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Introduction

On-Chip Interconnect Analysis and Evaluation of Delay, Power, and Bandwidth Metrics under Different Design Goals. Introduction. Interconnect strategy, or interconnect planning has become a critical part of chip design: the growing significance of wire delay relative to gate delay .

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Introduction

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  1. On-Chip Interconnect Analysis and Evaluation of Delay, Power, and Bandwidth Metrics under Different Design Goals

  2. Introduction • Interconnect strategy, or interconnect planning has become a critical part of chip design: • the growing significance of wire delay relative to gate delay . • increasing power consumption of wires: could be up to 50% of the total dynamic power. • Influences the ASIC design methodology

  3. Our work • Try to revamp the on-chip local interconnect configuration for multi-objective optimization: • Compare different objective functions. • Formulate various matrics to measure the wire performance. • Identify the optimal wire configurations.

  4. Evaluation Approach and Models • objective functions: • is the wire-length normalized delay. • is the wire-length-normalized power.

  5. Evaluation Approach and Models • Metrics • is amount of data that can be transferred per unit area per unit time.

  6. Evaluation Approach and Models • Models • Elmore delay model: • Power model: • Leakage factor:

  7. Minimum Delay • Optimum repeater interval and size: • Optimum delay and power

  8. Experimental results: wire configuration Optimal widths Optimal inverter sizes

  9. Optimal inverter distances in the min-d procedure Optimal inverter distances in the min-ddp procedure Optimal inverter distances in the min-dp procedure

  10. Experimental results: metric evaluation

  11. Experimental results: metric evaluation

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