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Code 300 Overview Code 300: Workmanship

Code 300 Overview Code 300: Workmanship. Name: Jeannette Plante Title: Project Lead Office: Bldg 15, Rm 213 Tel: 4-5944 Email: jeannette.f.plante@nasa.gov. Soldering P olymeric applications Cable harnesses Fiber Optic cables. Example of Defects - Soldering. Excessive Solder.

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Code 300 Overview Code 300: Workmanship

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  1. Code 300 OverviewCode 300: Workmanship Name: Jeannette Plante Title: Project Lead Office: Bldg 15, Rm 213 Tel: 4-5944 Email: jeannette.f.plante@nasa.gov

  2. Soldering Polymeric applications Cable harnesses Fiber Optic cables

  3. Example of Defects - Soldering Excessive Solder Bridging Solder Insufficient Solder

  4. Example of Defects - Soldering Flux Residue Incomplete solder flow Burned Flux and flux residue Gold Embrittlement

  5. Fractured solder joint Excess staking Excess solder bridging terminals

  6. Example of Defects – Cables and Harnesses Typical Harness Installation Unacceptable Harness Installation Bent Connector Pins Flux residue/corrosion byproduct

  7. Cab le insulation stressed by compression of less than minimum bend radius Cable insulation stressed by sharp edge Single indenter crimp does not provide gas-tight crimp and leads to cracks in contact crimp barrel.

  8. Electrostatic Discharge Damage

  9. Organization Charter Provide engineering and assurance expertise for printed wiring assembly and cable harness assemblyprocesses that are used in the manufacturing of electronic hardware for space flight application. • Provide support to OSMANASA HQ • Maintain five NASA-STD-8739 requirements documents. • Maintain NASA-adopted VCS’s • Help resolve Agency-level waiver requests • Help resolve Agency-level audit findings • Keep Western and Eastern Training Centers aligned with policy • GSFC Project Support • Help resolve non-compliances in flight hardware • Resolve assurance rules for new and non-standard assembly methods • Manage GSFC ESD Control Program • Capture and share GSFC Packaging Rules and Best Practices

  10. Who are the Workmanship Group? Jeannette Plante – Manager, Policy lead, SME support Bob Humphrey – Group Lead, SME support, Level A Instructor Jose Sancho – SME support, ESD Bench Certifier, ESD Technical Lead Vacant – SME support, GSFC Packaging Processes Standards/Best Practice Vic DiMarco - ESD Bench Certifier Julio Diaz-Perez – ESD Bench Certifier at WFF SME = Workmanship Subject Matter Expert Support to Projects Who are the Training Center? Felix Frades – Level A Instructor Riley Northam – Level A Instructor Craig Firman – Level A Instructor Elaine Hill - Registrar

  11. When to Call the Workmanship Group • How do I specify Workmanship requirements in my MAR? • My supplier wants to use a non-standard configuration, what rules apply? • The project engineer has designed and built a non-compliant configuration. Is it ok to use as-is? • What electrical tests are required for workmanship acceptance of a wire harness? • I’m not sure that this vendor has a controlled soldering process, can someone take a look at it? • The project needs to start work on an ESD-sensitive item, how do we get the bench certified? Projects need to Budget 0.1 – 0.2 FTEs for Workmanship per year. More if new technologies are expected (CGA, Water Soluble Flux, Pb-free Solder, etc.)

  12. NASA Documents Managed by the Workmanship Group NPD 8730.5, NASA Quality Assurance Program Policy, 10/27/05 NASA-STD-8739.1, Workmanship Standard for Polymeric Applications on Electronic Assemblies, Rev A, Change 2, 3/29/2011 NASA-STD-8739.2, Surface Mount Technology, Rev- Change 2, 3/29/2011 NASA-STD-8739.3, Soldered Electrical Connections, Rev- Change 4, 3/29/2011 NASA-STD-8739.4, Crimping, Interconnecting Cables, Harnesses, and Wiring, Rev- Change 6, 3/29/2011 NASA-STD-8739.5, Fiber Optics Terminations, Cable Assemblies, and Installation, Rev- Change 2, 3/29/2011

  13. VCS Documents Managed by the Workmanship Group ANSI/ESD S20.20, For the Development of an Electrostatic Discharge Control Program for – Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices), 2/11/2007 • J-STD-001ES Space Applications Electronic Hardware Addendum to J-STD-001E Requirements for Soldered Electrical and Electronic Assemblies • IPC/WHMA-A-620AS,Space Applications Electronic Hardware Addendum to IPC/WHMA-A-620A Requirements and Acceptance For Cable and Wire Harness Assemblies NASA-Adopted To be NASA-Adopted Being developed for NASA-Adopted

  14. GSFC Documents Managed by the Workmanship Group GPR 8730.6, GSFC Policy for Electrostatic Discharge, 6/7/10 • GSFC-WM-001B, Workmanship Manual for Electrostatic Discharge Control (Excluding Electrically Initiated Explosive Devices), 7/10/2008 • GSFC-STD-6000 GSFC Electronic Assembly Manufacturing Requirements and Best Practices, 1st Rough Draft, 3/9/11 • GSFC-STD-6001 Ceramic Column Grid Array Design and Manufacturing Rules for Flight Hardware, Rev-, 2/22/11 • 300-WI-8730.6.1 Assessment Plan for Ceramic Column Grid Array (CCGA) Attachment Process, 1st Draft, 7/22/10 • 300-WI-8730.x.x ESD Bench Certification Process, in process

  15. Can the supplier use their own procedures instead of the Workmanship Standards? Procedure: Step-by-step instructions for implementing a manufacturing process. Procedures will include steps that ensure that quality requirements are met. Requirement Document: Collection of requirement with applicable scope and intended requirements owners. May include accept/reject/defect criteria. Workmanship Standards are Requirements Documents Supplier Procedures are not substitutes for NASA’s requirements documents. Exceptions taken to NASA’s requirements must be declared in advance by the supplier and not discovered later by CSO in a procedure. Workmanship would like to review/approve requirements exceptions, not procedures. Justification would include assurance requirements to be used.

  16. Special Process or Non-Standard Configuration Any configuration outside of the scope of the Workmanship Standards needs: Declared in advance Reliability data for relevant environment (i.e. life test) Custom quality criteria – Workmanship standards inspection rules may not be suitable. Approved in advance Examples: Lead-free solder, organic acid flux, ball grid array, >5 wires in a crimp splice, dead-bug mounting, leads without stress relief Caution: Some suppliers call their own internal process engineering testing “Qualification”. NASA calls life-testing “Qualification”. Supplier’s claims that a non-standard process or configuration is “qualified” may not meet the intent of the Workmanship requirement. Caution: Some suppliers consider their “special” processes to be “standard”. Our definition is relative to the scope of the Workmanship Standard. Outside the scope = non-standard.

  17. “GSFC already approved this process” Workmanship has created a method for reviewing non-standard supplier processes or configurations. Many of these are “standard” to the supplier and show up across projects. Our method helps reduce repetitive reviews and makes our response more consistent. Supplier Non-standard Processes Currently on File: BAE Systems: 2 (one more in process) Ball Aerospace: 19 Boeing: 1 Emcore: 1 GSFC: one in process L3: one in process SEAKR: 2 Moog: 1 Workmanship recommends or does not recommend approval to the CSO. Categories are: Recommend without conditions Recommend with conditions Not recommended for use Requires MRB approval Inconclusive Withdrawn Recommendation is Project-specific Project makes final determination

  18. Design and Processing Requirements The Use of Jumper Wires (“White Wires”) Pre-CDR Requires Code 300 Chief Engineer Review/Approval Workmanship looks at safe routing of wire, staking, solder joint quality – not number used or performance impact.

  19. “They should have known we do it this way and never that way!” Workmanship has partnered with Code 500 to create a Electronic Packaging Requirements and Best Practices Standard. The 1st rough draft is out for comment. Each page contains a single topic with the following subheadings: Requirements - shall statements Manufacturing Practices - for the operators/technicians/process engineers Cautions – head’s up for everyone Quality Assurance – for the CSO/QE Notes – doesn’t fit in other sections References – source or history of the information Examples of topics are: PCB Material Selection and Non-Standard Design Features, Thermal Bonding, Solder Paste Preparation, Material Selection for Polymeric Applications (Bonding, Staking, Conformal Coating), Design notes required on manufacturing/engineering drawings.

  20. Example of a Page from GSFC-STD-6000

  21. Information Resources GSFC Workmanship Website (only accessible inside of GSFC) http://sma.gsfc.nasa.gov/workmanship Hot Links: GSFC-WM-001, Assurance Policy for Water Soluble Flux, NASA Workmanship Standards site link, ANSI/ESD S20.20 documents link ESD Bench Certification Process: Who to call, documents, overview .ppt Workmanship Resources: documents and links arranged in order of project life cycle. Includes recommended requirements, qualification methods, packaging best practices, evaluation data, audit checklists, link to the training center https://secureworkgroups.grc.nasa.gov/workmanship: insider information about what’s going on in the world of NASA and industry standards development for Workmanship. Find drafts for review, comments submitted, policy plans, etc. Apply to join. http://nepp.nasa.gov/workmanship: official statements about NASA Workmanship Standards Program policy, links to the Standards, application notes, links to the training centers. Public website.

  22. QUESTIONS?

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