Interconnect and Packaging Lecture 3: Skin Effect

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# Interconnect and Packaging Lecture 3: Skin Effect - PowerPoint PPT Presentation

Interconnect and Packaging Lecture 3: Skin Effect. Chung-Kuan Cheng UC San Diego. Outlines. Transmission Line Model Spectrum of Configurations Skin Effect Coaxial Cable. I. Transmission Line Model. Voltage drops through serial resistance and inductance

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### Interconnect and PackagingLecture 3: Skin Effect

Chung-Kuan Cheng

UC San Diego

Outlines
• Transmission Line Model
• Spectrum of Configurations
• Skin Effect
• Coaxial Cable
I. Transmission Line Model
• Voltage drops through serial resistance and inductance
• Current reduces through shunt capacitance
• Resistance increases due to skin effect
• Shunt conductance is caused by loss tangent
I. Interconnect Model
• Telegrapher’s equation:
• Propagation Constant:
• Wave Propagation:
• Characteristic Impedance
I. Interconnect Model
• Propagation Constant:
• Wave Propagation:
• Characteristic Impedance
I. Interconnect Model (Constants)
• AWG (American Wire Gauge
• Wire Diameter = 2.54x10-(AWG+10)/20
• Copper p= 2.2uohm-cm
• Copper thickness 1oz(/sqft)= 36um
• Electric Permittivity of Air 8.85x10-12F/m
• Magnetic Permeability of Air
• Characteristic Impedance of Air
III. Skin Effect

Assuming that resistance and capacitance

are negligible.

Skin Depth

(Equivalent Depth of Uniform Current)

HW1: Remarks on z900
• Chip (Processor)
• 10x17 sqmm, 38W, 918MHz, 250MIPS
• 128bits to each L2 cache chip
• 280um pitch chip to MCM
• MCM
• 127x127sqmm, 5xTerabits/s, 459MHz
• 20 Processors, 8x4MB Memory
• 11Knets, 95mm max length on critical path
• 1ns on MCM, 1.4ns off MCM
• 33um think film pitch, 396um ceramic substrate
• 101Kpins, 35.3pin/sqcm
• 4224pins/1735pg to PCB
HW1: Remarks
• Board
• 553x447sqmm, 1 MCM, 64GB memory, 24 STI
• 7 mils pitch (3.3width/4sep)
• 24GB/s IO, 1GB/s bus, 240lines/MBA (6GB/s),
• 10pairs/STI, 9 signals/1 clock
• 3516nets, 19,788pins (signals + pg), 8pins/sqcm