Al kapton bus development at riken
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Al - Kapton Bus development at RIKEN. Process Sticking Al – Kapton Etching Through hole Stacking Gold plating Issues Plan. Atsushi Taketani ([email protected]). ALICE Full Al BUS. 5 to 7 m m Al. 12 m m Polyimide. 5 to 7 m m Al. 5 m m glue. 12 m m Polyimide. 5 m m glue.

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Al - Kapton Bus development at RIKEN

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Al kapton bus development at riken

Al - Kapton Bus developmentat RIKEN

  • Process

  • Sticking Al – Kapton

  • Etching

  • Through hole

  • Stacking

  • Gold plating

  • Issues

  • Plan

Atsushi Taketani ([email protected])

2004-11-15 ALICE ITS


Alice full al bus

ALICE Full Al BUS

5 to 7 mm Al

12 mm Polyimide

5 to 7 mm Al

5 mm glue

12 mm Polyimide

5 mm glue

15 mm Al

5 mm glue

12 mm Polyimide

5 mm glue

50 mm Al

5 mm glue

12 mm Polyimide

5 mm glue

50 mm Al

5 mm glue

12 mm Polyimide

Glue 35 mm0.0122%X0

Al125 -130 mm 0.140% X0

Polyimide60 mm0.0210%X0

Total radiation length = 0.173 % X0

2004-11-15 ALICE ITS


Manufacture process

Aluminum

Aluminum

Polyimide

Polyimide

Polyimide

Manufacture Process

4 Through hole

1 Glued

5 Alignment and Etching

2 Etching

3 Glued

6 Gold plating

2004-11-15 ALICE ITS


Sticking al kapton

8 micron m Polyimide (Ink)

12 micron m Al

Sticking Al - Kapton

Press with heat

No glue!

2004-11-15 ALICE ITS


Etching

Etching

ALICE BUS Vertical

ALICE BUS Horizontal

I bring most of the samples which I show in slides.

Trying 30 micron line width!

2004-11-15 ALICE ITS


Our trial pattern

Our Trial pattern

12 micron Al

8 micron Kapton

Single layer

80 micron space

80 micron width

2004-11-15 ALICE ITS


Bad etching sample

Bad etching sample

Fatal case

Dimple along the line

We expect to avoid these problem by washing with NaOH before photo resist painting.

2004-11-15 ALICE ITS


Sticking next layer

8 micron m Polyimide (Ink)

8 micron m Polyimide (Ink)

12 micron m Al

12 micron m Al

Sticking next layer

No glue!

Press with heat

Not Etched

Etched

2004-11-15 ALICE ITS


Through hole laser drilling

Through Hole (Laser drilling)

2004-11-15 ALICE ITS


Through hole cross section

Through Hole (Cross section)

0.5mm

2004-11-15 ALICE ITS


Stacking layer

8 micron m Polyimide (Ink)

8 micron m Polyimide (Ink)

12 micron m Al

12 micron m Al

Stacking layer

Project line patterns with alignment (Common technique for Cu board)

Photo resist

Not Etched

Etched

2004-11-15 ALICE ITS


Al kapton bus development at riken

Top

2nd

3rd

3 signal layers + Power/GND layers

2004-11-15 ALICE ITS


Gold plating

Gold Plating

  • We already made a Al -Ni-Au plated sample.

  • It worked for Al wire boding.

2004-11-15 ALICE ITS


Issue

Issue

We do not have an idea how to make these steps

50 mm Al

50 mm Al

2004-11-15 ALICE ITS


Possible solution

Possible Solution

Additional through hole and bonding pad

50 mm Al

50 mm Al

2004-11-15 ALICE ITS


Al kapton bus development at riken

Plan

  • We almost establish essential techniques which we need.

  • I am requesting a board including all essential techniques( etching, through hole, stacking with alignment, gold-plating)

  • It will come end of Dec. 2004.

  • After we confirm them, we start to design PHENIX board in Jan. 2004 and fabricate until Mar. 2005.(fastest guess)

2004-11-15 ALICE ITS


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