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Interconnect and Packaging Lecture 3: Skin Effect. Chung-Kuan Cheng UC San Diego. Outlines. Transmission Line Model Spectrum of Configurations Skin Effect Coaxial Cable. I. Transmission Line Model. Voltage drops through serial resistance and inductance

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Interconnect and packaging lecture 3 skin effect

Interconnect and PackagingLecture 3: Skin Effect

Chung-Kuan Cheng

UC San Diego


Outlines
Outlines

  • Transmission Line Model

  • Spectrum of Configurations

  • Skin Effect

  • Coaxial Cable


I transmission line model
I. Transmission Line Model

  • Voltage drops through serial resistance and inductance

  • Current reduces through shunt capacitance

  • Resistance increases due to skin effect

  • Shunt conductance is caused by loss tangent


I interconnect model
I. Interconnect Model

  • Telegrapher’s equation:

  • Propagation Constant:

  • Wave Propagation:

  • Characteristic Impedance


I interconnect model1
I. Interconnect Model

  • Propagation Constant:

  • Wave Propagation:

  • Characteristic Impedance


I interconnect model constants
I. Interconnect Model (Constants)

  • AWG (American Wire Gauge

    • Wire Diameter = 2.54x10-(AWG+10)/20

  • Copper p= 2.2uohm-cm

  • Copper thickness 1oz(/sqft)= 36um

  • Electric Permittivity of Air 8.85x10-12F/m

  • Magnetic Permeability of Air

  • Characteristic Impedance of Air



Iii skin effect
III. Skin Effect

Assuming that resistance and capacitance

are negligible.

Skin Depth

(Equivalent Depth of Uniform Current)








Hw1 remarks on z900
HW1: Remarks on z900

  • Chip (Processor)

    • 10x17 sqmm, 38W, 918MHz, 250MIPS

    • 128bits to each L2 cache chip

    • 280um pitch chip to MCM

  • MCM

    • 127x127sqmm, 5xTerabits/s, 459MHz

    • 20 Processors, 8x4MB Memory

    • 11Knets, 95mm max length on critical path

    • 1ns on MCM, 1.4ns off MCM

    • 33um think film pitch, 396um ceramic substrate

    • 101Kpins, 35.3pin/sqcm

    • 4224pins/1735pg to PCB


Hw1 remarks
HW1: Remarks

  • Board

    • 553x447sqmm, 1 MCM, 64GB memory, 24 STI

    • 7 mils pitch (3.3width/4sep)

    • 24GB/s IO, 1GB/s bus, 240lines/MBA (6GB/s),

    • 10pairs/STI, 9 signals/1 clock

    • 3516nets, 19,788pins (signals + pg), 8pins/sqcm


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