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TD18 – post mortem analysis

TD18 – post mortem analysis. Inspection 11WDSDVG1KEK SLAC. 1093766. TD18 - analysis. RF check made at CERN (confirmation of previous results from SLAC, EDMS : 1090704 ) Straightness measurement Cutting: see next slides Visual inspection (EDMS: 1093766) SEM (localization of breakdowns)

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TD18 – post mortem analysis

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  1. TD18 – post mortem analysis Inspection 11WDSDVG1KEK SLAC 1093766

  2. TD18 - analysis • RF check made at CERN (confirmation of previous results from SLAC, EDMS: 1090704 ) • Straightness measurement • Cutting: see next slides • Visual inspection (EDMS:1093766) • SEM (localization of breakdowns) • Dimensional control (EDMS: 1099135)

  3. For the straightness measurement we have cut 2 couplers

  4. The engraved lign is not to be lost in the orientation of the discs after the cuts

  5. Preparation for the measurement of straightness for the cells after bonding and of the couplers after brazing Alignment of cells 0 and 20 is 0 in the vertical and horizontal axis Mesures 1 Mesures 2 G. Riddone, 20100816

  6. Resultsafter 4 passes with a micron comparator mesures1

  7. Results after 4 passes with a micron comparator at 90 degrees of the first measurement

  8. Superposition of the values of two measurements Mesures1: 23 microns for the disc bonding from 0 to 20 30 microns with the coupler brazing Mesures 2 : 21 microns for the disc bonding from 0 to 20 28 microns with the coupler brazing

  9. Cutting sections for analyses

  10. STEP 1 5 cuts: Iris shall be not damaged 16,17,18,19 and 20 Cut 5 Cut 1 the irises should not be damaged Part C Part B Part E Part D Part A Les disques seront gravés A,B,C,D et E

  11. STEP 2.1 Coupe disque 10 Cut 6 G. Riddone, 20100816

  12. STEP 2.2 Longitudinal section of the discs 11 to 15 Part F Cut 7 Part G

  13. Dimensional control disk N 18 (EDMS: 1099135) Diameterof the iris is 5.4024 mm before BONDING

  14. Dimensional control (EDMS: 1099135) Diameter of the iris is5.4024 mm before BONDING Diameterafter BONDING is 5.403 mm differenceis 0.6 microns

  15. SEM (localization of breakdowns) by Markus

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