1 / 12

Actividades 3D

Actividades 3D. G. Pellegrini, C. Fleta, D. Quirion, JP Balbuena, D. Bassignana. Radiation-hard 3D detectors for the (s)LHC. Inner pixel layer (IBL) replacement for ATLAS (2014) Fluence of 4.4 x 10 15 1MeV neq/cm 2 Super-LHC (2017) – Atlas and CMS 10 * luminosity upgrade on present LHC

flarson
Download Presentation

Actividades 3D

An Image/Link below is provided (as is) to download presentation Download Policy: Content on the Website is provided to you AS IS for your information and personal use and may not be sold / licensed / shared on other websites without getting consent from its author. Content is provided to you AS IS for your information and personal use only. Download presentation by click this link. While downloading, if for some reason you are not able to download a presentation, the publisher may have deleted the file from their server. During download, if you can't get a presentation, the file might be deleted by the publisher.

E N D

Presentation Transcript

  1. Actividades 3D G. Pellegrini, C. Fleta, D. Quirion, JP Balbuena, D. Bassignana

  2. Radiation-hard 3D detectors for the (s)LHC • Inner pixel layer (IBL) replacement for ATLAS (2014) • Fluence of 4.4 x 1015 1MeV neq/cm2 • Super-LHC (2017) – Atlas and CMS • 10 * luminosity upgrade on present LHC • Fluence up to ~ 1 x 1016 1MeV neq/cm2 • LHCb VELO upgrade • Integrated fluence ~ 1 x 1016 1MeV neq/cm2 • TOTEM experiment • Integrated fluence ~ 1 x 1016 1MeV neq/cm2 • Design fluences for ATLAS sensors (includes 2x safety factor) : • Innermost Pixel Layer ~ 5cm radius :1.6 x 1016 1MeV neq/cm2 = 500 Mrad • Outer Pixel Layers ~ 30cm radius: 3 x 1015 1MeV neq/cm2 = 150 Mrad

  3. 3D Detectors First proposed by Parker et al. Nucl. Instr. Meth. A, 395 (1997) 328 • Array of electrode columns passing through substrate • Electrode spacing << wafer thickness (e.g. 10m:300m) • Benefits: • Low full depletion voltage • Fast collection times → Reduced charge trapping • Reduced charge sharing due to E-field shape → Higher signal in one pixel • More complicated fabrication - micromachining Planar 300 300 µ µ m m Double sided 3D

  4. CNM Double-sided 3D fabrication runs • Hole aspect ratio 25:1 • 10µm diameter, 250µm deep • p-type and n-type substrates 285µm thick. • Only one guard ring 10um wide Devices designed at Glasgow & CNM Fabricated at CNM CNM 3D-wafer ATLAS Medipix2 Pads Strips 4 inch wafer ICP is a reliable and repeatable process (many test runs always successful). Yield: Strip detectors = 88%. ATLAS pixels = 50%

  5. Short strip detectors n+ readout columns Irradiated at Karlsruhe with 26 MeV protons. Irradiations of strip 3D 1 x 1016 1 MeV neq cm-2 ALIBAVA Charge multiplication? 1 x 1016 1 MeV neq cm-2 Word done with Glasgow Uni and Universität Freiburg. Measurements also from testbeam available.

  6. Atlas pixels Atlas pixels, FE-I3 and new FE-I4 fabrication and irradiation for Insertable B-Layer and testbeam. In the framework of the Atlas 3D collaboration (http://test-3dsensor.web.cern.ch/test-3dsensor/). Common layout in the Atlas 3D collaboration (CNM,FBK,SINTEF, Stanford). New FE-I4 design (2x2 cm2). A module should be fabricated with 3D detectors. CNM already fabricated 24 6” wafers to test the bump bonding at IZM and 8 4” wafers to test the bump bonding at SELEX. Dummies include one structure to test pixel detectors with ALIBAVA read out electronics. Work done with IFAE and Glasgow Uni.

  7. CMS pixels We are designing a new mask with single chips and one module 8x2. We are also implementing a new bias grid for 3D detectors without punch trough Work done with PSI, access to GICSERV.

  8. TOTEM strips • We are designing a new mask to fabricate TOTEM strip detectors with 3D detectors. • Strip pitch 66um • AC coupled. • 3cm long • n+ readout Work done with CERN, access to GICSERV.

  9. 7 ADCshared 7 ADC 30 ADC LHCb pixels • Secondary 120 GeV pion beam from SPS • 4 Timepix, 2 Medipix planes in telescope • DUT: double sided 3D N-type sensor from CNM/Glasgow • Expected track extrapolation error: < 3 μm 6 medipix2 3d irradiated with neutrons and waiting for bump bonding Pion beam Individual pion tracks Measurements at 0º. No true with tilting Preliminary results with scan to 10º. telescope DUT

  10. Inefficiencies Centre Corners* Planar 0% 7% 3D N –Type 3% 7% 3D P –Type 4% 7% Synchrotron Applications New medipix3 detectors already fabricated and bonded at CNM • B16 Test beamline at the Diamond • Monochromatic X-ray beam of 14.5keV • Beam size FWHM were measured as • 4.5±0.3 µm in x • 6.7±0.3 µm in y THL~25% THL~50% Reduced level of over counting and under counting in 3D THL~75% Work done with Diamond light source and Glasgow Uni.

  11. Stripixels 3D strip detectors with 2D positioning on one side. Double metal process. Mask already designed, detectors are being fabricated at CNM. Work done with Brookhaven National Laboratory .

  12. Resume of the projects • Strip 3D was financed by SCTESP3 and Rd50. • Atlas pixels is part of the NEWATLASPIX CYCYT project • LHCb project is a GICSERV access from Universidad de Santiago • CMS project is a GICSERV access from PSI • TOTEM project is a GICSERV access from CERN • Synchrotron project is a GICSERV access from Diamond light source. • Stripixels project is a GICSERV access from University of Laaperanta (and BNL).

More Related