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Theoretical Tile Assembly Models Tianqi Song

Theoretical Tile Assembly Models Tianqi Song. Outline. Wang tiling Abstract tile assembly model Reversible tile assembly model Kinetic tile assembly model Multiple temperature model q-tile assembly model Flexible glue model Time-dependent glue model Step-wise assembly model

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Theoretical Tile Assembly Models Tianqi Song

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  1. Theoretical Tile Assembly ModelsTianqi Song

  2. Outline • Wang tiling • Abstract tile assembly model • Reversible tile assembly model • Kinetic tile assembly model • Multiple temperature model • q-tile assembly model • Flexible glue model • Time-dependent glue model • Step-wise assembly model • Staged assembly model

  3. Wang Tiling • Proposed by Hao Wang in 1961. • Given a finite set of square tiles with a glue on each side. • Question: whether they can tile the plane with sameabutting glue. • Note that tiles cannot be rotated or reflected and you can use infinite number of copies of each tile.

  4. Example of Wang Tiling Designed by Karel Culik II in 1996. Picture is from Wikipedia. This tile set contain 13 tiles. They can tile the plane aperiodically as shown in next page.

  5. Example of Wang Tiling This picture is from Wikipedia.

  6. Abstract Tile Assembly Model • Proposed by Erik Winfree and Paul W.K. Rothemund in 2000. • A tiling system under aTAM is a quadruple <T, s, τ, g>. • T is a set of tiles. A tile is a square with a glue on each side. N W E S

  7. Abstract Tile Assembly Model • s is seed tile. The initial configuration has only seed tile. • τ is temperature: the minimum accumulative strength that can fix a tile in a configuration. • g is glue strength function: G×G->N+, where G is glue set. For any x, y in G, g(x,y)=g(y, x). • A configuration is a function: Z×Z->TU{empty}, where Z is integer set.

  8. Tile Complexity • Tile complexity or program-size complexity: the minimum number of tile types required to assemble a shape.[Erik Winfree and Paul W.K. Rothemund STOC 2000] • A special case: in the linear version proposed by Chandran et al, the tile set is MULTISET.

  9. Time Complexity • Time complexity or running time: model the assembly process by continuous Markov process.[Adleman et al STOC 2001] Example of continuous Markov process. Picture is from Wikipedia

  10. Time Complexity • States: possible configurations. • Rate between state S1 and S2: if S2 is got by attaching a tile x to S1. The rate is the concentration of tile x. Otherwise, no edge between S1 and S2. • The time from initial configuration to the terminal configuration is a random variable. Time complexity is the expected value of the random variable

  11. Reversible Tile Assembly Model • Proposed by Leonard M. Adleman in 1999 to study linear assembly. • Define two functions: (1) σ: G×G->[0,1] (2) v: G×G->[0,1] where G is the glue set. • σ(g1,g2) is the probability of sticking between glue g1 and g2. • v(g1,g2) is the probability of unsticking between glue g1 and g2.

  12. Kinetic Tile Assembly Model • Proposed by Erik Winfree in 1988. • Four assumptions: (1) All monomers hold the same constant concentration. (2)There are not interactions among aggregates.

  13. Kinetic Tile Assembly Model • Four assumptions(continue): (3) All monomers have the same forward rate constant. (4) The reverse rate depends exponentially on the number of pairs need to be broken.

  14. Kinetic Tile Assembly Model Picture is from paper written by Erik Winfree in 1998

  15. Kinetic Tile Assembly Model • rf=kf [monomer]=kfe-Gmc • rr,b=kr,b=kfe-bGse • kf is the forward rate constant. • [monomer] is the concentration of some kind of monomer. • Gmc is a measure of entropic cost of fixing a monomer at a particular position. It is decided by the concentration of monomer.

  16. Kinetic Tile Assembly Model • Gse is a measure of free energy cost to break a double helix of length s, where Gse= (4000K/T-11)s. • b is the number of s-length double helix that need to be broken.

  17. Multiple Temperature Model • Proposed by Aggarwal et al. in 2004. • Replace temperature t in the standard model by a sequence of temperatures {τi}i=1. • A system that has k temperatures is a k-temperature system. • Assembly mechanism: the assembly process of a k-temperature system has k phases as shown in the Figure(next page). k

  18. Multiple Temperature Model Assemble and disassemble under temperature τ1 for long enough time. Phase 1 Assemble and disassemble under temperature τkfor long enough time. Phase k The terminal product of phase k is the terminal product of this k-temperature system.

  19. Flexible Glue Model • Proposed by by Aggarwal et al. in 2004. • In standard model: g(x, y)= 0 if x≠y. • In flexible glue model: g(x, y) may not be 0 when x≠y.

  20. q-Tile Model • Proposed by by Aggarwal et al. in 2004. • In standard model: only single tile can attach to the growing supertile containing seed. • In q-tile model: supertiles of size not larger than q can form and attach to the seed supertile if the accumulative glue strength between two supertiles is not less than temperature. • Standard model is exactly 1-tile model.

  21. Time-dependent Glue Model • Proposed by Sahu et al. in 2005. • The glue strength function g is defined differently from standard model: g: G×G×R -> R. g(x, y, t) is the glue strength between glue x and glue y when they have been juxtaposed for t time.

  22. Time-dependent Glue Model Picture is from the paper by Sahu et al. in 2005

  23. Time-dependent Glue Model • As shown in the figure, define r: G×G-> R as time for maximum glue strength. g(x, y, t) is growing when t< r(x, y). When t≥ r(x, y), g(x, y, t)= g(x, y, r(x, y)). • Define u: G×G-> R as minimum interaction time between two glues.

  24. Time-dependent Glue Model • An example from Sahu’s paper:

  25. Step-wise Assembly Model • Proposed by Reif in 1999. • A tiling system under step-wise assembly model is a quadruple Sstep= <{Ti}i=1, s, g, {τi}i=1 >, where k is the number of steps, Ti is the tile set at step i, is τi is the temperature at step i. • The assembly process is shown in the Figure(next page). k k

  26. Step-wise Assembly Model Put in T1 including s. Assemble under temperature τ1 for long enough time. step 1 (in tube 1) terminal product of step 1 terminal product of step k-1 Put in Tkin. Assemble under temperature τkfor long enough time. step k (in tube k) The terminal product of step k is the terminal product of this k-step system.

  27. Staged Assembly Model • Proposed by Demaine et al. in 2007. • It is a generalized version of step-wise assembly model. • The assembly process under staged assembly model is shown in the Figure(next page).

  28. Staged Assembly Model This picture is from paper by Demaine et al. Vertices of mix graph represent bins for separated assembly reactions. Each bin has its only tile set and temperature. Only terminal product of one bin is delivered to bins in next stage.

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