series

    Continuous Learning

    • Undergraduate

    • Certificate

    • Graduate

    • Beyond

      Lecture Series

    • Evening and daytime events

    • Current and topical

    • Experts from Industry

      Networking opportunities


    Delivery methods packaging of electronics and optical devices

    Delivery MethodsPackaging of Electronics and Optical Devices

    • On Campus

      • Traditional classrooms

    • Distance Learning

      • DVD delivery

      • Streaming video downloads


    On campus instruction

    On Campus Instruction

    Standard M/W , M/W/F or T/TH classes

    Day and evening formats

    Standard Fall / Spring / Summer Semesters

    Taught by full-time and adjunct Faculty


    Distance learning

    Distance Learning

    Streaming Video Downloads

    • Flexible scheduling

      Lectures are current

    • Usually posted to the SMU server within a few hoursof delivery

      Exams are proctored

      Industry students are welcome to attend on campus if convenient


    Mechanical engineering department

    Mechanical Engineering Department


    Engineering leaders masters series

    Mechanical Engineering Department (ME)

    ME at SMU is a Research-oriented, student-centered department. The department promotes world class research with absolute commitment to excellence in teaching.


    Mechanical engineering faculty

    Mechanical Engineering Faculty

    Yildirim Hurmuzlu

    Chair

    Radovan Kovacevic

    Peter Raad

    Jose Lage

    12 Full time faculty

    7 Emeritus faculty

    8 Adjunct faculty

    3 Staff members

    3 Post-Doctoral Research Associates

    Wei Tong

    Charles Lovas

    Paul Krueger

    David Willis

    Gemunu Happawana

    Dona Mularkey

    Elena Borzova

    Donald Price


    Mechanical engineering degree programs

    Mechanical Engineering Degree Programs

    Mechanical Engineering (ME)

    BS, MS, Ph.D.

    M.S. with Major in Packaging of Electronics and Optical Devices (PEOD)

    MS, Professional Certificates

    M.S. with Major in Manufacturing Systems Management (MSM)

    MS, Professional Certificates


    Engineering leaders masters series

    SMU

    Packaging of Electronics and Optical Devices

    Presented from an Industry Perspective

    Donald Price, Ph.D., P.E.

    Director

    December 15, 2006


    Why packaging of electronics and optical devices

    Why Packaging of Electronics and Optical Devices ?

    • In today’s environment, an engineer working in the electronics industry must constantly develop more advanced capabilities in the design and packaging of electronic systems.

    • These systems are becoming more complex, with ever-increasing requirements for higher reliability and lower-cost manufacturability.

    • To compete, you will need an understanding of the:

      • Effect of mechanical vibrations on components and systems,

      • Behavior of electronic components

      • Fundamentals of optoelectronics and microelectromechanical systems (MEMS)

      • Failure modes and mechanisms of electronic components

      • Current thermal management techniques

      • Electronic materials and their material properties

      • Basics of experimental measurements

      • Computational techniques used in both mechanical and thermal design

      • Fundamentals of electronic manufacturing technology.


    Why packaging of electronics and optical devices1

    Why Packaging of Electronics and Optical Devices ?

    • Being trained in these disciplines, you will find yourself in high demand, as advanced electronic and optical devices reach even further into our everyday lives.

    • You will learn how this program will resolve all of the issues, which currently are limiting progress in your career.


    Why southern methodist university

    Why Southern Methodist University ?

    • The MS program in Packaging of Electronics and Optical Devices at SMU is one of only a few programs in the world designed to provide you, the practicing engineer, with the depth and breadth of skills in the diverse disciplines, which you need to succeed in this ever more demanding field

    • No time for on-campus coursework? No problem. Traveling for your employer! No problem.

    • This program is unique, in that it delivers courses via Distance Learning, enabling you to balance your advanced degree studies with your work priorities.

    • You are able to easily communicate with your SMU professors via telephone, fax, and email. Lecture notes and course materials are placed on the web site in advance of classroom lectures.


    Why southern methodist university1

    Why Southern Methodist University ?

    • The lectures are digitally recorded and are available for streaming video downloads from the SMU web site to your computer over the internet.

    • With this form of course delivery, the program is ideally suited for engineers throughout the United States and for military personnel, whether stationed in the US or abroad.

    • SMU offers qualified military personnel and government employees discounted tuition.


    Smu s vision and mission statement

    SMU’s Vision and Mission Statement

    • SMU has revised the course content and technical approach of the M.S. degree program in Packaging of Electronic and Optical Devices

    • The content of the program now features electronic packaging education being presented from an industry perspective in order to provide complete instruction in the design, development, and manufacture of electronic components and systems.

    • SMU believes that the electronics industry in this area requires engineers with multidisciplinary skills in the fields of electronic materials science, mechanical design, and thermal management.


    Vision and mission statement cont

    Vision and Mission Statement (cont)

    • SMU seeks to develop students uniquely able to contribute to the growth of the electronics and avionics in the Dallas-Ft. Worth area and around the world.

    • We believe that the electronics industry seeks to hire engineers with a cross-disciplinary educational background, possessing skills and capabilities in mechanical modeling, mechanical design, and thermal design, as well as an understanding of electronic materials and material properties.

    • To this end, we believe that the program, as now structured, meets that need


    Degree requirements admission requirements admission process

    Degree Requirements,Admission RequirementsAdmission Process


    Degree requirements

    Degree Requirements

    In addition to meeting the School of Engineering degree requirements for a Master of Science degree, applicants are required to satisfy the following additional requirements:

    • Satisfactory completion of a required core curriculum consisting of the four courses (12 hrs)

    • Satisfactory completion of the required six (6) electives selected from a list of eight (8) electronic packaging courses (18 hrs)


    Admission requirements

    Admission Requirements

    In addition to meeting the School of Engineering admission requirements for a Master of Science degree, applicants are required to satisfy the following additional requirements:

    Bachelor of Science in one of the engineering disciplines, or in a closely related scientific field


    Admission process

    Admission Process

    Procedures and forms are located at

    http://engr.smu.edu/students/graduate_admission.html

    What you will need

    • Completed application form

    • Two recommendation forms (one from a manager or supervisor)

    • Current resume

    • All official undergraduate and graduate transcripts

    • $75 application fee


    Curriculum packaging of electronics and optical devices

    CurriculumPackaging of Electronics and Optical Devices

    • Core Courses - 12 hrs

      • ME 7334 – Fundamentals of Electronic Packaging

      • ME 7242 – Introduction to Thermal Management of Electronics

      • ME 7343 – Electronic Packaging Materials: Processes, Properties, and Testing

      • ME 7358 – Vibration Analysis of Electronic Systems


    Curriculum packaging of electronics and optical devices1

    CurriculumPackaging of Electronics and Optical Devices

    • Electronic Packaging Electives [select six (6) of eight (8) courses] - 18 hrs

      • ME 7314 – Introduction to Microelectromechanical Systems and Devices

      • ME 7335 – Convective Cooling of Electronics

      • ME 7344 – Conductive Cooling of Electronics

      • ME 7346 – Application of Computational Techniques to the Mechanical and Thermal Design of Electronic Systems

      • ME 7348 – Thermal, Fluid, and Mechanical Measurements in Electronic Systems

      • ME 7360 – Electronic Product Design and Reliability

      • ME 7367 – Electronic Manufacturing Technology

      • ME 7359 – Analysis and Design of Optoelectronic Packages


    Schedule of course offerings core courses

    Schedule of Course OfferingsCore Courses


    Schedule of course offerings packaging elective courses select 6 of 8

    Schedule of Course OfferingsPackaging Elective Courses (select 6 of 8)


    Training programs professional certificates

    Training ProgramsProfessional Certificates


    Training programs

    Training Programs

    Professional Certificates in

    Packaging of Electronics and Optical Devices

    Manufacturing Management Fundamentals

    Short Courses

    Cutting-edge topics for IT professionals


    Professional certificate in electronic packaging fundamentals

    Professional Certificate in Electronic Packaging Fundamentals

    A Graduate Certificate is earned upon the successful completion of three (3) courses selected from the following list of four (4) core courses:

    ME 7334 – Fundamentals of Electronic Packaging ME 7242 – Introduction to Thermal Management of Electronics ME 7343 – Electronic Packaging Materials: Processes, Properties, and Testing

    ME 7358 – Vibration Analysis of Electronic Systems


    Admission requirements professional certificate in electronic packaging fundamentals

    Admission RequirementsProfessional Certificate inElectronic Packaging Fundamentals

    • Students must have an undergraduate degree in science or engineering or five (5) years of directly relevant professional experience

    • Students who complete the requirements for the professional certificate, and meet the admission requirements, can apply for admission as a degree-seeking student in the graduate degree program in Packaging of Electronics and Optical Devices

    • For those students accepted into the graduate degree program, the courses taken to complete the professional certificate will count toward the graduate degree requirements


    Completion requirements professional certificate in electronic packaging fundamentals

    Completion RequirementsProfessional Certificate inElectronic Packaging Fundamentals

    • The professional certificate will be awarded upon completion of three (3) of the four (4) core courses with a grade of B or better in each of the three courses

    • The three courses for the professional certificate must be completed within three (3) years from admission to the program


    Engineering leaders masters series

    Statement Regarding Thesis RequirementMS Degree with Major in Packaging of Electronics and Optical Devices


    Thesis not required for ms degree

    Thesis Not Required for MS Degree

    For the MS degree with a major in Packaging of Electronics and Optical Devices, a thesis is not normally required

    If the student wants to pursue a research project and has a topic of sufficient applicability to the interests of the student’s sponsoring company, it is permissible to substitute a thesis for two (2) of the ten (10) courses required for graduation


    Thesis requirement continued

    Thesis Requirement (continued)

    Basic requirements for substitution:

    • The research should be totally funded by the sponsoring company

    • The research may either be performed at SMU or on the premises of the sponsoring company, depending on the topic and the scope of the work

    • The student will need to select a faculty member to act as thesis advisor

    • SMU faculty and staff, associated with the project, are willing to sign a confidentiality agreement, but there is a basic requirement that the thesis, and any publications derived from the thesis, be publishable in the open literature

    • Depending on the scope of the work and the level-of-effort, it may be necessary for the student’s sponsoring company to compensate the faculty thesis advisor for time required for supervision


    Loan programs and distributed payment plan for tuition

    Loan Programs and Distributed Payment Plan for Tuition


    Smu tuition loan programs

    SMU Tuition Loan Programs

    • For graduate students registered for a minimum of six hours per semester, go to

      http://smu.edu/financial_aid

      and click on “Grad and Professional Students”

    • Federally backed low interest loans are available, and students may be eligible for up to $18,000 per year

    • Payment is not required until after the student finishes his or her studies

    • For graduate students registering for three hours per semester, application websites for two lenders that offer educational loans

      www.wellsfargo.com/student/undergrad/education/?_requestid=50321

      www.educationone.com/chase-student-loans/continuing-education.htm

    • Both of these lenders offer loans, which are consumer/credit based with variable interest rates.  Funds are disbursed directly to the student, not the school.


    Distributed tuition payments

    Distributed Tuition Payments

    • To ease the pain of advance tuition payments prior to reimbursement by your company, SMU has created an arrangement whereby you can make distributed tuition payments through Sallie Mae

    • Two payment plans are available depending on when you apply

    • These are: 5 month/ten month payment plan and four month payment plan

    • 5 Month and 10 Month Payment Plans

      • Due Dates – The 1st of each month beginning June 1st

      • Enrollment fee - $50.00 for the 5 Pay Plan (Fall or Spring Only) and $100 for the 10 Pay Plan (Fall & Spring)

      • Last date to enroll in this plan for Fall is August 4th

      • Students can enroll by phone (1-800-635-0120 or 1-800-556-6684), online at www.tuitionpay.com, or by mailing in the enrollment form


    Distributed tuition payments1

    Distributed Tuition Payments

    • 4 Month Payment Plan

      • Due Dates – August 25th, September 25th, October 25th, November 25th - Please note that this plan was set up so that the students MUST pay for the first (August 25th) payment and the enrollment fee AT THE TIME OF ENROLLMENT regardless of when they enroll in this plan.

      • Enrollment Fee - $100.00 for plans $2,499.99 or less & $150.00 for plans $2,500.00 or more. 

      • The last date to enroll in this plan for Fall is September 30th

      • The only way to enroll for this plan is by PHONE.  Students cannot enroll online. 

    • The 5 Month Payment Plan is offered before the fall semester begins.  

    • The 4 Month Payment Plan is offered to those students who are not able to make payment after payment due date.  Those students who enroll on the 4 Month Payment Plan are also responsible for a $100 Late Payment Fee in addition to the enrollment fee.


    Thumbnail sketches of coursework

    Thumbnail Sketches of Coursework


    Core courses

    Core Courses

    • ME 7334 - Fundamentals of Electronic Packaging

      • This course is an introduction into all aspects of the packaging of electronics covered in this degree program

    • ME 7342 – Introduction to Thermal Management of Electronics

      • This is an introductory course into all of the methods used for the thermal design and thermal management of electronic components and systems

    • ME 7343 - Electronic Packaging Materials: Processes, Properties, and Testing

      • This course covers all of the materials used in electronic components and systems and the properties of those materials

    • ME 7358 – Vibration Analysis of Electronic Systems

      • This course introduces all aspects of the mechanical design of electronic components and systems, particularly in the areas of vibrations and mechanical shock


    Packaging electives

    Packaging Electives

    • ME 7314 - Introduction to Microelectromechanical Systems (MEMS) and Devices

      • This course develops the basics for microelectromechanical devices and systems, including microactuators, microsensors, and micromotors, micromachining techniques (surface and bulk micromachining), and microfabrication techniques

    • ME 7335 - Convective Cooling of Electronics

      • This course reviews of the fundamentals of convection heat transfer, followed by applications of these principals to the convective cooling of electronic components and systems. Special topics in convective cooling, such as spray cooling, jet-impingement cooling, microchannel cooling, and heat pipe applications will also be included.

    • ME 7344 - Conductive Cooling of Electronics

      • This course reviews of the fundamentals of conduction heat transfer, followed by application to the conductive cooling of electronics. Special topics in conductive cooling, such as contact conductance, interface thermal resistance, heat spreaders, thermal interface materials, phase change materials, and thermoelectric devices


    Packaging electives continued

    Packaging Electives (continued)

    • ME 7346 - Application of Computational Techniques to the Mechanical and Thermal Design of Electronic Systems

      • This course focuses on the utilization of CAD tools to develop mechanical and thermal models of electronic systems and to design elements of these systems

    • ME 7348 - Thermal, Fluid, and Mechanical Measurements in Electronics

      • This course covers all methods of experimental measurements used in the design and testing of electronic systems. In addition, proper experimental procedures will be discussed

    • ME 7359 - Analysis and Design of Optoelectronic Packaging

      • This course will cover optical fiber interconnections, packaging for high-density optical back planes, selection of fiber technologies; semi-conductor laser and optical amplifier packaging, optical characteristics and requirements, optical alignment, and packaging


    Packaging electives continued1

    Packaging Electives (continued)

    • ME 7360 - Electronic Product Design and Reliability

      • This course will investigate the failures, failure modes, and failure mechanisms in electronic systems, including failure detection, environmental stress tests, and failure analysis.

      • In addition, this course will cover temperature as a reliability factor and provide an overview of high temperature electronics, the use of silicon devices at high temperatures, and the selection of passive devices for use at high temperatures.

    • ME 5/7363 - Electronic Manufacturing Technology

      • This course covers an introduction to the electronics manufacturing industry, electronic components, interconnections, printed wiring boards, soldering and solderability, automated assembly, including leaded component insertion and surface mount device placement


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