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HCC – present status. Original estimate of device size was 3.5mm x 3.5mm (area ~ 12.25mm 2 ) All costing based on this size Any changes in area can impact upon price... Lots of progress now made BUT device is coming in with 117 bond pads (see below)

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Hcc present status
HCC – present status

  • Original estimate of device size was 3.5mm x 3.5mm (area ~ 12.25mm2)

    • All costing based on this size

    • Any changes in area can impact upon price...

  • Lots of progress now made BUT device is coming in with 117 bond pads (see below)

    • Pad ring requires 2 sides being duplicated because of hybrid constraints, 41 bonds/side (82 total)

      • Effectively one side of device is not accessible when attached to a hybrid

      • Having 2 differing flavoured hybrids makes the duplication necessary

    • Big driver of chip size and cost-

  • Numerous iterations of pad ring have been made

    • Converging to a fixed pad ring description

    • Making use of ABC130 differential drivers/receivers

      • Saves reinventing the wheel but requires additional area – apparent towards the corners (450µm keep clear)

As of today – needs to be checked

Guessed size

Bump Bonding

16.2mm2

13.5mm2

7.3mm2

12.25mm2

Time


Hcc present status1
HCC – present status

  • As of today

  • Moved bond pads around whilst trying to maintain minimal duplication

    • Biggest change is powering now brought in towards the bottom of the device and not the sides

    • Rest remains more or less the same

  • Still lots of unknowns

    • Use of different value capacitors makes it difficult in real estate usage on hybrid

      • Better to converge to a singe value of capacitance (using arrays)

      • Array footprint is much smaller – original reason for power pads placed on side decoupled with a single array

    • Otherwise have to make use of 0402s and 2 x capacitor array

Hybrid Data

Chip area ~ 13.5mm2 (10% oversize compared to original)

Stave TTC

ABC130 TTC

ABC130 TTC

Auxiliary Connections

Auxiliary Connections

Power Block

ABC130 Data

ABC130 Data

ABC130 Data

ABC130 Data


Hcc present status2
HCC – present status

Does it fit on a hybrid? Appears to with no change to hybrid geometry

ABC130 TTC Bus yet to be routed

PLL and Bandgap Decoupling

Power Supply decoupling (100nF and 1µF)


Hcc present status3
HCC – present status

  • Alternative, more aggressive proposal, courtesy of Nandor/(Mitch) at Penn

    • Makes use of dual row bonding throughout

    • Device size comes in at 3mm x 3mm – though will probably increase.


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