Report to transition ieee tc task force on embedded systems codesign into ieee technical committee
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Report to Transition IEEE TC Task Force on Embedded Systems Codesign into IEEE Technical Committee. Alex Orailoglu [email protected] CSE Department University of California, San Diego. TF ESC IP Generation. Conference, Community Formation Industrial Sessions and Participation

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Alex Orailoglu [email protected] CSE Department University of California, San Diego

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Report to transition ieee tc task force on embedded systems codesign into ieee technical committee

Report to TransitionIEEE TC Task Force on Embedded Systems CodesignintoIEEE Technical Committee

Alex Orailoglu

[email protected]

CSE Department

University of California, San Diego

TF to TC Embedded Systems Codesign


Tf esc ip generation

TF ESC IP Generation

  • Conference, Community Formation

  • Industrial Sessions and Participation

  • Journal Special Issues

  • Collaborative Keynotes

TF to TC Embedded Systems Codesign


Conference community formation

Conference, Community Formation

  • SASP (IEEE Symposium on Application specific Processors) initiated in 2008

  • Symposium has been operating successfully

  • SASP has had paper submissions in the range of 60-70 in 2008 and 2009

  • SASP is 100% sponsored by IEEE Computer Society (TF ESC)

  • SASP is financially successful (generated surplus and met the $5K requirement)

  • Industry participation in PC and OC from Tensilica, SUN, HP, IBM, Thales, DE Shaw

  • SASP highly selective; typical paper acceptance rate 25% and below

TF to TC Embedded Systems Codesign


Sasp community analysis

SASP Community Analysis

  • SASP 2008 paper submissions

    • US (40%), Asia (23%), Europe (33%)

    • Submissions from China, UK, Switzerland, France, Netherlands, Italy, Germany, Japan, Portugal, India, Tunisia, Iran, Czech, Singapore, Canada

  • SAS9 2009 paper submissions

    • US (43%), Asia (18%), Europe (33%)

    • Submissions from China, UK, Switzerland, France, Netherlands, Italy, Germany, Korea, Finland, Iran, Brazil, Turkey, Pakistan, New Zealand

  • Industry participation from Microsoft, ARM, LSI, Novelics, Consentry Networks, Coware, Nokia, Thales, Infineon, IBM, Brightscale, ARC

TF to TC Embedded Systems Codesign


Industrial sessions and participation

Industrial Sessions and Participation

  • Industrial Session in 2008 on

    • GP vs. ASP: Are ASIPS just a short-term transition in computing?

    • Participants from major ES companies, such as Tensilica, Novelics, CoWare, ARC

  • Industrial Session in 2009 on

    • Reconfigurable application specific multicore-computing: Possible futures

    • Invited participants from ST Micro, Xilinx, Altera, Recore, Abound Logic, Maxeler, Nvidia, Tensilica

    • Invitations composed of CEOs, CTOs, Senior VPs and Chief Scientists

TF to TC Embedded Systems Codesign


Journal special issues

Journal Special Issues

  • Special issue in IEEE Transactions on VLSI Systems on October 2008

    • Guest editors: Peter Petrov (U. Maryland)

      Paolo Ienne (EPFL, Switzerland)

  • Special issue in IEEE Transactions on Computer Aided Design on Fall 2009

    • Paper selection concluded May 2009

    • Guest editors: Alex Orailoglu (UC San Diego)

      Laura Pozzi (U. Lugano, Switzerland)

  • Two special issues planned for 2010

TF to TC Embedded Systems Codesign


Collaborative keynotes

Collaborative Keynotes

  • Two keynotes open to Design Automation Conference attendees in 2008

    • Anton, an Application-Specific Supercomputer for Molecular Dynamics Computations by Cliff Young, D. E. Shaw Research

    • Application-Specific Processors for Client-side Computing: Opportunities and Pitfallsby Sanjay Patel, U Illinois, Urbana-Champaign

  • Two keynotes open to DAC attendees: July 2009

    • Currently finalizing invitations with major company CEOs/CTOs, and leading academics

TF to TC Embedded Systems Codesign


Alex orailoglu aorailoglu ucsd cse department university of california san diego

  • Mission Statement

  • The ESC technical committee organizes a vibrant community of researchers focusing on research and development in system level issues including embedded systems architectures, hardware, software, computational models, reliability and CAD. These focus areas have traditionally been fostered by IEEE Computer Society

  • Embedded Software: Compiler, Operating Systems, Runtime Environments and Simulation Methodologies for Embedded Systems

  • Embedded Architectures: Application-specific architectures in the face of nanoscale challenges, multicores, customizable processors

  • Reliability: Debugging, verification and integration testing for large scale embedded systems

  • CAD for ES: Design methods and tools for simulation, modeling, design capture, design synthesis etc.

TF to TC Embedded Systems Codesign


Alex orailoglu aorailoglu ucsd cse department university of california san diego

  • The Embedded Systems Task Forceï‚®Technical Committee leadership team:

  • Chair: Alex Orailoglu ([email protected])

  • CSE Dept, University of California at San Diego

  • Pai Chou ([email protected])

    EECS Dept, University of California at Irvine

  • ViceChair: Peter Petrov ([email protected])

    ECE Department, University of Maryland, College Park

  • Paolo Ienne ([email protected])

    EPFL, Lausanne, Switzerland

  • Laura Pozzi ([email protected])

    University of Lugano, Switzerland

  • Grant Martin ([email protected])

    Chief Scientist, Tensilica

  • Tughrul Arslan ([email protected])

    University of Edinburgh, UK

  • Georgi Gaydadjiev ([email protected])

    TU Delft, Netherlands

TF to TC Embedded Systems Codesign


Esc continuing detailed goals

ESC Continuing Detailed Goals

  • Sponsor and/or organize workshops, symposia and conferences in related topical areas

    • Build on the success of SASP

    • Organize satellite workshops with SASP?

  • Continue to organize and publish journal special issues

  • Disseminate e-newsletter that will be single source for important announcements

  • Develop tutorials targeting a technical as well as a non-technical audience

  • Establish synergistic relationships between TC ESC and other IEEE Comp Soc TCs, CEDA

  • Continue on developing stronger industrial links through industry sessions in SASP, collaborative keynotes, and increased industry participation on program committees

TF to TC Embedded Systems Codesign


Questions

Questions?

TF to TC Embedded Systems Codesign


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