Gtk micro channel frame
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GTK Micro Channel Frame. Thermal layout. Georg Nüßle. Content. Model thermal frame (simulation) Layout channel geometry (analytical). Content. Model thermal frame (simulation) Layout channel geometry (analytical). Geometry and Boundaries. Cooling frame with sensor and chips.

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GTK Micro Channel Frame

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Gtk micro channel frame

GTK Micro Channel Frame

Thermal layout

Georg Nüßle


Content

Content

  • Model thermal frame (simulation)

  • Layout channel geometry (analytical)

GTK Cooling Meeting


Content1

Content

  • Model thermal frame (simulation)

  • Layout channel geometry (analytical)

GTK Cooling Meeting


Geometry and boundaries

Geometry and Boundaries

  • Cooling frame with sensor and chips

GTK Cooling Meeting


Geometry and boundaries1

Geometry and Boundaries

  • Cooling frame with sensor and chips

  • Cut through complete assembly

GTK Cooling Meeting


Geometry and boundaries2

Geometry and Boundaries

  • Cooling frame with sensor and chips

  • Cut through complete assembly

  • ASIC digital part 6mm long

  • That means micro channel area 6mm wide

6mm

GTK Cooling Meeting


Geometry and boundaries3

Geometry and Boundaries

  • Cooling frame with sensor and chips

  • Cut through complete assembly

  • ASIC digital part 6mm long

  • That means micro channel area 6mm wide

  • Simplified model: half model, slice of 1mm

  • Cover wafer 100µm thick

  • MC wafer 400µm thick

  • Channel height 300µm

  • Channel width 100µm

  • Wall width between channels 100µm

GTK Cooling Meeting


Geometry and boundaries4

Geometry and Boundaries

Fixed temperature on channel walls, -20°C (Junction Temperature)

Heat source: digital 4W/cm2, analog 0.5W/cm2

Glue between ASIC and mc frame, 0.3W/m/K

Bonding between cover and mc wafer

  • Bump bonds, ASIC and Sensor, 0.12W/m/K

  • SnAG3.5 -> 33W/m/K

  • Pixel area 300µm x 300µm, bump diameter 20µm

  • Area ratio gives 0.12W/m/K for contiguous material

Symmetry, front, back and right side

GTK Cooling Meeting


Temperature distribution

Temperature Distribution

ASIC 100µm thick

∆T over Sensor ~ 9.3°C

-3.2837°C

~ -12.6°C

ASIC 200µm thick

∆T over Sensor ~ 7.2°C

-7.0151°C

~ -14.2°C

GTK Cooling Meeting


Total deformation

Total Deformation

Fixed support boundary condition

Symmetry boundary condition

Maximum Deformation ~ 3µm

ASIC 200µm thick, fixed by symmetry boundary condition on the right side

Maximum Deformation ~ 32µm

ASIC 200µm thick, fixed by symmetry boundary condition on the right side and by gluing on the PCB (Fixed support)

GTK Cooling Meeting


Thermal stress

Thermal Stress

Fixed support boundary condition

Symmetry boundary condition

Maximum Stress ~ 12.1MPa

ASIC 200µm thick, fixed by symmetry boundary condition on the right side

Maximum Stress ~ 65.7MPa

ASIC 200µm thick, fixed by symmetry boundary condition on the right side and by gluing on the PCB (Fixed support)

GTK Cooling Meeting


Content2

Content

  • Model thermal frame

  • Layout channel geometry (analytical)

GTK Cooling Meeting


Constraints

Constraints

  • Channel length 60mm

  • Width cooled area 6mm

  • ∆T between inlet and outlet 5K (-> m, ∆p)

  • Junction temperature = ∆TJ between wall and mean fluid temperature

  • ∆TJ depends on geometry and heat flux

60mm

  • K takes into account the ratio between the hydraulic area and the heat exchange area in a square shaped channel

∆TJ

GTK Cooling Meeting


Influence of the wall width

Influence of the Wall Width

  • Smaller walls lead to more channels and more heat exchange surface

  • ∆Tjunction and ∆pchannelrise with the wall width

GTK Cooling Meeting


T j and p with 50 m wall

∆TJand ∆p with 50µm wall

∆pin_out

∆TJ

∆TJ/ ∆pin_out

[K] / [bar]

channel width [µm]

GTK Cooling Meeting


T j and p with 1 00 m wall

∆TJand ∆p with 100µm wall

∆pin_out

∆TJ

∆TJ/ ∆pin_out

[K] / [bar]

channel width [µm]

GTK Cooling Meeting


T j and p with 200 m wall

∆TJand ∆p with 200µm wall

∆pin_out

∆TJ

∆TJ/ ∆pin_out

[K] / [bar]

channel width [µm]

GTK Cooling Meeting


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