lecture 8 micromouse pcb design guide
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Lecture 8 Micromouse PCB design guide. Components Placement. Place library for encoder/motor to (0,0) to make it symmetrical from left and right Draw a middle reference line. Use dimension layer to draw the outline of the mouse, make sure the length is not exceed 100mm to save cost.

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Presentation Transcript
slide3

Place library for encoder/motor to (0,0) to make it symmetrical from left and right

  • Draw a middle reference line
slide4

Use dimension layer to draw the outline of the mouse, make sure the length is not exceed 100mm to save cost

slide5

Draw the guide line for the wall and posts in order to determine the sensor point angles later

slide6

Place the components at proper position

  • Place sensors at proper position, make sure they point to proper location
  • Make sure the components won’t be blocked by motor mount/encoder
where should sensors point to
Where should sensors point to?
  • Side sensors point to somewhere a little to the front of the post, when the mouse is at the center of the cell
  • Front sensors point outwards about 5-10 degrees, make so it won’t point to the side of the wall when at 1.5 cells away
settings
Settings
  • No mask for via>12 mills
  • Make 1 mill grid when drawing and parts placing
traces
Traces
  • MCU pins from LQFP package are 10-12 mill wide.
  • Try maximum tracer width for power/analog signal related trace
  • Thinner traces are OK for digital signal
trace thickness
Trace thickness
  • Wider trace for high power intensive parts, ex. Vbat Power trace
  • Thinner for signal traces
  • Polygon may needed to give more area for power trace for thermo performance
trace style
Trace style
  • Shorter the possible
  • Less turn possible
  • 45 degree turns
  • good
  • bad
small via
Small via
  • 12 mill via minimum
  • Good for signal trace
  • Better be masked
large via
Large Via
  • Larger via for power/thermo intensive trace/pad/polygon
  • Should not be masked
  • Drill shouldn’t bee too big
polygon
Polygon
  • First to the First: Don’t make a single GND polygon for the entire PCB!!!!!
  • Why? Because it will transfer heat to temperature sensitive components easily from some heat intensive parts
  • You should place polygon selectively, only on those parts generate a lot of heat(5V LDO, motor driver) or the parts are sensitive with heat(MCU, analog device)
sample 1
Sample 1
  • Motor driver, GND polygon, on both sides
sample 2
Sample 2
  • Not make the polygon connected between 5V and MCU since MCU is temperature sensitive
distincted ground
Distincted Ground
  • MGND
  • DGND
  • AGND
  • Don’t mix them before they reach the negative terminal of battery
  • AGND is temperature sensitive, make the trace avoid the hot area if possible
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