Welcome to ee 130 230m integrated circuit devices
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Welcome to EE 130/230M Integrated Circuit Devices. Instructors: Prof. Tsu -Jae King Liu and Dr. Nuo Xu ( tking and nuoxu @eecs.berkeley.edu) TA: Khalid Ashraf ([email protected]) Web page: http://www-inst.eecs.berkeley.edu/~ee130/

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Welcome to EE 130/230M Integrated Circuit Devices

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Welcome to ee 130 230m integrated circuit devices

Welcome to EE 130/230MIntegrated Circuit Devices

Instructors: Prof. Tsu-Jae King Liu and Dr. NuoXu

(tking and nuoxu @eecs.berkeley.edu)

TA:Khalid Ashraf ([email protected])

Web page: http://www-inst.eecs.berkeley.edu/~ee130/

bSpace site: EE 130/230M Spring 2013

Objectives:

Fundamental understanding of the working principles of semiconductor devices used in modern ICs.

An ability to design a transistor to meet performance requirements within realistic constraints.


Schedule

Lectures (247 Cory):TuTh 11AM-12:30PM

Discussion Section (beginning Wednesday 1/23):

Section 101 (289 Cory):We 2-3PM

Office Hours:

Prof. Liu (225 Cory):Mo 4-5PM

Nuo Xu (225 Cory): Tu 3-4PM

Khalid Ashraf (382 Cory):We 4-5PM

Schedule

EE130/230M Spring 2013

Course Overview, Slide 2


Relation to other courses

Prerequisite:

EECS40: Basic properties of semiconductors;

basic understanding of transistor operation 

Familiarity with the Bohr atomic model

Relation to other courses: 

EE130 is a prerequisite for EE231 (Solid State Devices)

EE130 is also helpful (but not required) for IC analysis and design courses such as EE140 and EE141, as well as for the microfabrication technology course EE143

Relation to Other Courses

EE130/230M Spring 2013

Course Overview, Slide 3


Reading material

Reading Material

  • Textbook:

    Semiconductor Device Fundamentals by R. F. Pierret

    (Addison Wesley, 1996)

  • Reference:

    • Modern Semiconductor Devices for Integrated Circuits by C. Hu (Prentice Hall, 2009)

EE130/230M Spring 2013

Course Overview, Slide 4


Grading

Homework (posted online)

due Th (beginning of class)

late homeworks not accepted!

Design project

assigned on 4/11, due on May 9

You may work in pairs

6 Quizzes

25 minutes each

closed book (1pg of notes allowed)

no make-up quizzes

Final exam

Th 5/16 from 8AM to 11AM

closed book

(6 pages of notes allowed)

Grading

Letter grades will be assigned based approximately on the following scales:

10%

20%

EE130

A+: 98-100

A: 88-98

A-: 85-88

B+: 83-85

B: 73-83

B-: 70-73

C+: 68-70

C: 58-68

C-: 55-58

D: 45-55

F: <45

EE230M

A+: 99-100

A: 91-99

A-: 90-91

B+: 89-90

B: 81-89

B-: 80-81

C+: 79-80

C: 71-79

C-: 70-71

D: 60-70

F: <60

30%

40%

EE130/230M Spring 2013

Course Overview, Slide 5


Miscellany

Miscellany

  • Special accommodations:

    • Students may request accommodation of religious creed, disabilities, and other special circumstances. Please meet with Prof. Liu to discuss your request, in advance.

  • Academic (dis)honesty

    • Departmental policy will be strictly followed

    • Collaboration (not cheating!) is encouraged

  • Classroom etiquette:

    • Arrive in class on time!

    • Bring your own copy of the lecture notes.

    • Turn off cell phones, etc.

    • Avoid distracting conversations

EE130/230M Spring 2013

Course Overview, Slide 6


The integrated circuit ic

  • In 1959, Robert Noyce (Fairchild Semiconductor) demonstrated an IC made in silicon using SiO2 as the insulator and Al for the metallic interconnects.

The first planar IC

(actual size: 0.06 in. diameter)

The Integrated Circuit (IC)

  • An IC consists of interconnected electronic components in a single piece (“chip”) of semiconductor material.

  • In 1958, Jack S. Kilby (Texas Instruments) showed that it was possible to fabricate a simple IC in germanium.

EE130/230M Spring 2013

Course Overview, Slide 7


From a few to billions of components

300mm Si wafer

From a Few, to Billions of Components

  • By connecting a large number of components, each performing simple operations, an IC that performs complex tasks can be built.

  • The degree of integration has increased at an exponential pace over the past ~40 years.

  • Moore’s Law: The # of devices on a chip doubles every ~2 yrs, for the same chip price.

Intel Ivy Bridge Processor

1.4B transistors, 160 mm2

EE130/230M Spring 2013

Course Overview, Slide 8


Impact of moore s law

Impact of Moore’s Law

http://www.morganstanley.com/institutional/techresearch/pdfs/2SETUP_12142009_RI.pdf

Transistor

Scaling

Investment

Higher Performance,

Lower Cost

Market

Growth

# DEVICES (MM)

CMOS generation: 1 um • • 180 nm • • 22 nm

YEAR

EE130/230M Spring 2013

Course Overview, Slide 9


The nanometer size scale

MOSFET

The Nanometer Size Scale

Carbon nanotube

1 micrometer (1 mm) = 10-4 cm; 1 nanometer (nm) = 10-7 cm

EE130/230M Spring 2013

Course Overview, Slide 10


Course overview

Course Overview

  • Semiconductor Fundamentals – 3 weeks

  • Metal-Semiconductor Contacts – 1 week

  • P-N Junction Diode – 3 weeks

  • MOS Capacitor – 2 weeks

  • MOSFET – 2 weeks

  • Bipolar Junction Transistor – 2 weeks

  • Modern CMOS Technology – 1 week

Metal-Oxide-Semiconductor (MOS)

Field-Effect Transistor (FET)

EE130/230M Spring 2013

Course Overview, Slide 11


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