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Wafer Bump X-Ray Inspection System High resolution type : TUX-8000

Wafer Bump X-Ray Inspection System High resolution type : TUX-8000. Features ▸ Fully automatic x-ray inspection system for wafer micro-bump. ▸ High resolution 130kV X-Ray source 0.4um-3um resolution switch-type open tube ▸ Inspection point : bump voids, diameter of bump

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Wafer Bump X-Ray Inspection System High resolution type : TUX-8000

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  1. Wafer Bump X-Ray Inspection System High resolution type: TUX-8000 Features ▸ Fully automatic x-ray inspection system for wafer micro-bump. ▸ High resolution 130kV X-Ray source 0.4um-3um resolution switch-type open tube ▸ Inspection point : bump voids, diameter of bump Inspection can be micro-voids of 1um level ▸ Maximum geometric magnification1000× ▸ Work size : 8inch/12inch Wafer ▸ Cleanroom Class 100 ▸ GEM/GEM300 Support ▸ Off-line manual inspection mode Fig. 1) Detected bump void image Fig. 2) Machinery appearance Fig. 3) High resolution x-ray tube Fig. 5) Wafer inspection table Fig. 4) Wafer convey robot

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