ITRS MEMS Est. 2011

1. ITRS MEMSEst. 2011 ITRS Public Meeting San Francisco, CA July 13, 2011 Presentation by Michael Gaitan, NIST

2. Destiny manifests itself before you -Enzo

4. ITRS MEMS TWG Focus: Mobile Internet Devices Device Technologies Accelerometers Gyroscopes Microphones RF MEMS Emerging MEMS Technology Requirements Device Performance Design and Simulation (Steve Breit, Coventor) Packaging and Integration (Raji Baskaran, Intel) Device Testing (John Rychcik, Solidus)

5. MEMS Technology Working Group Arthur Morris Asif Chowdhury Bill Bottoms Brian Gerson Brian Jamieson Buzz Hardy Chengkuo Lee Chris Apanius Chris van Hoof Chuck Richardson Dave Howard Dimitrios Peroulis Dominique Schinabeck Don DeVoe Edward Chiu Fabio Pasolini Fabrice Verjus Fumihiko Nakazawa Gilles Poupon Goro Nakatani Hebert Bennett Henne van Heeren Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI) Wispry Analog Devices 3MTS, Packaging TWG PMC-Sierra, RF/AMS TWG SB Microsystems MEMSCAP National U of Singapore Promeus IMEC iNEMI Jazz Semiconductor Perdue Acutronic University of MD Asian Pacific Microsystems ST KFM Technology Fujitsu, JEITA LETI Rohm, JEITA NIST, RF/AMS TWG enablingMNT Hiroshi Yamada Ingrid De Wolf Jack Pekarik Jae Sung Yoon Jim Spall Jim Mrvos Jianmin Miao John Rychcik Josh Molho JuergenWolf Karen Lightman Kevin Chau Koji Fukumoto Marcie Weinstein Mark Crockett Michel Brillouet Monica Takacs Patric Salomon RaffaellaBorzi Raj Gupta RajiBaskaran Toshiba IMEC IBM, RF/AMS TWG KIMM Delphi Lexmark NTU Solidus Caliper Fraunhofer Institute MEMS Industry Group MEMStaff Sony, JEITA Akustica SEMI, MEMSmart LETI MEMS Industry Group 4m2c IMEC Volant Technologies Intel Rakesh Kumar Robert De Nuccio Ron Lawes Sacha Revel Scott Bryant Shawn Blanton Snezana Jenei Stephane Donnay Steve Breit Steve Greathouse Steve Tilden Steve Walsh Takashi Mihara Tetsu Tanaka Tony Stamper Veljko Milanovic Wei-Leun Fang Wendy Chen Xiaoming Wu Yasutaka Nakashiba Global Foundries ST Imperial College Accutronic MANCEF Carnegie Mellon University Infineon IMEC Coventor Plexus LTXCredence MANCEF Micromachine Center Tohoku Univ., JEITA IBM Mirrorcle Technologies NTHU KYEC Lexmark Renesas Electronics, JEITA

6. MEMS Technology Working Group Arthur Morris Asif Chowdhury Bill Bottoms Brian Gerson Brian Jamieson Buzz Hardy Chengkuo Lee Chris Apanius Chris van Hoof Chuck Richardson Dave Howard Dimitrios Peroulis Dominique Schinabeck Don DeVoe Edward Chiu Fabio Pasolini Fabrice Verjus Fumihiko Nakazawa Gilles Poupon Goro Nakatani Hebert Bennett Henne van Heeren Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI) Wispry Analog Devices 3MTS, Packaging TWG PMC-Sierra, RF/AMS TWG SB Microsystems MEMSCAP National U of Singapore Promeus IMEC iNEMI Jazz Semiconductor Perdue Acutronic University of MD Asian Pacific Microsystems ST KFM Technology Fujitsu, JEITA LETI Rohm, JEITA NIST, RF/AMS TWG enablingMNT Hiroshi Yamada Ingrid De Wolf Jack Pekarik Jae Sung Yoon Jim Spall Jim Mrvos Jianmin Miao John Rychcik Josh Molho JuergenWolf Karen Lightman Kevin Chau Koji Fukumoto Marcie Weinstein Mark Crockett Michel Brillouet Monica Takacs Patric Salomon RaffaellaBorzi Raj Gupta RajiBaskaran Toshiba IMEC IBM, RF/AMS TWG KIMM Delphi Lexmark NTU Solidus Caliper Fraunhofer Institute MEMS Industry Group MEMStaff Sony, JEITA Akustica SEMI, MEMSmart LETI MEMS Industry Group 4m2c IMEC Volant Technologies Intel Rakesh Kumar Robert De Nuccio Ron Lawes Sacha Revel Scott Bryant Shawn Blanton Snezana Jenei Stephane Donnay Steve Breit Steve Greathouse Steve Tilden Steve Walsh Takashi Mihara Tetsu Tanaka Tony Stamper Veljko Milanovic Wei-Leun Fang Wendy Chen Xiaoming Wu Yasutaka Nakashiba Global Foundries ST Imperial College Accutronic MANCEF Carnegie Mellon University Infineon IMEC Coventor Plexus LTXCredence MANCEF Micromachine Center Tohoku Univ., JEITA IBM Mirrorcle Technologies NTHU KYEC Lexmark Renesas Electronics, JEITA • Subgroup Leaders • Inertial Sensors – Philippe Robert, LETI • Microphones – Marcie Weinstein, Akustica • RF MEMS – Robert Tsai, TSMC • Emerging MEMS – Chris van Hoof, IMEC • Design and Simulation – Steve Breit, Coventor • Packaging and Integration- RajiBaskaran, Intel • Testing – John Rychcik, Solidus

7. MEMS Technology Working Group Arthur Morris Asif Chowdhury Bill Bottoms Brian Gerson Brian Jamieson Buzz Hardy Chengkuo Lee Chris Apanius Chris van Hoof Chuck Richardson Dave Howard Dimitrios Peroulis Dominique Schinabeck Don DeVoe Edward Chiu Fabio Pasolini Fabrice Verjus Fumihiko Nakazawa Gilles Poupon Goro Nakatani Hebert Bennett Henne van Heeren MEMS Industry Group Chair: Mike Gaitan (NIST), Chair Co-Chairs: Robert Tsai (TSMC) and Philippe Robert (LETI) Wispry Analog Devices 3MTS, Packaging TWG PMC-Sierra, RF/AMS TWG SB Microsystems MEMSCAP National U of Singapore Promeus IMEC iNEMI Jazz Semiconductor Perdue Acutronic University of MD Asian Pacific Microsystems ST KFM Technology Fujitsu, JEITA LETI Rohm, JEITA NIST, RF/AMS TWG enablingMNT Hiroshi Yamada Ingrid De Wolf Jack Pekarik Jae Sung Yoon Jim Spall Jim Mrvos Jianmin Miao John Rychcik Josh Molho JuergenWolf Karen Lightman Kevin Chau Koji Fukumoto Marcie Weinstein Mark Crockett Michel Brillouet Monica Takacs Patric Salomon RaffaellaBorzi Raj Gupta RajiBaskaran Toshiba IMEC IBM, RF/AMS TWG KIMM Delphi Lexmark NTU Solidus Caliper Fraunhofer Institute MEMS Industry Group MEMStaff Sony, JEITA Akustica SEMI, MEMSmart LETI MEMS Industry Group 4m2c IMEC Volant Technologies Intel Rakesh Kumar Robert De Nuccio Ron Lawes Sacha Revel Scott Bryant Shawn Blanton Snezana Jenei Stephane Donnay Steve Breit Steve Greathouse Steve Tilden Steve Walsh Takashi Mihara Tetsu Tanaka Tony Stamper Veljko Milanovic Wei-Leun Fang Wendy Chen Xiaoming Wu Yasutaka Nakashiba Global Foundries ST Imperial College Accutronic MANCEF Carnegie Mellon University Infineon IMEC Coventor Plexus LTXCredence MANCEF Micromachine Center Tohoku Univ., JEITA IBM Mirrorcle Technologies NTHU KYEC Lexmark Renesas Electronics, JEITA MEMS TWG Subgroups: Devices, Design and Simulation, Packaging and Integration, and Testing

8. Integration Path for Inertial Sensors Package Level Chip Level

9. State of the Art - 10 DOF Board Level STMicroelectronics Analog Devices June 16, 2011 Analog Devices ADIS16407 iSensor MEMS-based inertial measurement unit combines a tri-axis accelerometer, a tri-axis gyroscope, a tri-axis magnetometer, and a pressure sensor in a single unit. May 18, 2011 STMicroelectronics’ Three MEMS Sensors Provide 10 DoF. The three ST MEMS sensors include a geo-magnetic module, a gyroscope, and a pressure sensor.

10. Microphones • Microphones require distribution around the system for functionality (e.g., noise cancellation) • Microphones are expected to increase in performance, decrease in size while continuing to lower cost. • Integration for microphones moves in the direction of advancing ASIC functionality and I/O

11. RF MEMS • RF MEMS are intended to lower power dissipation by the radio. • RF MEMS are sill in the process of increasing their reliability and lowering cost before they will be adopted in mobile devices. • RF MEMS are expected to increase in performance and reliability. • The biggest challenge in RF MEMS is enhancing reliability and lifetime (e.g., # of operations) • Some of the future performance metrics have no known solutions, e.g., signal isolation requirements.

12. Grand Challenges

13. Conclusion R&D Investment MEMS Manufacturing Cost Packaging and Testing Device Fabrication Packaging and Testing Device and Process Development • The back-end (packaging and test) typically consumes 2/3 of the manufacturing cost for MEMS devices. • Most R&D investment has been in the front end (device and process development). • Our roadmapping effort is articulating the issues at the back-end which may be useful in focusing R&D efforts.