Standards and Specifications The Seven Wonders of Design Innovation

1. Standards and SpecificationsThe Seven Wonders of Design Innovation INTRODUCTION TO IPC & STANDARDIZATION

2. Minimum Standards Tool Kit

3. Membership Development PCB Manufacturers 382 EMS Companies 374 Suppliers 636 OEMs 753 Government/Others _198__ Total 2,343 Companies IPC Designers Council 1,100 Individuals

4. Major IPC Program Areas Management Programs Industry Programs Technical Programs Education, Training & Certification Market Research/Statistical Programs Public Policy Advocacy There is a reason why IPC has over 2300 member companies around the globe with more joining each and every day. It’s the variety of services we offer the industry through market research, industry programs, technical programs, management programs, education and public policy. There is a reason why IPC has over 2300 member companies around the globe with more joining each and every day. It’s the variety of services we offer the industry through market research, industry programs, technical programs, management programs, education and public policy.

5. Technical Programs The central nervous system of IPC is the Technical Department. IPC technical programs and its staff are in regular contact with the people who make the industry work. Technical programs works with technical committees consisting of industry representatives to develop standards, begin and maintain positive relationships with other organizations and keep a finger on the pulse of an ever changing industry.The central nervous system of IPC is the Technical Department. IPC technical programs and its staff are in regular contact with the people who make the industry work. Technical programs works with technical committees consisting of industry representatives to develop standards, begin and maintain positive relationships with other organizations and keep a finger on the pulse of an ever changing industry.

6. Standards & Specifications Standards, specifications and guidelines developed for PCB design, manufacture and assembly ANSI-Accredited Standards Developing Organization (SDO) Industry technology roadmaps Software Code Standards for Interoperability Technical Programs One of the main tasks of the IPC Technical Department is the development of standards and specifications. IPC has set up a strict standardization procedure, which has been accepted by the American National Standards Institute, the governing body over standards developing organizations. ANSI approval of a standard or specification ensures that the document was developed with openness and fairness and was approved by consensus. Under technical programs and in conjunction with market research, IPC also develops roadmaps for the industry. The Electronic Interconnection Roadmap is usually done on a two-year cycle. IPC has also started efforts on a Lead-free roadmap.One of the main tasks of the IPC Technical Department is the development of standards and specifications. IPC has set up a strict standardization procedure, which has been accepted by the American National Standards Institute, the governing body over standards developing organizations. ANSI approval of a standard or specification ensures that the document was developed with openness and fairness and was approved by consensus. Under technical programs and in conjunction with market research, IPC also develops roadmaps for the industry. The Electronic Interconnection Roadmap is usually done on a two-year cycle. IPC has also started efforts on a Lead-free roadmap.

9. Technical Committees 21 General Committees 160 Subcommittees and Task Groups Consist of industry peers Started writing standards in 1959 (46 years ago) Responsible for round robin test programs Managed by Technical Activities Executive Committee (TAEC) Technical Programs As just mentioned, standards and specifications are developed by a consensus group. These groups fall under the various IPC technical committees. Committees, which consist of your peers, take on such tasks as standardization, conducting round robin studies and forming groups to work on non-IPC projects that affect them in some way, such as UL Recognition. Anyone can take part in one of the various IPC committees, subcommittees or task groups. So, whether your interest lies in assemblies, base materials, bare board qualification, flexible circuits, HDI, design or test, we have a group for you. And if we don’t have one you see necessary, let us know. The IPC standardization process is under the management of the expert volunteer technical leaders that serve as chairmen of IPC’s technical committees.As just mentioned, standards and specifications are developed by a consensus group. These groups fall under the various IPC technical committees. Committees, which consist of your peers, take on such tasks as standardization, conducting round robin studies and forming groups to work on non-IPC projects that affect them in some way, such as UL Recognition. Anyone can take part in one of the various IPC committees, subcommittees or task groups. So, whether your interest lies in assemblies, base materials, bare board qualification, flexible circuits, HDI, design or test, we have a group for you. And if we don’t have one you see necessary, let us know. The IPC standardization process is under the management of the expert volunteer technical leaders that serve as chairmen of IPC’s technical committees.

10. Activities with Other Organizations Membership and Active Participation National Electronics Manufacturing Initiative (NEMI) now iNEMI American National Standards Institute (ANSI) Underwriters Laboratories (UL) Technical Programs Through the IPC technical programs come strong bonds with other sister organizations, both nationally and internationally. This slide displays several organizations with which IPC has had a long-standing working relationship. Staying involved with other organizations that affect our industry only helps to keep our industry more informed, which gives them all the same competitive advantage. Through the IPC technical programs come strong bonds with other sister organizations, both nationally and internationally. This slide displays several organizations with which IPC has had a long-standing working relationship. Staying involved with other organizations that affect our industry only helps to keep our industry more informed, which gives them all the same competitive advantage.

11. Activities with Other Organizations Joint Standards Activity Japan Printed Circuit Association (JPCA) Wiring and Harness Manufacturers Association (WHMA) Electronic Industries Alliance (EIA) Joint Electron Device Engineering Council (JEDEC) Jisso International Council (JIC) Technical Programs Here we see some organizations IPC works with on joint standards activities. Again, by sharing resources with each other, we create better standards and specifications. Of special note on this slide is the JPCA, which worked with IPC on the development of two successfully published standards; one on HDI materials and one on flexible circuits, and there is one more HDI document on the way. Bringing together our two strong organizations to come to consensus on standards covering such fast emerging technologies creates consistency and improves competitive fairness.Here we see some organizations IPC works with on joint standards activities. Again, by sharing resources with each other, we create better standards and specifications. Of special note on this slide is the JPCA, which worked with IPC on the development of two successfully published standards; one on HDI materials and one on flexible circuits, and there is one more HDI document on the way. Bringing together our two strong organizations to come to consensus on standards covering such fast emerging technologies creates consistency and improves competitive fairness.

12. International Activities Liaison “D” Status to IEC TC91 U.S. Technical Advisor (TA) IEC TC91 on SMT Chairmanship of IEC TC91 on SMT Secretary, US TAG on IEC TC93 on EDA US TAG of ISO Task group on Solder materials IPC standards internationally recognized Technical Programs IPC works very hard to develop standards that are accepted on an international level. Having internationally accepted standards develops consistency for companies from different countries specifying everything from base materials to assembled product. Most of the IPC activity is done through the IEC, but we recently developed two joint standards on two of the most emerging technologies in our industry: flexible circuits and HDI. Both specifications were developed jointly by IPC and JPCA technical committees, who realized what a tremendous first step it was for our two countries to be working together.IPC works very hard to develop standards that are accepted on an international level. Having internationally accepted standards develops consistency for companies from different countries specifying everything from base materials to assembled product. Most of the IPC activity is done through the IEC, but we recently developed two joint standards on two of the most emerging technologies in our industry: flexible circuits and HDI. Both specifications were developed jointly by IPC and JPCA technical committees, who realized what a tremendous first step it was for our two countries to be working together.

13. World Electronic Circuits Council China Printed Circuit Association (CPCA) European Federation of Interconnection and Packaging (EFIP) Hong Kong Printed Circuits Association (HKPCA) Indian Printed Circuit Association (IPCA) Japan Printed Circuits Association (JPCA) Taiwan Printed Circuits Association (TPCA) Korea Printed Circuits Association Technical Programs The international activities with other organizations go beyond just standards development. Whether it’s keeping in touch to stay abreast of things happening with companies in your country, <next slide> The international activities with other organizations go beyond just standards development. Whether it’s keeping in touch to stay abreast of things happening with companies in your country, <next slide>

14. Current Major Initiatives Optoelectronics Lead-Free & Halogen Free issues Embedded components Wire Harness workmanship Electronics enclosures 2004/2005 International Technology Roadmap Material Declaration Enterprise Communication Standards Technical Programs The IPC technical department also makes sure to remain on the cutting edge of the industry. There are currently two major initiatives the technical department is quite active in. <Pause> The lead free movement is heading our way, and due to legislation in Europe and drop dead dates for lead removal by Japanese companies, IPC realizes the pressure that will be put on US companies. To assist the US companies with this, IPC has focused an entire conference on the issue and will be developing a roadmap for the removal of lead. Another project IPC is focused on right now is GenCAM, which solves CAD to CAM transfer language problems. Using this tool, the user is now taken from initial design to final assembly.The IPC technical department also makes sure to remain on the cutting edge of the industry. There are currently two major initiatives the technical department is quite active in. <Pause> The lead free movement is heading our way, and due to legislation in Europe and drop dead dates for lead removal by Japanese companies, IPC realizes the pressure that will be put on US companies. To assist the US companies with this, IPC has focused an entire conference on the issue and will be developing a roadmap for the removal of lead. Another project IPC is focused on right now is GenCAM, which solves CAD to CAM transfer language problems. Using this tool, the user is now taken from initial design to final assembly.

16. A Global Membership 78% North America 11% Europe 9% Asia 2% Rest of World Members in 47 Countries

17. How Does the Standards Process Work? Task groups develop drafts of new standards and resolve comments at IPC meetings Participants represent their company Four stages to get comments from industry Project Submission - TAEC approves form Working Draft - gets project started Proposal -solicits comments from industry Interim Final - resolves comments for balloting

18. Standard Development Cycle

19. Terms and Definitions Terminology is the key to good communication IPC-T-50 initial release in 1965 Next revision is “H” scheduled for 2007 Use of the Treutler Classification Code Builds on the standardization process Contains over 2000 terms Has international recognition IEC 60194 – identical except spelling

20. Classification Code 1-Administration 2-Engineering and Design for elect. pkg 3-Components for electronic packaging 4-Materials for electronic packaging 5-Interconnect board fabrication processes 6-Types/performance for Interconnections 7-Assembly processes 8-Types/performance for assemblies 9-Quality/reliability for boards/assembly

21. Second Digit Family 6 ID 60-General terms 61-Rigid printed boards (organic) 62-Flexible printed boards (organic) 63-Flex-rigid printed boards (organic) 64-Discrete wiring boards (organic) 65-Inorganic printed boards (ceramic etc.) 66-Molded structures (three dimensional) 67-Hybrid/Multichip module structures 68-(Reserved for future expansion) 69-Other interconnecting structure terms

22. CC Description Examples

23. IPC-T-50 Published Embedded Component 30.0436 A discrete or active component that is fabricated as an integral part of a printed board. (See Figure E-1.)

24. IPC-T-50 Published Discrete Component 30.0392 A separate part of a printed board assembly that performs a circuit function, e.g., a resistor, a capacitor, a transistor,etc. Active Device 30.0016 An electronic component whose basic character changes while operating on an applied signal. (This includes diodes, transistors, thyristors, and integrated circuits that are used for the rectification, amplification, switching, etc., of analog or digital circuits in either monolithic or hybrid form.) Passive Component (Element) 30.1468 A discrete electronic device whose basic character does not change while it processes an applied signal. (This includes components such as resistors, capacitors, and inductors.)

25. Terms and Definitions

26. Terminology Blank * 41.1339 An unprocessed or partially processed piece of base material or metal- clad base material, that has been cut from a sheet or panel, that has the rough dimensions of a printed board. (See also ‘‘Panel.’’) Panel * 41.1463 A rectangular sheet of base material or metal-clad material of predetermined size that is used for the processing of one or more printed boards and, when required, one or more test coupons. (See also ‘‘Blank.’’) Fabrication Panel A rectangular sheet of base material or metal-clad material of predetermined size that is used by a printed board manufacturer for the processing of one or more printed boards and, when required, one or more test coupons. (See also ‘‘Blank.’’) Board * 60.0118 see ‘‘Printed Board,‘‘ and ‘‘Multilayer Printed Board.’’ Printed Board (PB) * 60.1485 The general term for completely processed printed circuit and printed wiring configurations. (This includes single-sided, double-sided and multilayer boards with rigid, flexible, and rigid-flex base materials.)

27. Terminology Multilayer Printed Board * 60.1227 The general term for a printed board that consist of rigid or flexible insulation materials and three or more alternate printed wiring and/or printed circuit layers that have been bonded together and electrically interconnected. Finished Board see “Printed Board” Finished Panel A rectangular sheet of base material or metal-clad material of predetermined size that is used for the processing of one or more printed board designs and, when required, one or more test coupons which is extracted from the fabrication panel to deliver to the customer or to the next level of fabrication. (see Assembly Pallet) Assembly* 80.1327 A number of parts, subassemblies or combinations thereof joined together. (Note: This term can be used in conjunction with other terms listed herein, e.g., ‘‘Printed Board Assembly’’) Printed Board Assembly* 80.0911 The generic term for an assembly that uses a printed board for component mounting and interconnecting purposes. Array* 22.0049 A group of elements or circuits arranged in rows and columns on a base material.

28. Terminology Printed Board Assembly Array A group of assemblies, all of the same design, arranged in rows and columns on a panel. Assembly Pallet The generic term for the assembly that uses a finished panel, as delivered from the board fabricator, of the same or different designs, for element and circuit component mounting and attachment to the board interconnections layers. The board arrangement on the pallet may be random or in the form of an array; the pallet may also include coupons for testing.

29. Hierarchy of IPC Design Standards(2220 Series)

30. Hierarchy of Printed Board Performance Standards(6010 Series)

31. Applicable IPC Standards -SM-782; Land Pattern Considerations -7095; BGA Process Implementation -2315; HDI & Microvia Design Guide -SM-785; SMT Reliability Testing -D-279; Design for SMT Reliability J-STD-001; Soldering Requirements -A-610; Assembly Acceptability -6010; Printed Board Series J-STD-004/005; Solder Flux/Paste

32. Scope Example (land patterns) This standard provides information on land pattern geometries used for surface attachment of electronic components. The intent of the information presented is to provide the appropriate size, shape and tolerance of surface mount land patterns to insure sufficient area for the appropriate solder fillet or solder volume. Also to allow for inspection, testing, and rework of those solder joints.

33. Scope (continued) Land pattern geometry may be different based on the type of soldering used to attach the electronic part, however land patterns are defined in such a manner that they are transparent to the process. Standard configurations are for manual designs & for computer-aided design. Parts are mounted on one or both sides, subjected to wave, reflow, or other type of soldering

34. Scope (continued) Although patterns are dimensionally defined and since they are a part of the printed board circuitry geometry, they are subject to the producibility levels and tolerances associated with plating, etching, assembly or other conditions. The producibility aspects also pertain to the use of solder mask and the registration required between the solder mask and the conductor patterns.

35. Performance Classes Three performance classes have been established to reflect progressive increases in sophistication, functional performance requirements and testing/ inspection frequency. There may be an overlap of equipment categories in different classes. The user is responsible to specify, in the contract or purchase order, the product performance class.

36. Class 1 - General Electronic Products Includes consumer products, some computer and computer peripherals suitable for applications where cosmetic imperfections are not important and the major requirement is function of the completed printed board.

37. Class 2 - Dedicated Service Electronic Products Includes communications equipment, sophisticated business machines, instruments where high performance and extended life is required and for which uninterrupted service is desired but not critical. Certain cosmetic imperfections are allowed.

38. Class 3 - High Reliability Electronic Products Includes the equipment and products where continued performance or performance on demand is critical. Equipment downtime cannot be tolerated and must function when required such as in life support items or flight control systems. Applications where high levels of assurance are required and service is essential.

39. Interpretation “Shall,” the emphatic form of the verb, is used throughout this specification whenever a requirement is intended to express a provision that is binding. Deviation from a “shall” requirement may be considered if sufficient data is supplied to justify the exception. The words “should” and “may” are used whenever it is necessary to express non-mandatory provisions. “Will” is used to express a declaration of purpose. To assist the reader, the word “shall” is presented in bold characters.

40. Complexity Levels Land pattern determination methods: Exact details based on component specifications, board manufacturing and component placement accuracy. The land patterns are restricted to a specific component, and have an identifying land pattern number Equations used for new components or to alter the given information to achieve a more robust solder connection, when used in particular situations

41. Level A: Maximum For low-density product applications, the 'maximum' land pattern condition have been developed to accommodate wave or flow solder of leadless chip devices and leaded gull- wing devices. The geometry furnished for these devices, as well as inward and “J”-formed lead contact device families, may provide a wider process window for reflow solder processes as well.

42. Level B: Median Products with a moderate level of component density should consider adapting the 'median' land patterns. The median land patterns furnished for all device families will provide a robust solder attachment condition for reflow solder processes. The condition should suitable for wave or reflow soldering of leadless chip and leaded gull-wing type devices.

43. Level C: Minimum High component density typical of portable and hand-held product applications may consider the 'minimum' land pattern geometry variation. Selection of the minimum land pattern geometry may not be suitable for all product use categories.

44. Combination of Issues Performance classes 1, 2, and 3 are combined with that of complexity and density levels A, B, and C in defining electronic assembly conditions. As an example, combining the description as Levels 1A or 3B or 2C, would indicate the different combinations of performance and component density to understand fabrication and assembly requirements for manufacturing and end use environment.

45. Test Requirements Prior to starting a design, a testability review meeting should be held with fabrication, assembly, and testing. Testability concerns, such as circuit visibility, density, operation, circuit controllability, partitioning, and special test requirements and specifications are discussed as a part of the test strategy

46. Test Requirements During the design testability review meeting, tooling concepts are established, and determinations are made as to the most effective tool cost versus board layout concept conditions. During the layout process, any circuit board changes that impact the test program, or the test tooling, should be reported to determine the best compromise.

47. Board Test Requirements The testing concept should develop approaches that can check the board for problems, and also detect fault locations wherever possible. The test concept and requirements should economically facilitate the detection, isolation, and correction of faults of the design verification, manufacturing, and field support of the printed board assembly life cycle.

48. Assembly Testability The printed board assembly testability philosophy also needs to be compatible with the overall integration, testing and maintenance plans. This includes: The factory testers to be used How integration and test is planned When conformal coated is applied Depot & field test equipment capability Personnel skill level

49. Need for Automation Standards needed for design and assembly New concepts in Business process optimization for competitiveness A need for lower operating costs in business and Information Transfer (IT). Tight business alignment with IT is essential Development of internal and external Service Oriented Architecture is needed in order to manage the new culture change. Shorten product development cycles Increase product flexibility Solutions require continuous monitoring of industry progress & infrastructure growth

50. IPC to IEC Deployment IPC-SM-782 provided by US to IEC Countries agree to standardize Japan found that one land pattern is insufficient to design Sony Minicam™ assemblies Discussions review principles of mathematical model – tighten requirements Three geometries proposed for future IEC starts work on IEC-61188-5-1 thru -8 IPC supersedes SM-782A with IPC-7351 Computer model tested with PCB Libraries

56. Ribbon Leads greater than 0.625

57. Ribbon Leads less than 0.625

58. J LeadedParts

59. RectangularSquare endTerminations

60. Metal Electrical Face

61. Bottom Only Terminations

62. Leadless Chip Carriers

63. Inward L shapedLeads

64. Flat Lug Leads

65. Quad Flat No Lead

66. Small Outline No Lead

67. Design Considerations Land pattern concepts Component selection Mounting substrate design Assembly methods Method of test Phototool generation Meeting solder joint requirements Stencil fixture requirements Providing access for inspection Access for rework and repair

68. Manufacturing Allowance Manufacturing allowance must be considered in the design process The courtyard represents the starting point of the minimum area needed for the component and the land pattern Manufacturing, assembly and testing representatives should assist in determining the additional room needed to accommodate placement, testing, modification and repair

69. IPC-7351 Land Pattern Courtyard Determination

70. IPC-7351 Land Pattern Naming Convention

71. IPC-7351 Land Pattern Naming Convention Example

72. IPC-7351 Land Pattern Naming Convention Example (cont’d)

73. IPC-7351 Zero Component Rotations

74. IPC-7351 Zero Component Rotations

75. IPC-7351 Land Pattern Software Suite

76. Part Selection

84. IPC-7351 Land Pattern Viewer Shareware program included with IPC-7351 standard and available at www.ipc.org under “PCB Tools and Caculators” Portability – doesn’t require a Web browser Enhanced searching capabilities 1:1 relationship for components/graphics Easily updated through free download of .p library files and program revisions

85. Building on the Standards IPC website and listservs will provide feedback point for new land pattern generation Developing CAD interfaces Incorporating the Concepts into OffSpring (the child of GenCAM and ODB++) IPC-2581 (IEC 61182-2) Beta testing to start end of 2005 Many CAD CAM companies committed

86. IPC-2581 Beta Testing Data extraction from CAD CAM step and repeat plus process tolerance inclusion Design file review (Pad Stacks) versus layered data Assembly information tied to CAD libraries Provide updated viewer to industry Provide Gerber to 2581 converter

87. Function Mode

88. Logistic Header

89. History Record

90. Bill of Materials

91. Approve Vendor List

92. The Heart and Stamina

93. The Information Vessels

94. Step Description

96. Detail Descriptions

97. NIST Viewer

98. Gerber Conversion Evaluation

99. IPC-25XX Certification Develop concept for matrix Examine D-350 and GenCAM test plans Keep it simple Build on self declaration principles Establish legal documents for details Ask NIST software engineering for help with portal development Examine using 3rd party consultants

100. Conclusions The standard is Alive and Well The cooperative efforts are winning New parts require continuous monitoring The IPC/PCB Libraries arrangement is a major benefit to the design community The IPC list servers are a way to keep in touch