Sensor Coordinates
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Sensor Coordinates. FE Chip Coordinates. 59800. Bump Bond Pad Row#0, Col#0 Ø = 18. Bump Bond Pad Ø = 12/18. 17800. 725. 275. Sensor Mark 140 x 140. 2595. 145. FE Chip#8 Col#0. FE Chip#F Col 17. z. x. FE PAD#2 110 x 210 LM Structure. Seen from Top. Sensor. M2. M1.

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725

Sensor Coordinates

FE Chip Coordinates

59800

Bump Bond Pad

Row#0, Col#0

Ø = 18

Bump Bond Pad

Ø = 12/18

17800

725

275

Sensor Mark

140 x 140

2595

145

FE Chip#8

Col#0

FE Chip#F

Col 17

z

x

FE PAD#2

110 x 210

LM Structure

Seen from Top


725

Sensor

M2

M1

M2-W8-X

M3

M4

M3-W8-X

M3-W8-Z

FE PAD#2

110 x 210

LM Structure

M3-WF-Z

M4-WF-Z

M3-WF-Z

z

FE Chip#8

FE Chip#F

x

Seen from Top

W8

WF


Wire bond to sensor mark

Wire Bond to Sensor Mark

  • In the table on the right there are the distances from each of the 4 sensor mark to the first wire-bond pad of the 8 FE chips opposite to the barrel pigtail.

  • The FE chips are: FE#8,…, FE#F.

  • The reference system is the one used in the stave.


725

Definition of module pitch in Z

Sensor Marks

PITCH

PITCH

PITCH

PITCH

M1A

M0

M1C

M2C

M2A

z


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