Interconnect and packaging lecture 3 skin effect
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Interconnect and Packaging Lecture 3: Skin Effect. Chung-Kuan Cheng UC San Diego. Outlines. Transmission Line Model Spectrum of Configurations Skin Effect Coaxial Cable. I. Transmission Line Model. Voltage drops through serial resistance and inductance

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Interconnect and Packaging Lecture 3: Skin Effect

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Interconnect and packaging lecture 3 skin effect

Interconnect and PackagingLecture 3: Skin Effect

Chung-Kuan Cheng

UC San Diego


Outlines

Outlines

  • Transmission Line Model

  • Spectrum of Configurations

  • Skin Effect

  • Coaxial Cable


I transmission line model

I. Transmission Line Model

  • Voltage drops through serial resistance and inductance

  • Current reduces through shunt capacitance

  • Resistance increases due to skin effect

  • Shunt conductance is caused by loss tangent


I interconnect model

I. Interconnect Model

  • Telegrapher’s equation:

  • Propagation Constant:

  • Wave Propagation:

  • Characteristic Impedance


I interconnect model1

I. Interconnect Model

  • Propagation Constant:

  • Wave Propagation:

  • Characteristic Impedance


I interconnect model constants

I. Interconnect Model (Constants)

  • AWG (American Wire Gauge

    • Wire Diameter = 2.54x10-(AWG+10)/20

  • Copper p= 2.2uohm-cm

  • Copper thickness 1oz(/sqft)= 36um

  • Electric Permittivity of Air 8.85x10-12F/m

  • Magnetic Permeability of Air

  • Characteristic Impedance of Air


Interconnect and packaging lecture 3 skin effect

II. Spectrum of Configurations


Iii skin effect

III. Skin Effect

Assuming that resistance and capacitance

are negligible.

Skin Depth

(Equivalent Depth of Uniform Current)


Iv coaxial cable

IV. Coaxial Cable


Iv coaxial cable inductance

IV. Coaxial Cable: Inductance


Iv coaxial cable inductance1

IV. Coaxial Cable: Inductance


Iv coaxial cable inductance2

IV. Coaxial Cable: Inductance


Iv coaxial cable impedance

IV. Coaxial Cable: Impedance


Iv coaxial cable impedance1

IV. Coaxial Cable: Impedance


Hw1 remarks on z900

HW1: Remarks on z900

  • Chip (Processor)

    • 10x17 sqmm, 38W, 918MHz, 250MIPS

    • 128bits to each L2 cache chip

    • 280um pitch chip to MCM

  • MCM

    • 127x127sqmm, 5xTerabits/s, 459MHz

    • 20 Processors, 8x4MB Memory

    • 11Knets, 95mm max length on critical path

    • 1ns on MCM, 1.4ns off MCM

    • 33um think film pitch, 396um ceramic substrate

    • 101Kpins, 35.3pin/sqcm

    • 4224pins/1735pg to PCB


Hw1 remarks

HW1: Remarks

  • Board

    • 553x447sqmm, 1 MCM, 64GB memory, 24 STI

    • 7 mils pitch (3.3width/4sep)

    • 24GB/s IO, 1GB/s bus, 240lines/MBA (6GB/s),

    • 10pairs/STI, 9 signals/1 clock

    • 3516nets, 19,788pins (signals + pg), 8pins/sqcm


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