Leyla Conrad Associate Director, Education Packaging Research Center

1. The First Entrepreneurial and Practice-Oriented Masters Program in Microelectronics Systems Packaging Leyla Conrad Associate Director, Education Packaging Research Center Georgia Institute of Technology

2. Evolution and Expectations in Packaging Industry 1999 2006 Electronics $993B > $2.0T Microelectronics & Packaging $250B $500B Electronics Packaging $109B* > $200B • To Support the Industry Growth: • • Next-Generation System Technologies • • Skilled Human Resources • Globally-Competitive, System-Level Engineers with Complete Product Dev. Education *Input from Tech Search International

3. U.S. Industry Needs • 58,000 scientists, engineers, and technicians are currently employed in U.S. in electronic packaging • PRC projects this number will reach 89,000 by 2008 • Total U.S. annual demand for new human resources =3,800 in 2002; current total degree recipients at all levels from all U.S. universities < 300 per year. • Estimated distribution in educational backgrounds:

4. Annual Human Resource Needs in U.S. Level Need/YearProd./Yr.Provided By PRC Production/10 years • 20 Universities • Graduate Education, • 228 in 10 years (PRC) Ph.D. 600 50 M.S. 2000 70 B.S. 800 50 Professional Engineers • Certificate in Microelectronic • 20 Universities Packaging 267 in 10 years • 3 Universities • Undergraduate Education • 465 in 10 years • Industry Education • IEEE-CPMT • IMAPS • 5-10 Universities • Companies

5. What is PRC? Georgia Tech 12 Collaborating Universities Global PRC • 50 Companies • 280 Students • 35 Professors, 7 • NSF-ERC • Georgia State • (GRA) • Global Departments Electronics • $20M Annual Industry Budget • 15 Research Eng. • Next-generation of Microelectronic Systems Packaging Technologies Based on SOP • New Breed of Globally-Competitive Engineers • Partnership and Technology Transfer to Global Industry

6. Integrated Vision forEducation Research • Prototype Research • Curriculum Development • Books • Short Courses • Workshops • Student Monthly Seminars • Systems Research • Labs for Hands-on DBO Courses • Prototype Research Projects • Operation of Manufacturing Equipment • EDUCATION: • Product Dev. Cycle • System-level • Global • IMAPS, IEEE Programs • Web-based Courses • International Internships • Academic Conference Global Relations Infrastructure • Internships/Co-Ops • Manufacturing Education • Distinguished Seminars • Mentoring by Industry Professionals • Industry Engineers on Campus • Entrepreneurial Education Industry

7. Desired Educational OutcomesResults of IAB Needs Assessment: • Rigorous, broad exposure to fundamentals • Deep level knowledge of issues relevant to electronics packaging • Interdisciplinary and cross-functional skills • Economics and management education • Hands-on work experience • Interpersonal skills • Exposure to foreign cultures • Diversity

8. Practice Oriented Masters Program • Objective:Implement a microelectronic packaging certificate program in engineering. • Goals: - Deep level knowledge of packaging, - Interdisciplinary and cross-functional skills, - Hands-on work experience, - Economics and management education, - Industry experience, - Exposure to foreign cultures.

9. STRATEGY 3 primary components 1) Engineering Component - 4 courses,12 hrs 2) Management Component - 2 courses, 6 hrs 3) Internship Component - 3 to 6 months Certificate Program Major: ECE, ME or MSE Minor: Management

10. Practice Oriented Masters Program

11. Engineering Component

12. Microelectronics Packaging Courses

13. Design-Build-Operate (DBO) Courses • Objective: Augment PRC curriculum with hands-on instructional laboratories. • Goal: Ensure that all PRC students have the opportunity to receive training in the hands-on aspects of electronics packaging. • Strategy: 2 hands-on laboratory courses • Substrate Fabrication (design, fabricate, test) • Module Assembly (assemble, test, thermal management) Complete Product Development Cycle

14. DBO1 Facilities Course Topics • Introduction to Packaging • Laboratory Safety • Interconnect Design • Dielectric/Polymer Deposition • Formation of interconnect vias • Copper Metallization • Substrate Testing Next Generation Substrate Facility

15. Process Flow Substrate Fabrication 1.ORIGINAL SUBSTRATE 2. COAT AND PRE-BAKE 3. PHOTO-EXPOSE, DEVELOP, CURE 4. SUB-ETCH COPPER LAYER 5. STRIP PHOTORESIST 6. APPLY PHOTO-POLYMER 7. EXPOSE, DEVELOP, FINAL CURE 8. METALLIZATION PROCESS WITH ELECTROLESS PLATING

16. Infrastructure Spin Coater Design Meniscus Coater Wet stations UV Exposure

17. DBO2 Facilities Course Topics • Introduction to next generation packaging • Thermo-mechanical modeling and reliability • Assembly processes and materials • Functional testing • Thermal management • Reliability testing Next Generation Module Facility

18. Assembly Process Flow

19. Management Component MGT6753 - Management for Engineers • Leadership for Creativity and Innovation (Instructor: Christina Shalley • Financial Reporting and Analysis of Tech Firms (Instructor: C.Mulford) • Managerial Accounting (Instructor: Deborah Turner) • Negotiation (Instructor: Christina Shalley) • Teams (Instructor: Dennis Nagao) • Operations I (Instructor: Cheryl Gaimon) • Operations II (Instructor: Cheryl Gaimon) • Focus on Capacity and Process Planning (Instructor: Cheryl Gaimon) • The Value of Quality (Instructor: Vinod Singhal) • Supply Chain Management (Instructor: Soumen Ghosh) • Finance (Instructor: Narayan Jayaraman) • Entrepreneurial Finance--Valuation, Financing (Instructor: Narayan Jayaraman) • New Product Development (NPD) Process (Instructor: Kenneth Kahn) • From Development to Commercialization Mkting (Instructor: Kenneth Kahn) • E-Commerce (Instructor: Fred Riggins) • Strategy (Instructor: Lloyd Byars)

20. Management Component Management Elective Courses • MGT 6051 Database Development and Applications • MGT 6052 System Analysis and Design • MGT 6055 Decision Support and Expert Systems • MGT 6056 Electronic Commerce and Marketing • MGT 6060 Financial Management • MGT 6198 Corporate Entrepreneurship for Global Competitiveness • MGT 6306 Business to Business Marketing • MGT 6350 Operations Management • MGT 6351 Operations Planning and Control • MGT 6360 Global Operations and Logistics • MGT 6772 Managing Resources of the Technological Firm • MGT 6773 Strategic Management of Technology Based Ventures • MGT 6789 Technology Transfer • MGT 6814 Law, Management, and Economics

21. Internship Component Lambda Technologies System Companies Automotive Computer Aerospace Communications Medical Packaging Companies Tool Companies CIRCUIT TECHNOLOGIES Material Companies Semiconductor Companies

22. Corporate Fellowships • Goal: to produce substantial number of microelectronics systems packaging engineers - fellowship grant of $25,000 (US) Company Benefits • Summer intern • Access to PRC graduates • Attend one annual IAB meeting

23. POM Students • Himanshu Agarwal (MSE) • Ankur Agrawal (ChE) • Charles Butterfield (ECE) • Anil K. Chinthakindi (ChE) • Pranav Patel (ECE) • Melinda Woods (ECE)

24. POM Organizational Structure

25. 8 7 UG Research 6 5 4 3 2 1 Microelectronic Systems Packaging Technology Curriculum at GT 16 15 System Integration Research 14 Ph.D. 13 Professional Communications course System-level course Packaging Certificate Entrepreneurial and Practice Oriented MS 12 11 System Integration Research Fundamental/Thrust courses (14 ) 10 DBO2 DBO1 MS Management Courses Hands-on Courses 9 System-level course SEMESTERS Focused Program of Study System-level course DBO2 DBO1 Hands-on Courses Fundamental/Thrust Courses (8) UG Research FUNDAMENTAL ENGINEERING COURSES ECE Electromagnetics BS ME Heat Transfer MSE Materials ChE Electrochem. Fundamental Science/Math Courses

26. Future Challenges Enhancing electronic packaging education • Planning human resource needs • Enhanced M.S. degrees • Technology-enhanced educational delivery • Focus on manufacturing, business, management • SOP technology • Environmentally benign processing • Assessment of education programs Forming partnerships • Universities, industry, and professional societies must form partnerships to promote electronics packaging education