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PUT JOSH WEB-STREAM HERE. 4/30/2010 Iowa State University EE492 – Senior Design II. IRP Review: A TEST CHIP FOR ELECTROMIGRATION STUDIES Karl Peterson (EE), Emmanuel Owusu ( CprE ), and Joshua Ellis (EE). Our project is special…. International collaboration

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4 30 2010 iowa state university ee492 senior design ii
4/30/2010

Iowa State University

EE492 – Senior Design II

IRP Review:A TEST CHIP FOR ELECTROMIGRATION STUDIESKarl Peterson (EE), Emmanuel Owusu (CprE), and Joshua Ellis (EE)

our project is special
Our project is special…
  • International collaboration
  • Product conceptualization & specification in addition to design
  • Integrated circuit (IC) rather than system design
  • Research-orientated objectives
problem statement
Problem Statement
  • Design a test chip to support ISU research on electromigration & IC reliability
  • The chip must include test structures composed of actual metal interconnects in a modern silicon process
  • Must be capable of interfacing with a controller to allow electrothermal conditions in the chip to be varied and monitored.
the big picture
The Big Picture
  • Electromigration – a complex physical phenomena that causes mechanical stress in metal interconnects
  • Important failure mechanism in ICs
  • Strong, non-linear dependence on current-density and temperature
  • Need models for electromigration that predict reliability under practical conditions

Electromigration in progress!

electromigration testing
Electromigration testing
  • Subject interconnects to variable electrothermal stresses
  • Measure time-to-failure of many samples
  • Analyze statistics, develop models, fit data, etc.
  • Use accelerated lifetime technique
  • Very high temperatures and current densities!
proposed solution
Proposed Solution
  • Proposed IC contains 8 identical metal test structures
  • Current-steering Digital-to-Analog Converter provides 0-25mA to test structure
  • On-die analog temperature sensing circuits
  • Open-circuit detection
  • Control logic with serial interface
  • Process technology:0.18 µm standard CMOS
test structure
Test Structure
  • Single-layer metal interconnect with serpentine pattern
test structure detail
Test structure – detail

Corners reinforced to mitigate current crowding

current steering dac
Current-Steering DAC
  • Current range of 0 to 25 mA
  • 7 bit resolution
  • LSB Current – 200 µA
  • Current-Steering Architecture
    • Binary-weighted sources
    • Constant power
  • Open Circuit Detection
    • Two inverters on the output

0010110

DAC

temperature sensor
Temperature sensor
  • Compact, CMOS-based sensor design
  • 5 sensor distributed throughout the floor plan
control logic
Control Logic
  • Serial interface
  • Simple protocol
  • Low pin-count
digital flow
Digital flow
  • Needed standard cell library for synthesis
  • Free, scalable library did not meet design rules of our process
  • Extensive work to customize , re-verify standard cells
auxiliary blocks
Auxiliary blocks
  • Master current switch
  • Reference-distribution network
physical design
Physical Design
  • Floorplan symmetry to prevent uncontrolled experimental variables
  • Significant redundancy and reinforcement of non-test blocks for reliability
  • Final design is 860 µm x 860 µm
simulations verification
Simulations & Verification
  • Analog verification: relevant performance parameters for each block tested over full PVT range with 500-run statistical simulations
  • Digital verification: functional simulations, timing analysis
  • System-level, mixed-signal verification: several long transient simulations covering typical operation sequence
top level functional simulation
Top-level Functional Simulation

#1 VDD rises

#2 Reference current starts

#3 <000> written to address reg.

#4 <0101010> written to address reg.

#5 master current switch enabled

#6 test current settles at predicted value

backup slides test results
Backup slides – test results
  • DAC
  • Temperature sensor
  • Top-level functional
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