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Package types. Livello 1 : Connecting die to package. Wire Bonding Backside of the die is attached to the substrate. Pads are individually connected to pins with Al or Au wires. Solder bump bonding

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Livello 1 connecting die to package
Livello 1: Connecting die to package

  • Wire Bonding

  • Backside of the die is attached to the substrate.

  • Pads are individually connected to pins with Al or Au wires


Package types

  • Solder bump bonding

  • Solder bumps are small spheres of solder (solder balls) that are bonded to contact areas or pads of semiconductor devices and subsequently used for face-down bonding.


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