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Simulated Evolution Algorithm for Multiobjective VLSI Netlist Bi-Partitioning

MS Thesis Presentation. Simulated Evolution Algorithm for Multiobjective VLSI Netlist Bi-Partitioning. By Dr Sadiq M. Sait Dr Aiman El-Maleh Raslan Al Abaji King Fahd University Computer Engineering Department. Outline …. Introduction Problem Formulation Cost Functions

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Simulated Evolution Algorithm for Multiobjective VLSI Netlist Bi-Partitioning

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  1. MS Thesis Presentation Simulated Evolution Algorithm for Multiobjective VLSI Netlist Bi-Partitioning • By • Dr Sadiq M. Sait • Dr Aiman El-Maleh • Raslan Al Abaji • King Fahd University • Computer Engineering Department

  2. Outline …. • Introduction • Problem Formulation • Cost Functions • Proposed Approaches • Experimental results • Conclusion

  3. 7.5M333MHz0.25um VLSI Technology Trend Design Characteristics 3.3M200MHz0.6um 1.2M50MHz0.8um 0.13M12MHz1.5um 0.06M2MHz6um Cycle-basedsimulation,FormalVerification Top-DownDesign,Emulation HDLs, Synthesis CAESystems, Siliconcompilation Key CAD Capabilities SPICE Simulation The Challenges to sustain such an exponential growth to achieve gigascale integration have shifted in a large degree, from the process of manufacturing technologies to the design technology.

  4. The VLSI Chip in 2006 Technology 0.1 um Transistors 200 M Logic gates 40 M Size 520 mm2 Clock 2 - 3.5 GHz Chip I/O’s 4,000 Wiring levels 7 - 8 Voltage 0.9 - 1.2 Power 160 Watts Supply current ~160 Amps Performance Power consumption Noise immunity Area Cost Time-to-market Tradeoffs!!!

  5. VLSI Design Cycle • VLSI design process is carried out at a number of levels. • System Specification • Functional Design • Logic Design • Circuit Design • Physical Design • Design Verification • Fabrication • Packaging Testing and Debugging

  6. Physical Design The physical design cycle consists of: • Partitioning • Floorplanning and Placement • Routing • Compaction Physical Design converts a circuit description into a geometric description. This description is used to manufacture a chip.

  7. Why we need Partitioning ? • Decomposition of a complex system into smaller subsystems. • Each subsystem can be designed independently speeding up the design process (divide-and conquer-approach). • Decompose a complex IC into a number of functional blocks, each of them designed by one or a team of engineers. • Decomposition scheme has to minimize the interconnections between subsystems.

  8. Levels of Partitioning System System Level Partitioning PCBs Board Level Partitioning Chips Chip Level Partitioning Subcircuits / Blocks

  9. Classification of Partitioning Algorithms Partitioning Algorithms Simulation Based Iterative Performance Driven Others Group Migration • Kernighan-Lin • Fiduccia-Mattheyeses (FM) • Multilevel K-way Partitioning • Simulated annealing • Simulated evolution • Tabu Search • Genetic • Spectral • Multilevel Spectral • Lawler et al. • Vaishnav • choi et al. • jun’ichiro et al.

  10. Related previous Works

  11. Need for Power optimization • Portable devices. • Power consumption is a hindrance in further integration. • Increasing clock frequency. • Need for delay optimization • In current sub micron design wire delay tend to dominate gate delay. Larger die size imply long on-chip global routes, which affect performance. • Optimizing delay due to off-chip capacitance. Motivation

  12. Objective • Design a class of iterative algorithms for VLSI multi objective partitioning. • Explore partitioning from a wider angle and consider circuit delay , power dissipation and interconnect in the same time, under balance constraint.

  13. Problem formulation • Objectives : • Power cost is optimized AND • Delay cost is optimized AND • Cutset cost is optimized • Constraint • Balanced partitions to a certain tolerance degree. (10%)

  14. Problem formulation • the circuit is modeled as a hypergraph H(V,E) • Where V ={v1,v2,v3,… vn}is a set of modules (cells). • And E = {e1, e2, e3,… ek} is a set of hyperedges. Being the set of signal nets, each net is a subset of V containing the modules that the net connects. • A two-way partitioning of a set of nodes V is todetermine two subsets VA and VB such that VA U VB = V and VAVB = 

  15. cutset = 3 Cutset • Based on hypergraph model H = (V, E) • Cost 1: c(e) = 1 if e spans more than 1 block • Cutset = sum of hyperedge costs • Efficient gain computation and update

  16. Delay Model path : SE1 C1C4C5SE2. Delay = CDSE1 + CDC1+ CDC4+ CDC5+ CDSE2 CDC1 = BDC1 + LFC1 * ( Coffchip + CINPC2+ CINPC3+ CINPC4)

  17. Delay Delay(Pi) = Delay(Pi) = Pi: is any path Between 2 cells or nodes P : set of all paths of the circuit.

  18. Power The average dynamic power consumed by CMOS logic gate in a synchronous circuit is given by: Ni : is the number of output gate transition per cycle( switching Probability) : Is the Load Capacitance

  19. Power :Load Capacitances driven by a cell before Partitioning : additional Load due to off chip capacitance.( cut net) Total Power dissipation of a Circuit:

  20. Power : Can be assumed identical for all nets :Set of Visible gates Driving a load outside the partition.

  21. Balance The Balance as constraint is expressed as follows: However balance as a constraint is not appealing because it may prohibits lots of good moves. Objective : |Cells(block1) – Cells( block2)|

  22. Unifying Objectives, How ? • Weighted Sum Approach • Problems in choosing Weights. • Need to tune for every circuit.

  23. Fuzzy logic for cost function • Imprecise values of the objectives • best represented by linguistic terms that are basis of fuzzy algebra • Conflicting objectives • Operators for aggregating function

  24. Use of fuzzy logic for Multi-objective cost function • The cost to membership mapping. • Linguistic fuzzy rule for combining the membership values in an aggregating function. • Translation of the linguistic rule in form of appropriate fuzzy operators.

  25. Some fuzzy operators • And-like operators • Min operator  = min (1, 2) • And-like OWA •  =  * min (1, 2) + ½ (1- ) (1+ 2) • Or-like operators • Max operator  = max (1, 2) • Or-like OWA •  =  * max (1, 2) + ½ (1- ) (1+ 2) • Where  is a constant in range [0,1]

  26. Membership functions Where Oiand Ciare lower bound and actual cost of objective “i” i(x) is the membership of solution x in set “good ‘i’ ” giis the relative acceptance limitfor each objective.

  27. Fuzzy linguistic rule • A good partitioning can be described by the following fuzzy rule • IFsolution has • small cutsetAND • low powerAND • short delay AND • good Balance. • THENit is a good solution

  28. Fuzzy cost function The above rule is translated to AND-like OWA Represent the total Fuzzy fitness of the solution, our aim is to Maximize this fitness. Respectively (Cutset, Power, Delay , Balance ) Fitness.

  29. Simulated Evolution • Algorithm Simulated evolution • Begin •  Start with an initial feasible Partition S • Repeat • Evaluation :Evaluate the Gi (goodness) of all modules • Selection : • For each Vi (cell) DO • begin • if Random Rm > Gi then select the cell • End For • Allocation:For each selected Vi (cell) DO • begin • Move the cell to destination Block. • End For • Until Stopping criteria is satisfied. • Return best solution. • End

  30. Simulated evolution Implementation. • Cut goodness • Power goodness • Delay goodness • The overall is a Fuzzy goodness.

  31. Cut goodness di: set of all nets, Connected and not cut. wi : set of all nets, Connected and cut.

  32. Power Goodness Vi is the set of all nets connected and Ui is the set of all nets connected and cut.

  33. Delay Goodness Ki: is the set of cells in all paths passing by cell i. Li: is the set of cells in all paths passing by cell i and are not in same block as i.

  34. Final selection Fuzzy rule. IF Cell I is near its optimal Cut-set goodness as compared to other cells AND AND THEN it has a high goodness. near its optimal power goodness compared to other cells near its optimal net delay goodness as compared to other cells OR T(max)(i) is much smaller than Tmax

  35. Fuzzy Goodness Tmax :delay of most critical path in current iteration. T(max)(i) :delay of longest path traversing cell i. Xpath= Tmax / T(max)(i) Fuzzy Goodness: Respectively (Cutset, Power, Delay ) goodness.

  36. Selectionimplementation • Biasless selection scheme • The goodness distribution among the cells is Guassian, with mean Gm and Standard deviation G . • A random Guassian Rm number is generated with R . • Eliminate having cells with zero selection probability.

  37. Selectionimplementation • Rm = Gm - G • R =G selection rule : if Rm > Goodness (I) then select the cell.

  38. Experimental Results ISCAS 85-89 Benchmark Circuits

  39. SimE Vs Ts Vs GA against time Circuit S13207

  40. Experimental Results SimE Vs Ts Vs GA SimE results were better than TS and GA, with faster execution time.

  41. Thank you. Questions?

  42. Evolutionary Heuristics for Multiobjective VLSI Netlist Bi-Partitioning • by • Dr. Sadiq M. Sait • Dr. Aiman El-Maleh • Mr. Raslan Al Abaji • Computer Engineering Department

  43. Outline …. • Introduction • Problem Formulation • Cost Functions • Proposed Approaches • Experimental results • Conclusion

  44. 7.5M333MHz0.25um VLSI Technology Trend Design Characteristics 3.3M200MHz0.6um 1.2M50MHz0.8um 0.13M12MHz1.5um 0.06M2MHz6um Cycle-basedsimulation,FormalVerification Top-DownDesign,Emulation HDLs, Synthesis CAESystems, Siliconcompilation Key CAD Capabilities SPICE Simulation The Challenges to sustain such an exponential growth to achieve gigascale integration have shifted in a large degree, from the process of manufacturing technologies to the design technology.

  45. The VLSI Chip in 2006 Technology 0.1 um Transistors 200 M Logic gates 40 M Size 520 mm2 Clock 2 - 3.5 GHz Chip I/O’s 4,000 Wiring levels 7 - 8 Voltage 0.9 - 1.2 Power 160 Watts Supply current ~160 Amps Performance Power consumption Noise immunity Area Cost Time-to-market Tradeoffs!!!

  46. VLSI Design Cycle • VLSI design process is carried out at a number of levels. • System Specification • Functional Design • Logic Design • Circuit Design • Physical Design • Design Verification • Fabrication • Packaging Testing and Debugging

  47. Physical Design The physical design cycle consists of: • Partitioning • Floorplanning and Placement • Routing • Compaction Physical Design converts a circuit description into a geometric description. This description is used to manufacture a chip.

  48. Why we need Partitioning ? • Decomposition of a complex system into smaller subsystems. • Each subsystem can be designed independently speeding up the design process (divide-and conquer-approach). • Decompose a complex IC into a number of functional blocks, each of them designed by one or a team of engineers. • Decomposition scheme has to minimize the interconnections between subsystems.

  49. Levels of Partitioning System System Level Partitioning PCBs Board Level Partitioning Chips Chip Level Partitioning Subcircuits / Blocks

  50. Need for Power optimization • Portable devices. • Power consumption is a hindrance in further integration. • Increasing clock frequency. • Need for delay optimization • In current sub micron design wire delay tend to dominate gate delay. Larger die size imply long on-chip global routes, which affect performance. • Optimizing delay due to off-chip capacitance. Motivation

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