Power & Hybrid Business Unit, Microelectronics

1. Power & Hybrid Business Unit, Microelectronics

2. Who Are we? Manufacturers of ultra reliable, high performance discrete semiconductors, power modules & hybrid microelectronic solutions designed to operate in any environment.

3. Our aim Through our flexibility and innovation, we aim to be recognised as trusted technology leaders in the aerospace, space, defence, medical and industrial markets.

4. What we do We research, design and manufacture an innovative range of MOSFETS, Bipolar Transistors, IGBTS, Power Modules, Diodes, Voltage Regulators and Customised Hybrid Microcircuits.

5. Aerospace Market Segments • Actuation • RADAR • Engine control • Flight subsystems . Space Market segments • Commercial Satellite - Telecoms, Broadcast, GPS, Weather • Exploratory Missions • Nano and Cube Satellites • Industrial Market segments • RF • Energy (oil/gas, renewable) • Audio • Power conversion & management • Customers and markets we serve • Military Market segments • Transportation • Communications • Homeland Defence • Aircraft • UAVs • MotorsportMarket segments • Formula 1 KERS • Touring Car KERS • Medical Market segments • Analytical equipment • Oncology equipment • De Fib

6. Our Portfolio 5

7. Power conversion: Inverters for wind & solar • Motor drive: HEV (on and off road), traction • Actuation: Hydraulic replacement, steering Discrete product for Satellite subsystems: • Nano and Cube satellites • GPS and Communications constellations • Weather/Scientific monitoring in Space • Concentrated Solar energy collection systems - using photo-voltaic cells • Motor drive actuation • Control systems • Inverters • Power factor correction

8. Automotive KERS Module • Customer Requirement • Power module solution for racing car Kinetic Energy Recovery System (KERS) • Solution • Custom Power Module • Custom configuration for application • Enhanced electrical, temperature and mechanical operation • Value Proposition • High temperature capability through using latest available technologies • Customised solution utilising the latest aerospace technologies to deliver high reliability • in a very harsh environment • Reduced weight through utilising latest materials to deliver a solution that is light yet extremely rugged • Core Competence • Flexibility – Closely working with the customer to realise their stringent technical & environmental requirements • Innovation – Utilising cutting edge mechanical and silicon/SiC technologies to achieve the spec • Pedigree - 35 years proven understanding of harsh environment requirements for high temperature and high reliability applications • Status • Successfully designed, built and winning races • Currently working with teams on the 2013 season • Proven experience and success at the highest performance level • Now looking to move into more race types • Reason for success? • Technical Innovation, experience in ultimate reliability and close engineering to engineering relationship with customer to understand their application and deliver a winning solution

9. Why Use Microelectronics • Power & Control Braking Resistors/Heaters High Power High Density & Reliability High Frequency

10. Thick Film Circuit Thick Film Ink Systems • Printing – Firing – Lasering • Gold, Silver, High and low Temperature Copper. • Resistor Printing directly in circuit. • Aspect ratio to 0.1mm track and gap width, +/- 0.03mm registration. • Automatic printing machines cassette to cassette process. • Automatic Laser trimming and continuity testing. • Clean-room facility operating on 3 shifts.

11. Technologies Substrates • Thick film on 96% alumina or aluminium nitride • Directly bonded copper (DBC) • Active metal braise on aluminium nitride & silicon nitride • High/Low temperature co-fired ceramic (HTCC/LTCC) • Steel • Aluminium • Thin film • FR4

12. Technologies • Component Attach • Solder Surface Mount • Polymer Component and die attach • Vacuum soldering (Power Die Attach) up to 400oC • Wire Bonding • Fine wire Au 17um to 33um • Fine wire Al 25um to 33um • Large diameter Al >125um • Packaging • Hermetic sealing • Projection weld & Seam Seal • Ceramic lidding • Glob-top / Silicon conformal coat

13. Microelectronics Assembly • Clean-room assembly operations. • Automated die bonding and wire bonding by pattern recognition. • Re-flow soldering and real time x-ray for void detection. • Aluminium fine wire bonding for high density signal and control circuits. • Large diameter Aluminium wire bonding for power circuits. • Hermetic sealing in inert atmosphere. • Leak detection. • Automatic test facilities.

14. Test, Burn-In and Screening Facilities Test Two General Purpose ATEs in Chip & Wire Clean Room. One reduced capability, DC only, ATE. One General Purpose ATE for one high volume product. Two ATEs for surface mount hybrids. One tray pack system – measure, accept/reject, pack. One PIC program/test XYZ system. Screening: Temperature cycling Constant acceleration Burn-in Fine & Gross Leak Test Pin D Bump Limited range vibration

15. MCM Engine Management Characteristics: • High Temperature Co-fired Ceramic (HTCC) • Chip and Wire (>1000 bonds) • High Density – Reduced size and Weight • Hermetically sealed • Engine mounted • Qualified –55oC to +150oC • Extended high temperature approval testing –55oC to +205 oC. • Completed 1000 hours +205oC • Completed 100 cycles –55oC to 205 oC Function: Engine management (FADEC) Custom ASIC - CPU, SRAM, EPROM, Oscillator Hi Reliability >20yrs life

16. MCM (Linear) Engine Management – Civil Aviation Function 3 Precision instrumentation amplifiers High common mode rejection Precision gain 3 Precision voltage references General purpose comparator Characteristics High operating temperature -55oC to +150oC Engine mounted Thin Film provides high accuracy and stability. Active Trimming to <0.01% tolerance. High precision and accuracy achieved with low cost Commercial Off The Shelf Components. Easily redesigned if amplifiers or reference become obsolete

17. DC/DC Converter – Civil Aviation Function: 3 Fixed DC Outputs from 14 to 36VDC 28 Watts Flight computer System Self Monitoring Self Diagnostics Characteristics: Mixed power and control circuits. High reliability >20 years life proven through extreme temperature cycling (>3,000 cycles) and HALT testing. Operating temperature -40oC to +95oC High packing density. Relatively low cost.

18. Safety Critical Fuse Function: 10 amps continuous current carrying capacity Fuse activation by external control Fusing time <5 second @ -40oC to +110oC Current applications: • Wing ice protections system, heater circuit protection (787 Dreamliner) Engine de-icing (Joint Strike Fighter) heater protection

19. Power MCM – Civil Aviation Function: Part of Wing Ice Protection System Switching controls power to wing tip or engine heaters (up to 5 amps continuous without heatsinking). Used in conjunction with thick film solder fuse protection device Characteristics: Each module contains 8 MOSFETs with low Rdson (<138m Ohm) High packing density and low assembly cost (35mm x 20mm) Good thermal management High reliability

20. Sonar Transducer Power Driver – Naval Systems Function: H Bridge MOSFET Switch to control power to sonar antenna Intelligent switch with ASIC control and MOSFET drivers. Characteristics: Each module contains 4 MOSFETs with low Rdson, drivers and control ASIC Uses mixed technologies Good thermal management High reliability

21. Flight Controls • Steel Dynamic Braking Resistors • For Aileron, Elevator and Rudder Actuation • Increased power dissipation by the use of bottom and top heat sinking • Low profile, Low Weight • Design-ins on: • Airbus A400M • A330 MRTT • Boeing 787 EBACS

22. Power Resistor – Motor Speed Control Design for high temperature environment Design for high reliability Low Profile, fits in motor housing 0.7 Ohm Resistance Curved shape to fit in housing • Test Requirement

23. AIN Heater – Toner Fusing Function: Instantaneous heating with individual control of 3 discrete segments 210°C in 2 seconds (1kW) Precision Temperature Control Characteristics: Large size printing AlN • Hi thermal Conductivity • Resistance to thermal shock Developed Inks with Fraunhofer Institute

24. Hi Frequency Telecoms Function: Frequencies up to 38GHz Hi Reliability Direct feed to antenna Small Package sizeCharacteristics: • Low loss at high frequency • Gold based ink • 0.38mm thick substrate down to 0.1% tolerance • Good thermal management • Precise track definition

25. Automotive – Mass Air Flow Sensor

26. Industrial – Ink Jet Print Head

27. Military and Avionics

28. Industrial – Power Module