1 / 29

How Engineering Supports Manufacturing

How Engineering Supports Manufacturing. Larry E. Hand. Peavey Electronics March 28, 2000. Introduction. Senior Design Larry E. Hand, MEE PE MCSE Master Electrical Engineering, Auburn University 1977 Harris Corporation, Melbourne Fl. 1977-83 Peavey Electronics, 1983-Present.

Download Presentation

How Engineering Supports Manufacturing

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript


  1. How Engineering Supports Manufacturing Larry E. Hand Peavey Electronics March 28, 2000

  2. Introduction • Senior Design • Larry E. Hand, MEE PE MCSE • Master Electrical Engineering, Auburn University 1977 • Harris Corporation, Melbourne Fl. 1977-83 • Peavey Electronics, 1983-Present

  3. Proof of Concept..

  4. After Proof of Concept, What Next? • Vacation • Big Bonus • Two Attaboys • Another Project • Physical Design and Transition to Manufacturing

  5. Life After Prototyping • Physical Design and PC Layout • Parts Procurement • Costing • Agency Approvals • Documentation, Literature and Manuals

  6. More things to consider • Mechanical Design and Packaging • Manufacturing Deliverables • Murphy’s Law- ECN’s and rework • It’s Always yours..

  7. Printed Circuit Board Design • Component Placement • Input/Output locations • Mounting Considerations • Technology Selection • Restricted areas • Minimize crossing count • Thermal Management

  8. Printed Circuit Board Design • Electrical Considerations • High Impedance Nodes • Differential signal pairing • Shielding for Magnetic and Capacitive Coupling • Transmission Line Effects- OverShoot and Ringing • EMI/EMC • Ground is NOT Ground......

  9. Printed Circuit Board Design • Manufacturing Considerations • Component Spacing • Orientations • Hole Sizes • Insertion Tooling Restrictions • Tooling Holes • Panelization

  10. Parts Approval and Procurement • Standard Parts • Multiple Sourced • Cost Effective • Minimal Specifications required • Improved response to demand changes • Note: Not all parts are created equal.... • Single Sourced • Unique or Patented Technical Advantage • An Act of Nature could shut you down! • Know Who You’re Dealing With

  11. Parts Approval and Procurement • Custom Parts • Product Differentiation • Protect Trade Secrets and Intellectual Property • Extensive Specifications/Documentation • If you change your mind, They’re still yours • Requires Accurate Forecasting

  12. Parts Approval and Procurement • Approved Vendor List (AVL) • Lead Times • Minimum Quantities • Packaging/Delivery Options • Bulk • Tape and Reel • Tape and Ammo • Trays or Tubes

  13. How is Cost Determined • Material Cost • Labor Cost • Manufacturing Burden • SG&A

  14. How Much does it Cost • Material Cost---52% of Total Cost • Unit Price * Quantity for all BOM items • Labor Cost --- 8% of Total Cost • Direct labor or value added labor required to manufacture the product

  15. How Much Does it Cost • Manufacturing Burden --- 17% of Cost • Indirect Labor • Utilities • Facilities • Employee Benefits • Depreciation, rent, etc..

  16. How Much Does it Cost • Sales/General and Administrative -- 23% • Cost of Selling the Product • Sales commission • Advertising • Service and Warranty • Corporate Management • Research and Development • IS, Bad Debt, etc..

  17. UL CSA FCC NOM CE NEMKO DEMKO VDE IRAM SASO SANZ SAA JIS and more..... Agency Approvals

  18. Documentation • User Manual • Technical Specifications • Service Manual • Assembly Directions • Marketing Support • Advertising Copy

  19. Packaging • Protect Unit During Shipment • Attractive at Point of Sale • Advertising • OEM or Consumer packaging

  20. Top Side SMT DIP IC’s and Sockets Axial leaded components Bottom side SMT Radial leaded components Hand Assembly Wave Solder Touchup and Inspect Precheck PCB Manufacturing Flow

  21. Manufacturing Deliverables • Programs for Automated Assembly Equipment • Axial Sequencer and Insertion • Radial Insertion • DIP Socket and IC insertion • Surface Mount Chips, IC’s, Odd Shaped Components • GenRad Automated Test

  22. Manufacturing Deliverables • PCB Assembly Drawings • Gerber Files • Mechanical Fabrication Drawings • Functional Test Procedure • Technical Specifications • Trouble Shooting procedures • Your Experience and Knowledge

  23. Oops.... • Tolerances • Incomplete Beta Testing • Parts Availability • Poor Manufacturing Yield • Poor Reliability • Marketing Redirection/Feature Addition

  24. Engineering Change Orders • ECO’s document a change that manufacturing will implement • Disposition of existing inventory • Disposition of Work In Process • Reason for Change • Cost/Performance/Schedule Impacts

  25. Engineering Change Orders • Safety - Liability • Recall, Disposition of units already sold • Obsolete inventory

  26. Sustaining Engineering • If you birth it, It’s always your baby • Customer complaints • Obsolete Parts • Unique Parts • Warranty claims and Field Failures • Specification changes in standard components

More Related