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GTK General meeting. Michel Morel CERN PH/ESE/FE. GTK assembly carrier equipped with µchannel cooling. Top view. Bottom view. GTK carrier assembly specifications. !! High speed serial links (6 Gb/s per chip) between the readout chips and optical transmitter modules

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gtk general meeting

GTK General meeting

Michel Morel

CERN PH/ESE/FE

slide2

GTK assembly carrier equipped with µchannel cooling

Top view

Bottom view

GTK General meeting Louvain M.Morel

slide3

GTK carrier assembly specifications

!! High speed serial links (6 Gb/s per chip) between the readout chips and optical transmitter modules

µ via technology board is foreseen around the readout chips

Each readout chip powered by 3 different power supplies

High current in the power supplies (25A)

GTK General meeting Louvain M.Morel

slide4

GTK carrier assembly Bloc Diagram

12 X 3.125 Gbps

Parallel Optical link

P CLK LVDS

GTK Readout ASIC

0

Precision CLK

OC-12

Receiver

SY89113U

Fanout Buffer

SO-3 & Ser Conf

ZL60113

TRANSMITTER

GTK Readout ASIC

1

Dig CLK LVDS

GTK Readout ASIC

2

Dig CLK

OC-12

Receiver

SY89113U

Fanout Buffer

SO-3 & Ser Conf

ZL60113

TRANSMITTER

GTK Readout ASIC

3

Ser Conf LVDS

GTK Readout ASIC

4

ZL60114

RECEIVER

S0-3 & Ser Conf

ZL60113

TRANSMITTER

Serial Conf

GTK Readout ASIC

5

12 X 3.125 Gbps

Parallel Optical link

GTK Readout ASIC

6

Reset LVDS

S0-3 & Ser Conf

ZL60113

TRANSMITTER

SY89113U

Fanout Buffer

RESET

GTK Readout ASIC

7

GTK Readout ASIC

8

JTAG

S0-3 & Ser Conf

ZL60113

TRANSMITTER

GTK Readout ASIC

9

A<3..0> Adress

Global_Reset

10 x Test input

-----------------------------

10 x SEU

10 x Temp Monitoring

10 x Test output

10 x 1V2 A

10 x 1V2 D

10 x 2V5 D

1 x 3V3

1 x 5V

Power Supplies

GTK General meeting Louvain M.Morel

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