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2002 Plans

2002 Plans. 1. Insure TCs are involved with all CPMT supported meetings. Summit at ECTC between Morris “meetings “ group and my TC Chairs. 2. Continue to upgrade TC chairs and web pages 3. Actively upgrade linkage between journals reviewers and TC membership

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2002 Plans

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  1. 2002 Plans 1. Insure TCs are involved with all CPMT supported meetings. Summit at ECTC between Morris “meetings “ group and my TC Chairs. 2. Continue to upgrade TC chairs and web pages 3. Actively upgrade linkage between journals reviewers and TC membership 4. Special edition of CPMT journals or IEEE Spectrum with “state-of-the -art “ submissions by TC Chairs

  2. Conference Leaders and TC’s • Since we are working to establish stronger ties between the CPMT TC’s and CPMT Conferences and Workshops, we are holding a TC Chair dinner jointly with our the Conference and Workshop leaders. Thursday 8-10 PM.

  3. TC Changes • TC 6 (PWBs) is being reinstated under Yoshitaka Fukuoka (thanks Yamanaka-san) Fukuoka-san is President of WEISTI ( Worldwide Electronic Integrated Substrate Technology Inc. ) • Michael Toepper has taken over TC-18 (Wafer Level Packaging) from Luu Nguyen.

  4. 2002 TC Changes • Closed TC 15 and 20 • Len Schaper U. Arkansas TC 2 • Eric Jung Fraunhofer IZM TC 17 • Frank Shi U. Cal Irvine TC 10 • Michael Toepper IZM TC 18 • Yoshitaka Fukuoka Weisti TC-6

  5. TC CHAIR Web page comments TC-1 Contacts Gerry Whitter  TC-2 Passives Len Schaper  TC-3 Assembly Dan Baldwin last update 1998 TC-4 Manufacturing Walt Trybula  TC-5 Materials Rajen Chanchani last update 2001 TC-6 High Density Boards Yoshitaka Fukuoka new TC7 Reliability Kirk Grey  TC-8 Semi Processing John Reekstin needs update TC-9 Thermal Tony Mak missing ? TC-10 Photonics Frank Shi  TC-11 Electrical Test Bruce Kim last update1998 TC-12 Design Swami  TC-13 Power Doug Hopkins last update 2000 TC-14 Systems Packaging, John & Connie  TC-16 RF & Wireless Craig Gaw last update 2001 TC-17 MEMS Erik Jung  TC-18 Wafer Level Michael Toepper last update 1999 TC-19 Education Rao Tummala  TC-21 Green ElectronicsHansjorg Griese 

  6. TC - ECTC Linkage From: Craig Gaw CPMT TC-16 RF & Wireless Technical Committee Members ECTC Components & RF Committee Members You are invited to a joint meeting of the "CPMT TC-16 RF & Wireless Technical Committee" & the "ECTC Components & RF Committee" at ECTC in San Diego …..The objective of the meeting will be to organize & implement a plan to improve the quality & quantity of paper submissions in the RF & wireless area for next year's ECTC. Other possible projects for TC-16 will also be discussed…..

  7. ECTC Plenary Scession 2002 “Laminate Packaging for the Athlon Microprocessor” Raj Master - AMD “The Future of Personal Area Networks” Wiliam Olsen - Motorola “Polymers in Optioelectronics” Chris Erben - Lucent 2001 "Packaging Technology for Pentium 4 Processors" - VK Nagesh, Intel ”Integration of Passives in the 21st Century" John Galvani - AVX "Advanced Packaging Technologies in the Mobile Internet Era" T Ogawa - Matsushita Electric

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